8月25日晚间，澄天伟业发布半年度业绩报告称，报告期内公司实现营业收入1.78亿元，同比上升 14.83%;实现归属于上市公司股东的扣非后净利润为1303.35万元，同比上升24.81%。公司表示，业绩驱 动因素主要得益于优化产品结构，同时海外收入占比进一步提升，加之生产中心技术改造，生产效率进 一步提升。 2018年，澄天伟业设立全资子公司宁波澄天，建立并拥有半导体芯片承载基带和半导体芯片全球研发中 心和制造基地。2019年底，宁波澄天智能卡芯片项目正式投产。至此，澄天伟业率先成为智能卡行业内 覆盖智能卡专用芯片生产、智能卡卡体生产及智能卡信息个人化的全产业链的企业。 公告显示，今年上半年，宁波澄天智能卡专用芯片项目已经实现批量投产，营业收入达2106.89万元。 公司表示，该项目的投产将进一步延伸公司产业链，丰富公司产品线。值得一提的是，目前宁波澄天已 经取得了ICCR集成电路卡注册证书，智能卡专用芯片SOGISCCEAL5+认证正在申请过程中。 澄天伟业表示，目前公司产能规模居于行业前列，近几年智能卡产销量均超过10亿张，规模优势为公司 积累了优质及需求多元化的客户。在产品结构上，随着国内金融IC卡需求 ...

12月22日，楚天龙涨5.02%，截至发稿，报19.25元/股，成交1.75亿元，换手率2.03%，总市值88.77亿 元。 资料显示，楚天龙股份有限公司位于北京市海淀区蓝靛厂金源时代购物中心B区1508室，成立日期2002 年10月16日，上市日期2021年3月22日，公司主营业务涉及从事智能卡的设计、研发、生产、销售和服 务。主营业务收入构成为：嵌入式安全产品80.69%，智能硬件9.86%，软件及服务7.25%，其他2.21%。 华宝中证金融科技主题ETF（159851）基金经理为陈建华、曹旭辰。 截至发稿，陈建华累计任职时间13年4天，现任基金资产总规模277.02亿元，任职期间最佳基金回报 171.9%， 任职期间最差基金回报-49.65%。 从楚天龙十大流通股东角度 数据显示，华宝基金旗下1只基金位居楚天龙十大流通股东。华宝中证金融科技主题ETF（159851）三 季度增持187.02万股，持有股数387.81万股，占流通股的比例为0.85%。根据测算，今日浮盈赚取约 356.79万元。 华宝中证金融科技主题ETF（159851）成立日期2021年3月4日，最新规模123.19亿。今年以来收益 1 ...

中国智能卡行业需求现状与投资发展策略分析报告2026年版 【出版机构】：鸿晟信合研究院 【内容部分有删减·详细可参鸿晟信合研究院出版完整信息！】 【免费售后 服务一年，具体内容及订购流程欢迎咨询客服人员 】 第1章：智能卡行业研究范围界定及发展环境剖析 1.1 智能卡行业的研究范围界定 1.1.1 智能卡的概念界定 【全新修订】：2025年11月 （1）智能卡的定义 （2）智能卡的组织构造 1.1.2 智能卡的产品分类 （1）按镶嵌芯片分类 （2）按交换界面分类 （3）按应用领域分类 （4）按数据传输方式分类 1.1.3 本报告统计口径及研究范围说明 1.2 智能卡行业政策环境分析 1.2.1 行业监管体系 1.2.2 行业规范标准 1.2.3 行业发展相关政策汇总及重点政策解读 （1）行业发展相关政策汇总 （2）行业发展重点政策解读 1.2.4 行业发展中长期规划汇总及解读 1.2.5 政策环境对智能卡行业发展的影响分析 1.3 智能卡行业经济环境分析 1.3.1 宏观经济现状 （1）国内生产总值增长分析 （2）固定资产投资增长分析 （3）工业经济增加值增长分析 1.3.2 宏观经济展望 1.4 智能卡行业 ...

