Core Viewpoint - SoftBank and Intel are collaborating to develop a new AI-focused high-bandwidth memory (HBM) that aims to compete with existing products from Samsung and SK Hynix, with a goal to reduce power consumption by 50% compared to current HBM chips [3][5]. Group 1: Project Overview - The new memory will feature a novel wiring structure and is expected to produce a prototype within two years, with commercialization targeted by 2030 [3][4]. - The initiative will be led by a new company named Saimemory, with SoftBank as the largest investor holding 3 billion yen in a 10 billion yen project [6]. Group 2: Market Context - The project faces significant challenges due to the established dominance of Samsung and SK Hynix in the global HBM market, which may further entrench their competitive advantage by the time Saimemory's product is launched [5][6]. - Japan's historical dominance in the DRAM market has diminished, with the last major manufacturer, Elpida, going bankrupt in 2012, leading to increased reliance on Korean suppliers [6]. Group 3: Strategic Implications - The new memory is intended for AI data centers, which have growing demands for energy efficiency and high throughput, aiming to support large-scale AI training more cost-effectively [5]. - Both SoftBank and Intel are currently managing multiple strategic initiatives, including AI chip development and market share recovery in CPUs, which may impact their focus on this project [6].