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第6代高带宽内存 (HBM4)
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【太平洋科技-每日观点&资讯】(2025-05-06)
远峰电子· 2025-05-05 11:37
Market Overview - The main board saw significant gains with notable stocks such as Hubei Broadcasting (+10.04%), Tongding Internet (+10.02%), and Shanghai Film (+10.01%) leading the charge [1] - The ChiNext board also performed well, highlighted by Everbright Tongchuang (+20.01%) and Creative Information (+19.93%) [1] - The Sci-Tech Innovation board was led by Dekeli (+15.41%) and Lingzhi Software (+14.46%) [1] - Active sub-industries included SW Communication Application Value-Added Services (+3.09%) and SW Horizontal General Software (+3.01%) [1] Domestic News - Tianyue Advanced is expanding its production capacity for silicon carbide single crystal with a project to produce 500 tons annually, aiming for equipment installation by May 2025 and trial production by June [1] - Saizhuo Electronics has officially launched a vehicle-grade semiconductor packaging project with a total investment of 500 million, enhancing its strategic positioning in the vehicle-grade integrated circuit sector [1] - TSMC has commenced construction of its third semiconductor factory in Phoenix, Arizona, with completion expected between 2028 and 2030, utilizing advanced 2nm and 1.6nm process technologies [1] - Jinghe Integrated reported an increase in revenue from 55nm products, driven by higher shipments of DDIC/CIS products, with automotive chip development progressing smoothly [1] Company Announcements - Shen Si Electronics announced receipt of government subsidies amounting to 1.821 million yuan, representing 11.17% of its latest audited net profit attributable to shareholders [3] - Jiangbolong disclosed a plan for a major shareholder to reduce holdings by up to 4.16 million shares, accounting for 1.00% of total share capital, between May and August 2025 [3] - Tongguan Copper Foil reported a share buyback of 3,800 shares, representing 0.00046% of total share capital, with a total transaction amount of 37,976 yuan [3] - Huada Jiutian is progressing with a major asset restructuring, with ongoing audits and due diligence [3] Overseas News - Current global tariff rates, if unchanged, are expected to increase Apple's costs by $900 million for the quarter ending June [4] - Samsung Electronics is in discussions with Nvidia, Broadcom, and Google to develop custom 6th generation high bandwidth memory (HBM4), with deliveries anticipated as early as next year [4] - Samsung has confirmed plans to introduce vertical channel transistor (VCT) technology after the 7th generation 10nm DRAM process, with products expected in 2 to 3 years [4] - In Q1 2025, the global AMOLED smartphone panel market in South Korea accounted for 49.2%, while domestic manufacturers held a 50.8% share, showing resilience despite a year-on-year decline [4]
HBM4,三星率先量产?
半导体行业观察· 2025-05-01 02:56
https://www.hankyung.com/article/2025043070471 如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自 hankyung,谢谢。 量产将领先竞争对手一步,预计明年上半年上市销售。 三星电子已与 Nvidia、Broadcom 和 Google 等人工智能 (AI) 加速器(专门用于数据学习和推 理的 AI 半导体封装)开发商展开讨论,以提供定制的第 6 代高带宽内存 (HBM4)。目标交货日 期最早为明年上半年。该计划旨在抢在 SK Hynix 等竞争对手之前开始量产定制 HBM4,从而颠 覆市场格局。 三星电子30日宣布,今年第一季度实现销售额79.1405万亿韩元,营业利润6.6853万亿韩元。与 去年同期相比,销售额增长了10.1%,营业利润增长了1.2%。移动体验(MX)部门和网络部门 的合并营业利润(4.3万亿韩元)同比增长22.5%。由于HBM和代工业务表现低迷,负责半导体 的设备解决方案(DS)部门的营业利润下降47.6%至1.1万亿韩元。 三星电子预测,如果美国关税政策等不确定因素得到解决,未来业绩将在年底前改善。副总裁兼 经营支持部长朴淳哲当天 ...