Group 1: Business Development and Market Strategy - The company is actively expanding its liquid cooling business, focusing on core customer mass production processes and has achieved small batch liquid cooling product orders [1][2] - The semiconductor packaging materials business is targeting major clients in the power semiconductor packaging sector, with a focus on applications in new energy vehicles and photovoltaic inverters [2][3] - The company aims to leverage its expertise in high thermal conductivity materials and semiconductor packaging to enter the thermal management market, with a comprehensive product range including liquid cooling plates and next-generation microchannel cooling solutions [3][4] Group 2: Financial Performance - In the first three quarters of 2025, the company reported revenue of CNY 310 million, a year-on-year increase of 24.48%, and a net profit attributable to shareholders of CNY 12.42 million, up 2,925.45% [2][3] - The growth in performance is attributed to increased sales of smart card products and the rapid expansion of the power electronics application market, which has enhanced the market penetration of semiconductor packaging materials [3][4] Group 3: Research and Development - The company holds 185 patents, including 5 invention patents and 126 utility model patents, with R&D investment increasing by 9.59% year-on-year [2][3] - Future R&D efforts will focus on semiconductor packaging materials and the newly developed liquid cooling business [3][4] Group 4: Future Outlook and Risks - The company is optimistic about the future growth of its liquid cooling business, despite its current revenue contribution being low, as it anticipates rapid growth with increased customer acceptance and mass production plans [3][4] - The company emphasizes the importance of adhering to legal disclosure requirements and encourages investors to be rational in their investment decisions, highlighting potential risks associated with new business developments [4][5]

Core Viewpoint - The company has established a strong competitive advantage in the smart card business through long-term strategic partnerships with major global players and a significant overseas revenue contribution [1] Group 1: Business Performance - The overseas revenue share of the company's smart card business has consistently exceeded 60% [1] - The revenue concentration from the top five customers has decreased from 87.92% in 2023 to 77.75% in 2024, indicating an improvement in customer diversification [1] Group 2: Strategic Initiatives - The company has formed long-term strategic partnerships with leading smart card system companies such as THALES and IDEMIA [1] - The company is expanding into new business areas such as semiconductor packaging and liquid cooling, which helps reduce reliance on the single smart card business and enhances overall operational stability [1]

Group 1: Company Overview and Business Segments - The company focuses on three main business segments: smart cards, semiconductors, and digital & energy thermal management, with smart cards being the traditional stronghold [1][2] - The Ningbo Cheng Tian dedicated chip project was completed in 2019, contributing to both internal use and external sales, and the semiconductor packaging materials business achieved large-scale production in 2023 [1][2] Group 2: Liquid Cooling Business Development - The liquid cooling business is a significant growth point, leveraging the company's expertise in high thermal conductivity materials and core processes to expand from packaging materials to system-level solutions [2][3] - The company has established a complete capability chain from semiconductor packaging materials to liquid cooling components and overall solutions, differentiating itself from competitors [3][4] Group 3: Financial Performance and Market Dynamics - Revenue from semiconductor packaging materials is projected to account for nearly 10% of total revenue in 2024, with strong growth expected [6] - The company's revenue fluctuated in 2022-2023 due to macroeconomic downturns, with smart card business being the main revenue source during this period [8][9] Group 4: Strategic Partnerships and Customer Base - The company maintains long-term strategic partnerships with major clients like THALES and IDEMIA, with overseas business accounting for over 60% of revenue [9][12] - The customer base for semiconductor packaging and liquid cooling businesses is currently independent, but there is potential for future collaboration as technology evolves [11] Group 5: Research and Development Focus - Future R&D investments will prioritize semiconductor packaging materials and the newly developed liquid cooling business, focusing on system-level testing and integration [10][12] - The company aims to enhance its competitive edge through continuous innovation and cost-effectiveness analysis in R&D [10] Group 6: Market Trends and Risks - The rise of eSIM technology is expected to boost product margins and transition the smart card business towards service-oriented models [12] - The company is aware of potential risks associated with new product development, including technological and market uncertainties [12]

Group 1 - The core viewpoint of the news is that Xin Heng Hui's stock price increased by 5.25% to 73.35 CNY per share, with a trading volume of 248 million CNY and a turnover rate of 7.65%, resulting in a total market capitalization of 17.571 billion CNY [1] - Xin Heng Hui Electronic Co., Ltd. is located in Zibo City, Shandong Province, established on December 7, 2017, and listed on June 20, 2025. The company's main business includes smart card business, etched lead frame business, and IoT eSIM chip testing services [1] - The revenue composition of Xin Heng Hui's main business is as follows: smart card business accounts for 59.74%, etched lead frame business 28.34%, IoT eSIM chip testing 6.16%, and others 5.76% [1] Group 2 - From the perspective of the top ten heavy stocks in funds, data shows that one fund under China Merchants Fund holds Xin Heng Hui as a significant investment. The fund, China Merchants CSI 300 Real Estate Equal Weight Index A (161721), held 382 shares in the third quarter, unchanged from the previous period, accounting for 0.0007% of the circulating shares, ranking as the seventh largest heavy stock [2] - The China Merchants CSI 300 Real Estate Equal Weight Index A (161721) was established on January 1, 2021, with a latest scale of 434 million CNY. Year-to-date returns are 0.84%, ranking 4164 out of 4216 in its category; over the past year, it has lost 14.99%, ranking 3919 out of 3922; and since inception, it has lost 41.71% [2] - The fund manager of China Merchants CSI 300 Real Estate Equal Weight Index A (161721) is Wang Ningyuan, who has been in the position for 260 days. The total asset scale during his tenure is 2.116 billion CNY, with the best fund return of 18.24% and the worst fund return of 4.59% [3]

