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大族数控(301200) - 2025年9月30日投资者关系活动记录表
2025-09-30 09:00
证券代码:301200 证券简称:大族数控 深圳市大族数控科技股份有限公司 投资者关系活动记录表 编号:2025-005 投资者关系活动 类别 特定对象调研 分析师会议 媒体采访 业绩说明会 新闻发布会 路演活动 现场参观 其他 券商策略会、电话会议 参与单位名称 宝盈基金(9月2日) 平安基金(9月2日) 兴业机械(9月3日) 华西证券(9月3日) 爱建证券资管(9月3日) 深圳市路演时代科技有限公司(9月3日) 南土资产(9月3日) 拾贝投资(9月3日) Pleiad Inverstment Advisors Limited(9月3日) 睿郡资产(9月3日) 洲和资本(9月3日) 江苏瑞华(9月3日) 中信证券(9月3日) 嘉实基金(9月5日) 民生证券(9月5日) 信达澳亚基金(9月5日) 诺安基金(9月5日) 金科投资控股(9月5日) 同时,公司业务模式创新发展,通过布局 PCB 生产关键工序 及多品类产品为客户提供一站式解决方案,实现了应用场景、技 术、供应链、设备与材料、产品、工序、客户的多维协同,并创造 性地发挥协同优势,放大客户、供应链及产业链伙伴、公司整体价 值,不断提升公司产品的技术能力和 ...
大族数控(301200) - 大族数控2025年8月29日投资者关系活动记录表
2025-08-29 10:48
Group 1: Company Performance - In the first half of 2025, the company achieved operating revenue of 238,183.32 million yuan, a significant increase of 52.26% compared to the same period last year [4] - The net profit attributable to shareholders reached 26,327.17 million yuan, reflecting an impressive growth of 83.82% year-on-year [4] Group 2: PCB Industry Trends - The PCB industry is expected to grow by 7.6% in revenue and 7.8% in production in 2025, driven by strong demand for AI servers and switches [6] - From 2024 to 2029, the compound annual growth rate (CAGR) for capacity in the PCB sector is projected to be 22.1% for high multilayer boards and 17.7% for HDI boards [6] - The global PCB market is anticipated to reach nearly 100 billion USD by 2029, while the domestic market is expected to hit 50 billion USD [7] Group 3: High Multilayer Board Market - The demand for high multilayer boards is increasing due to the rapid growth of data and the adoption of 112/224Gbps SerDes designs in AI servers and high-speed switches [8] - The need for advanced drilling technology, such as CCD six-axis independent drilling machines, is rising to meet the higher precision and quality requirements for AI PCB products [9] - The company has developed a CO2 laser drilling machine that meets the high-quality processing needs for large-diameter and cross-layer blind holes [10] Group 4: HDI Market Situation - The demand for HDI boards is rapidly increasing in AI smartphones, AI PCs, automotive electronics, and optical modules [11] - The company is upgrading its CO2 laser drilling machines and high-resolution imaging systems to meet the shrinking feature sizes of HDI products [11] - New laser processing solutions have been developed to achieve high precision in micro-hole drilling and shaping, gaining recognition and orders from downstream customers [12]