Core Viewpoint - The company is actively expanding its eSIM packaging capabilities and is currently in the business development phase for its IoT eSIM chip packaging business [1] Group 1: Company Collaboration - The company has established relationships with major clients in the smart card business, including Hengbao Co., Ltd., Chutianlong, and Dongxin Peace [1] - The company is exploring potential collaborations with eSIM partners such as Dongxin Peace, Chutianlong, Hengbao Co., Ltd., and Chengtian Weiye [1] Group 2: Business Development - The eSIM packaging business is a new venture for the company, which is currently in the market expansion phase [1] - The company is committed to actively exploring market opportunities based on business demand [1]

Core Viewpoint - New Henghui Electronics Co., Ltd. is set to go public on the Shenzhen Stock Exchange's ChiNext board on June 20, 2025, with an initial offering price of 12.80 yuan per share, which is significantly lower than the industry average P/E ratio, indicating potential investment attractiveness [2][19]. Company Overview - New Henghui Electronics specializes in the manufacturing of smart cards, etched lead frames, and IoT eSIM chip packaging, with a registered capital of 179.67 million yuan [21][22]. - The company has achieved positive net profits in the last two years, totaling 32.12 million yuan, meeting the listing criteria for the ChiNext board [21][24]. Financial Metrics - The offering price of 12.80 yuan per share corresponds to a diluted P/E ratio of 17.76 times based on the 2024 net profit, which is significantly lower than the industry average P/E ratio of 37.99 times [5][19]. - The company reported revenues of 68.38 million yuan, 76.67 million yuan, and 81.60 million yuan for the last three years, indicating a steady growth trajectory [12][13]. Market Position - The company holds a 32% market share in flexible lead frames and approximately 13% in smart card modules, reflecting a strong competitive position in the smart card market [10][12]. - The global smart card shipment volume has remained stable at around 9.5 billion units, with significant contributions from telecom SIM cards and banking chip cards [10]. Shareholder Structure - The major shareholders include Yu Renrong and Ren Zhijun, who collectively control over 51% of the company, ensuring stable governance [24][25]. - The company plans to implement a strategic share placement, with 1.20 million shares allocated to strategic investors, which will enhance liquidity post-listing [19][20]. Risk Factors - The company faces risks related to market demand stability for smart cards, potential competition in the etched lead frame business, and reliance on major customers, which could impact future revenue growth [10][12][13]. - The initial trading period on the ChiNext board will have no price limits for the first five trading days, which may lead to significant price volatility [8][9].

股票简称：新恒汇 股票代码：301678 新恒汇电子股份有限公司 （北京市朝阳区朝阳门南大街10号兆泰国际中心A座15层） 二〇二五年六月 （山东省淄博市高新区中润大道 187 号） 首次公开发行股票并在创业板上市 之 上市公告书 保荐人（主承销商） | 第一节 重要声明与提示 4 | | --- | | 一、重要声明 4 | | 二、创业板新股上市初期投资风险特别提示 4 | | 三、特别风险提示 7 | | 第二节 股票上市情况 11 | | 一、股票注册及上市审核情况 11 | | 二、股票上市的相关信息 11 | | 三、公司申请首次公开发行并上市时选择的具体上市标准及公开发行后 | | 达到所选定的上市标准及其说明 14 | | 第三节 发行人、实际控制人及股东持股情况 16 | | 一、发行人基本情况 16 | | 二、公司董事、监事、高级管理人员及其持有公司股票、债券的情况16 | | 三、控股股东及实际控制人的情况 18 | | 四、本次公开发行前已制定或实施的股权激励计划及员工持股计划..19 | | 五、本次发行前后的股本结构变动情况 42 | | 六、本次发行后公司前十名股东持股情况 4 ...