Core Insights - The company, Cheng Tian Wei Ye, is one of the earliest entrants in the smart card industry in China, establishing a comprehensive end-to-end process that includes chip application R&D, module packaging, smart card development, production, sales, and terminal application development [1] - The company has achieved a breakthrough in one-stop delivery capability in the smart card sector, enhancing product consistency and delivery efficiency, which strengthens technical barriers and customer loyalty, creating a differentiated competitive advantage and higher value-added space [1] - Cheng Tian Wei Ye has established long-term stable partnerships with international leading smart card system manufacturers such as THALES and IDEMIA, with over 60% of its products exported, making it one of the first smart card companies in China to achieve a global layout [1] - The company's communication smart card products have formed a certain sales scale in the global market, with the smart card business accounting for approximately 60%-70% of total revenue [1] - It is expected that the revenue scale of the smart card business will remain relatively stable, while the proportion of this business in total revenue will gradually decrease as the company expands its semiconductor and thermal management businesses [1]

Group 1: Company Overview - The company is one of the earliest entrants in the smart card industry, establishing a comprehensive end-to-end process for chip application development, module packaging, smart card R&D, production, sales, and terminal application development [1] - Smart card business accounts for approximately 60%-70% of total revenue, with expectations for stable revenue in this segment [1][2] Group 2: Semiconductor Business - Main products in the semiconductor business include carrier tapes, lead frames, and copper heat dissipation substrates, catering to the needs of MOSFET, SiC, and IGBT power modules [2] - The growth of the semiconductor packaging materials sector is driven by the rapid expansion of downstream power electronics applications, particularly in photovoltaic inverters, energy storage systems, and new energy vehicles [2] Group 3: Liquid Cooling Solutions - The company has developed a full-stack layout for liquid cooling products, including core components like liquid cooling plates and secondary system-level solutions [3] - The liquid cooling business is in an active market expansion phase, targeting major domestic server manufacturers and AI computing platform builders [3] Group 4: Strategic Partnerships - The company has formed a joint venture with superX to integrate strengths and expand the global AIDC cabinet liquid cooling product market, with the company holding a 25% stake [3] - The joint venture aims to design customized cabinet-level liquid cooling solutions, enhancing internal business synergy [3] Group 5: Technology and Innovation - The microchannel liquid cooling plate (MLCP) technology integrates traditional packaging heat dissipation structures with liquid cooling channels, significantly reducing thermal resistance and improving heat exchange efficiency [3] - The company is actively advancing MLCP sample testing and production line preparations, focusing on high heat flux density applications in AI servers and power modules [3] Group 6: Risk Management - The company acknowledges potential technical, market, and application validation risks associated with new business and product development [4] - It emphasizes the importance of rational investment and risk awareness among investors [4]

Core Viewpoint - Dongxin Peace Technology Co., Ltd. experienced a stock price increase of 5.05%, reaching 27.69 CNY per share, with a trading volume of 2.038 billion CNY and a turnover rate of 12.93%, resulting in a total market capitalization of 16.072 billion CNY [1] Group 1: Company Overview - Dongxin Peace was established on October 20, 1998, and went public on July 13, 2004. The company is located in Zhuhai, Guangdong Province, and specializes in the production and sale of mobile communication smart cards, contactless smart cards, and related application systems [1] - The revenue composition of Dongxin Peace includes 71.47% from smart card products, 27.05% from digital security and platform services, and 1.48% from other supplementary services [1] Group 2: Shareholder Information - Among the top ten circulating shareholders of Dongxin Peace, Huabao Fund's Huabao CSI Financial Technology Theme ETF (159851) increased its holdings by 295,200 shares in the second quarter, bringing its total to 2.9987 million shares, which accounts for 0.52% of the circulating shares [2] - The Huabao CSI Financial Technology Theme ETF was established on March 4, 2021, with a current scale of 5.731 billion CNY. Year-to-date returns are 19.25%, ranking 2404 out of 4218 in its category, while the one-year return is 31.33%, ranking 1608 out of 3865. Since inception, the fund has achieved a return of 70.7% [2]