【导读】房地产板块异动拉升，半导体概念股走强 中国基金报记者 李智 一起来看下最新的市场情况及资讯。 9月24日开盘，A股三大指数集体低开，随后震荡拉升。截至发稿，沪指涨0.24%，深成指跌 0.19%，创业板指跌0.42%。 | 上证指数 | 深证成指 | 北证50 | | | --- | --- | --- | --- | | 3831.11 | 13095.03 | 1562.44 | | | +9.28 +0.24% | -24.79 -0.19% | +14.99 +0.97% | | | 科创50 | 创业板指 | 万得全A | | | 1424.61 | 3101.48 | 6209.85 | | | +17.31 +1.23% | -13.08 -0.42% | +7.25 +0.12% | | | 沪深300 | 中证500 | 中证A500 | | | 4522.99 | 7191.16 | 5452.23 | | | +3.22 +0.07% | +10.45 +0.15% | +6.22 +0.11% | | | 中证1000 | 深证100 | 中证红利 | | | 7412.65 ...

智通财经APP获悉，国泰海通证券发布研究报告称，人工智能快速发展，看好由其驱动的相关测试设备 需求的快速增长，主要包括：①全球AI计算测试设备的市场快速增长，2024年达23亿美元；②HBM产 品的复杂度增加带来新的HBM测试需求；③超节点技术的发展，服务器主板的测试设备需求日益增 长。 服务器测试设备需求快速增长。AI大模型参数规模的快速增长，带来超大计算能力和内存资源需求， 超节点技术孕育而生。我们以英伟达基于NVLink的NVL72方案为例，整个系统由18个Compute Tray和9 个Switch Tray构成，其中1个Compute Tray包含2个GB200超级芯片(Superchip)，每个GB200超级芯片有2 个Blackwell系列的B200 GPU；1个Switch Tray包含2颗NVLINK Switch芯片，整个机柜后部通过线缆将 Compute Tray和Switch Tray进行互联。随着机柜越来越复杂，国泰海通证券认为为了保障机柜的正常使 用，必须对服务器进行一系列的测试包括但不限于ICT、FCT、老化、SIT、性能、兼容性测试等，而相 关测试设备供应商的重要性逐渐凸显，且 ...

格隆汇9月23日丨聚辰股份(688123.SH)在互动平台表示，公司目前没有HBM产品。 ...

Market Overview - A-shares experienced wide fluctuations with the Shanghai Composite Index down 0.18%, Shenzhen Component Index down 0.29%, and the ChiNext Index up 0.21% [1] - The total trading volume in the Shanghai and Shenzhen markets reached 24,944 billion [1] ETF Performance - The Chip Equipment ETF (560780) led the gains with an increase of 7.72%, followed by the Semiconductor Materials ETF (562590) at 6.04% and the EasyOne Semiconductor Equipment ETF (159558) at 5.76% [2] - The financial technology sector saw significant declines, with the 2000 ETF (159907) dropping by 9.46% [4] Semiconductor Industry Insights - Huatai Securities predicts a 14% year-on-year growth in semiconductor capital expenditure for 2025, reaching $148 billion, while the global equipment market is expected to grow by 12% to $142 billion [3] - The Chinese market is anticipated to continue its investment cycle led by advanced processes, presenting opportunities for domestic equipment companies [3] - The demand for high-bandwidth memory (HBM) products is increasing, with SK Hynix completing HBM4 development, which will drive the market for high-end storage testing equipment [3] ETF Trading Activity - The Short-term Bond ETF (511360) had the highest trading volume today at 34.1 billion [5] - The S&P Consumer ETF (159529) recorded the highest turnover rate at 383% [6] Upcoming ETF Listings - Fourteen new Sci-Tech Bond ETFs are set to be listed on September 24, 2025, from various fund companies, including Wan Jia, Tian Hong, and Yin Hua [6][7] - These ETFs are designed to track indices related to AAA-rated technology innovation company bonds, appealing to investors seeking stable returns with lower risk [7]

