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用于芯片封装可剥离超薄铜箔
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嘉元科技(688388.SH):布局了用于芯片封装可剥离超薄铜箔相关项目
Ge Long Hui· 2025-10-24 07:39
Core Viewpoint - The company is focused on new technologies and product applications in the industry, emphasizing research and development innovation and product upgrades to enhance its core competitiveness [1] Group 1: Production Capacity - The company has planned a total production capacity of 35,000 tons for its electrolytic copper foil production line located in Longnan, Jiangxi [1] - Currently, the production capacity that has been put into operation exceeds 10,000 tons [1] Group 2: Product Applications - The production line primarily manufactures electronic circuit copper foil products, with high-end products applicable for AI server PCBs [1] - The company is also developing projects related to peelable ultra-thin copper foil for chip packaging [1] Group 3: Future Production Plans - The first production line for the ultra-thin copper foil is expected to begin trial production in the fourth quarter of 2025 [1] - By the end of 2026, the company aims to achieve an annual production capacity of 700,000 square meters [1]