Core Viewpoint - Chipone Microelectronics (芯碁微装) plans to initiate the process for issuing H-shares and listing on the Hong Kong Stock Exchange to enhance its international strategy and brand recognition [1][2]. Group 1: H-Share Listing Plans - The company's board approved the proposal to start preparations for the H-share issuance and listing on June 27, 2025, with a 12-month authorization period [1]. - The H-share listing aims to strengthen the company's capital strength and overall competitiveness [1]. - Specific details regarding the H-share listing are yet to be finalized, and the company will consult with relevant intermediaries [1]. Group 2: Previous Fundraising Activities - Chipone Microelectronics was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on April 1, 2021, raising a total of 460 million yuan, with a net amount of 416 million yuan after expenses [2][3]. - The company initially planned to raise 473 million yuan, with allocations for various projects including high-end PCB laser imaging equipment and wafer-level packaging [3]. - The total fundraising from the IPO and subsequent private placement amounts to 1.258 billion yuan [5]. Group 3: Recent Capital Increases - As of July 25, 2023, the company issued 10,497,245 shares at a price of 75.99 yuan per share, raising approximately 797.69 million yuan, with a net amount of about 789.36 million yuan after expenses [4].