基带芯片是一种用于无线电传输和接收数据的数字芯片，是移动通信设备的基础元器件，主要的功能是 把数据变成天线可以发出的电磁波，再把接收到的电磁波解码成所需要的数据。 基带芯片技术壁垒高，需要长期累积，因此全球只有极少数厂家拥有此项技术，如高通、联发科、三 星、紫光展锐和英特尔。高通是其中的主导者，并为苹果iPhone产品生产组件。截至目前，苹果大部分 机型在基带上依旧使用高通产品，但最终苹果的目的是全面摆脱高通基带。 每经记者｜王晶 每经编辑｜文多 今年以来，苹果在自研基带芯片上持续发力。继2月在主打中端市场的iPhone 16e上首次搭载自研基带芯 片C1后，本月发布的 iPhone Air也采用了升级版C1X。这意味着，苹果正逐步摆脱对高通在基带领域的 依赖。同时，外界也认为这将给高通的财务带来一定的影响。 9月24日，《每日经济新闻》记者就如何应对苹果自研基带芯片带来的影响，采访了高通中国区董事长 孟樸。他介绍："苹果用自研芯片，时间表都是透明的，我们2027年以后的规划里面没有苹果（有关） 生意的部分。从高通来讲有两个方面（的应对思路）：怎么能更多地（与）安卓厂商加强合作，以此取 代iOS的份额；另一方 ...

Core Insights - The iPhone 17 Pro will retain a physical SIM card slot, indicating Apple's commitment to traditional SIM technology alongside eSIM options [1] - The iPhone 17 Air is set to replace the Plus model, featuring a thickness of approximately 5.5mm, making it Apple's thinnest device to date [3] - The iPhone 17 Air will have a battery capacity of less than 3000mAh, and it will be equipped with Apple's self-developed C1 baseband chip, which is more power-efficient but does not support 5G millimeter wave [3] Group 1 - The iPhone 17 series, except for the Air model, will continue to support traditional SIM cards [1] - The production line for the iPhone 17 Air began assembly in July, indicating a likely launch of the eSIM-enabled Chinese version [1] - The iPhone 17 Air is expected to be officially unveiled in September [3] Group 2 - eSIM technology allows for integration directly on the device's motherboard, providing a more flexible and convenient network connection experience [3] - The iPhone 17 Air's design prioritizes thinness, which has resulted in a reduced battery capacity [3] - The C1 baseband chip is designed to enhance battery life, although it lacks support for certain advanced 5G features [3]