Group 1 - The global semiconductor equipment market is projected to see a 24% year-on-year revenue growth in Q2 2025, reaching $34 billion, driven by AI-related investments in overseas markets, which are expected to grow by 40% year-on-year [1] - China's semiconductor equipment market is expected to experience a slight decline of 1% in the first half of 2025 due to last year's high base, indicating different cyclical characteristics compared to overseas markets [1] - Semiconductor capital expenditure for 2025 is forecasted to increase by 14% year-on-year, reaching $148 billion, while the global equipment market is expected to grow by 12% year-on-year, reaching $142 billion [1] Group 2 - Changchuan Technology has announced a profit forecast for the first three quarters of 2025, expecting a net profit attributable to shareholders of between 827 million and 877 million yuan, representing a year-on-year growth of 131.39% to 145.38% [1] - The demand in the semiconductor industry continues to grow, with strong customer demand and abundant product orders leading to significant revenue growth for the company [1] Group 3 - With the increasing demand for computing power driven by AI large models, HBM products are evolving from 8-layer to 12-layer stacks, leading to increased testing complexity and a rise in demand for wafer-level and package-level testing equipment [2] - SK Hynix has completed the development of HBM4 and established a mass production system, which is expected to further expand the market for high-end storage testing equipment [2] - The complexity of systems integrating numerous GPUs and switching chips necessitates multiple tests to ensure stability, benefiting testing equipment suppliers involved in AI infrastructure development [2] Group 4 - As of September 23, 2025, the semiconductor equipment ETF has risen by 0.72%, with notable increases in component stocks such as Changchuan Technology and Li'an Micro, which saw gains of 20% and 10% respectively [2] - The semiconductor equipment ETF has reached a new high in scale at 368 million yuan and has seen continuous net inflows, totaling 126 million yuan over the past four days [3] - The ETF closely tracks the CSI Semiconductor Materials and Equipment Theme Index, which includes 40 listed companies involved in semiconductor materials and equipment [3]

Group 1: Electronic Components Sector - The electronic components sector has seen a strong rise, with an increase of over 5%, indicating strong market expectations for this sector [1] - The demand for high-performance, miniaturized, and integrated electronic components is continuously rising due to the upgrade trend in terminal products like 5G smartphones and smart wearable devices [1] - The number and performance requirements of electronic components in 5G smartphones are significantly higher than in 4G smartphones, particularly for core components like RF, filters, and IC substrates, driving growth in the PCB and upstream materials market [1] - The government has introduced multiple policies to support the electronic components industry, including tax incentives and special subsidies, aimed at achieving self-sufficiency and breakthroughs in key technologies [1] - Domestic manufacturers are gaining greater market space and policy benefits due to the dual pressures of international trade friction and supply chain security, making domestic substitution a key industry development theme [1] - Companies like Huadian Co., Shengnan Circuit, and Zhongjing Electronics are positioned well in high-density HDI boards and other niche markets, showing good growth potential [1] Group 2: Computing Power and Optical Networks - In 2024, over 90% of new resources will come from large or super-large projects, with high-power intelligent computing centers accounting for 40%, indicating a shift of core areas towards the "East Data West Computing" model [2] - Dongshan Precision plans to invest nearly 6 billion RMB to fully acquire Solstice Optoelectronics, which specializes in 10G to 800G optical modules, serving data centers and 5G base stations [2] - Hollow-core optical fibers are becoming a key area for next-generation communication infrastructure due to their ultra-low latency and high bandwidth, despite facing standard and cost barriers [2] Group 3: Memory Prices and A-share Storage Industry Impact - Major DRAM manufacturers like Samsung, SK Hynix, and Micron have announced a halt in DDR4 memory chip production, marking the end of the DDR4 product lifecycle [3] - The collective exit of these manufacturers has led to a sharp supply contraction, with DDR4 prices surging by 53% in May, the largest increase since 2017 [3] - This price increase is characterized by supply-side dominance, representing a structural opportunity that catalyzes the storage industry and domestic substitution processes [3] - As global suppliers exit, Chinese manufacturers are poised to rapidly increase their market share in the mid-to-low-end DDR4/LPDDR4 segments [3] - Micron will retain DDR4 shipments only for long-term clients in automotive and industrial sectors, allowing PC and consumer market orders to shift to domestic manufacturers [3] Group 4: AI and Robotics - The surge in token generation has driven computing power demand from G-level to TB-level, creating strong demand for inference-specific chips like NVIDIA Blackwell [4] - The convergence of "information robots" and "embodied AI" is shifting humanoid robot training from the physical world to Omniverse simulation training and Thor deployment [4]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自 techradar 。 新型人工智能存储芯片或可帮助降低大型数据中心的能源消耗。 据报道，软银和英特尔正在联手开发一种新型的以人工智能为重点的高带宽内存，他们希望这种内 存能够与韩国科技巨头三星和 SK 海力士生产的 HBM 产品相媲美。 《日经亚洲》报道称，双方的目标是打造具有新布线结构的堆叠式 DRAM 芯片，与目前的 HBM 芯片相比，可将功耗降低一半。 该计划将由一家名为 Saimemory 的新公司牵头，预计两年内推出原型，并计划在 2030 年之前实 现商业化。 图片来源： Shutterstock/Tupungato 软银和英特尔计划推出低功耗内存，与韩国 HBM 竞争 Saimemory 计划于 2030 年推出，但面临严重的市场延迟 英特尔和软银已涉足人工智能芯片和技术投资 太晚了？ 尽管Saimemory在技术上雄心勃勃，但时间表却构成了严峻挑战。三星和SK海力士的产品已经领 先几代，并稳稳地占据了全球HBM市场的主导地位。等到Saimemory将其替代方案推向市场时， 现有厂商的领先优势很可能已经进一步扩大。 软银一位高管向《日 ...