Group 1 - The core point of the news is that the controlling shareholder and actual controller of Chipbond Microelectronics, Cheng Zhuo, plans to reduce his shareholding by up to 2,634,814 shares, which is no more than 2.00% of the total shares, due to personal funding needs [1] - As of the announcement date, Cheng Zhuo directly holds 36,787,490 shares, accounting for 27.92% of the company's total share capital [1] - The planned reduction will be executed through a combination of centralized bidding and block trading within three months after the announcement, with specific limits on the number of shares that can be sold in any 90-day period [1] Group 2 - Chipbond Microelectronics was listed on the Sci-Tech Innovation Board on April 1, 2021, with an issuance of 30,202,400 shares at a price of 15.23 yuan per share, raising a total of 460 million yuan [2] - The net amount raised after deducting issuance costs was 416 million yuan, which was 57.08 million yuan less than the original plan [2] - The funds raised were allocated to various projects, including 208 million yuan for upgrading high-end PCB laser direct imaging equipment and 108 million yuan for research and development of flat panel display lithography equipment [2] Group 3 - On August 8, 2023, Chipbond Microelectronics disclosed that it issued 10,497,245 shares at a price of 75.99 yuan per share, raising a total of approximately 797.69 million yuan [3] - After deducting issuance costs, the net amount raised was approximately 789.36 million yuan [3] - The main underwriter for this issuance was Haitong Securities [3] Group 4 - The total fundraising from both the IPO and the private placement amounts to 1.258 billion yuan [4] - On September 16, 2025, Chipbond Microelectronics announced that it had submitted application materials for issuing overseas listed shares (H shares) to the China Securities Regulatory Commission [4] - The company applied for listing H shares on the Hong Kong Stock Exchange on August 31, 2025 [4]

Core Viewpoint - Chip Microelectronics (芯碁微装) announced a share reduction plan by its controlling shareholder and chairman, Cheng Zhuo, due to personal funding needs, intending to sell up to 2,634,814 shares, representing no more than 2.00% of the total shares [1][2]. Summary by Sections Share Reduction Plan - Cheng Zhuo currently holds 36,787,490 shares, accounting for 27.92% of the total share capital [1]. - The planned reduction will occur through a combination of centralized bidding and block trading within three months after the announcement, starting 15 trading days post-announcement [1]. - The maximum number of shares to be sold via centralized bidding is limited to 1% of the total shares over any 90-day period, while block trading is capped at 2% [1]. Financial Implications - Based on the closing price of 141.34 yuan on September 30, the total cash raised from the share reduction could reach up to 372 million yuan [2]. - The company raised a total of 460 million yuan during its IPO, with a net amount of 416 million yuan after deducting issuance costs [3]. - The total fundraising from both the IPO and subsequent private placements amounts to 1.258 billion yuan [5]. Recent Developments - On September 16, 2025, Chip Microelectronics announced that its application for issuing overseas listed shares (H-shares) was accepted by the China Securities Regulatory Commission [6]. - The company submitted its application for H-share listing on the Hong Kong Stock Exchange on August 31, 2025 [6].

Core Viewpoint - Chipone Microelectronics (芯碁微装) plans to initiate the process for issuing H-shares and listing on the Hong Kong Stock Exchange to enhance its international strategy and brand recognition [1][2]. Group 1: H-Share Listing Plans - The company's board approved the proposal to start preparations for the H-share issuance and listing on June 27, 2025, with a 12-month authorization period [1]. - The H-share listing aims to strengthen the company's capital strength and overall competitiveness [1]. - Specific details regarding the H-share listing are yet to be finalized, and the company will consult with relevant intermediaries [1]. Group 2: Previous Fundraising Activities - Chipone Microelectronics was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on April 1, 2021, raising a total of 460 million yuan, with a net amount of 416 million yuan after expenses [2][3]. - The company initially planned to raise 473 million yuan, with allocations for various projects including high-end PCB laser imaging equipment and wafer-level packaging [3]. - The total fundraising from the IPO and subsequent private placement amounts to 1.258 billion yuan [5]. Group 3: Recent Capital Increases - As of July 25, 2023, the company issued 10,497,245 shares at a price of 75.99 yuan per share, raising approximately 797.69 million yuan, with a net amount of about 789.36 million yuan after expenses [4].