Core Viewpoint - The article discusses the upcoming 2025 Bay Area Semiconductor Chip Exhibition in Shenzhen, highlighting the participation of local semiconductor company Xinkailai and the potential surprises it may unveil, particularly in advanced semiconductor manufacturing technologies [2][3][4]. Group 1: Event Overview - The 2025 Bay Area Semiconductor Chip Exhibition will take place from October 15 to 17 at the Shenzhen Futian Convention Center [2][3]. - Xinkailai is expected to showcase significant advancements, including a new generation of ultra-fast real-time oscilloscopes with a performance improvement of 500% [4]. Group 2: Potential Surprises from Xinkailai - Surprise One: Breakthrough in domestic DUV lithography machine components, specifically the light source or high-NA lens system, which are critical for advanced lithography technology [6][7]. - Surprise Two: A complete set of domestically produced core equipment for 28nm and above processes, demonstrating a systematic breakthrough in semiconductor manufacturing capabilities [7]. - Surprise Three: Revolutionary software or intelligent process control platforms that significantly enhance performance on existing lithography equipment, potentially achieving near 7nm process yields [9]. Group 3: Xinkailai's Technological Innovations - Xinkailai's "Mountains Series" equipment matrix, which includes various advanced semiconductor manufacturing tools, aims to break international monopolies and achieve precision from microns to nanometers [20][23]. - The Emei Mountain series focuses on atomic-level precision in epitaxial deposition, achieving significant advancements in material preparation for semiconductor manufacturing [27][29]. - The Sanqing Mountain series offers rapid thermal processing (RTP) solutions with millisecond temperature response and nanometer-level uniformity, enhancing thermal budget management in advanced processes [32][40]. Group 4: Equipment and Capabilities - The Wuyi Mountain series provides a complete etching solution for 12-inch wafers, achieving nanometer-level precision and competing with international leaders [44][51]. - The Putuo Mountain series focuses on physical vapor deposition (PVD) with millimeter-level positioning accuracy and atomic-level film control, establishing a strong presence in metal interconnect processes [55][58]. - The Alishan series of atomic layer deposition (ALD) equipment achieves 0.1Å film thickness control, significantly enhancing material growth rules in advanced semiconductor manufacturing [62][65].

Core Viewpoint - The emergence of New Kai Lai in the semiconductor industry could signify a strategic shift, particularly if it successfully advances to 3nm technology, potentially altering the balance of power in the semiconductor supply chain and reducing Western control over critical technologies [1] Group 1: Industry Impact - The breakthrough in 3nm technology by New Kai Lai would alleviate the bottleneck in lithography, which is crucial for semiconductor manufacturing, thereby enhancing the competitive position of Eastern companies [1] - New Kai Lai's rise is expected to have a long-term positive impact on the upstream supply chain of equipment components and semiconductor manufacturing materials [1] Group 2: Domestic Demand and Capabilities - Domestic computing power demand has been suppressed due to a lack of high-end chips, which in turn is caused by insufficient advanced manufacturing capabilities [1] - If high-end manufacturing capabilities improve rapidly, similar to Western advancements, the release of computing power in the domestic market could be significant [1] Group 3: Recent Developments - At the 2025 SEMICON China exhibition, New Kai Lai introduced the ALD "Ali Mountain" atomic layer deposition equipment for sub-5nm film deposition and the Wuyishan series etching equipment supporting advanced processes below 5nm [1] - New Kai Lai's self-developed SAQP technology, in collaboration with Huawei's HiSilicon, has improved the precision of DUV lithography machines by 300%, achieving 5nm processes [1] - A collaboration with SMIC has led to the trial production of 5nm logic chips, achieving a wafer yield of 85%, which is close to TSMC's EUV process yield of 90% [1]