Core Viewpoint - The semiconductor equipment industry faces ten major challenges, including severe competition and various forms of industry "involution" as highlighted by the chairman of Zhongwei Company, Yin Zhiyao [1][2]. Group 1: Industry Challenges - The semiconductor micro-processing equipment industry is experiencing significant challenges, including unfair competition and the negative impacts of vertical integration attempts by some companies [1][3]. - Yin Zhiyao identified 15 manifestations of industry involution, such as unfair terms between equipment manufacturers and component suppliers, and the use of media to undermine competitors [1]. Group 2: Vertical Integration Issues - Vertical integration in the semiconductor industry leads to unfair competition, as manufacturers may leak proprietary knowledge to equipment suppliers during collaboration [3][4]. - Historical attempts by some chip manufacturers to engage in equipment production have largely failed, reinforcing the need for separation between manufacturing and equipment supply [4]. Group 3: Domestic Equipment Development - The domestic semiconductor equipment industry has made progress in localization, with the highest domestic production rate of 90% for de-bonding equipment, while other segments like thermal treatment and etching equipment have around 20% localization [5]. - The development of semiconductor equipment requires substantial funding, often exceeding the sale price of the equipment by multiples, which poses a barrier to further localization [5][6]. Group 4: Collaboration and Innovation - To reduce internal competition and promote healthy development in the semiconductor equipment industry, collaboration between smaller and larger companies is encouraged [6]. - Zhongwei Company showcased six new semiconductor equipment products at the recent exhibition, demonstrating its technological capabilities in critical processes such as plasma etching and atomic layer deposition [6].