1月7日，A股早盘强势上扬，沪指盘中逼近4100点，续创逾10年新高；午后一度回落翻绿；港股走势疲弱，恒生指数跌近1%，恒生科技指数跌1.49%。 | 行情 | 资金净流入 | 涨跌分布 | | --- | --- | --- | | 上证指数 | 深证成指 | 科创综指 | | 4085.77 | 14030.56 | 1746.72 | | +2.11 +0.05% | +8.01 +0.06% | +26.32 +1.53% | | 万得全A | 创业板指 | 北证50 | | 6654.10 | 3329.69 | 1496.28 | | +12.34 +0.19% | +10.40 +0.31% | +3.24 +0.22% | 具体来看，沪指盘中震荡上扬，午后一度回落，尾盘再度翻红，连续14日收阳；科创50指数较为强势。截至收盘，沪指微涨0.05%报4085.77点，深证成指 涨0.06%，创业板指涨0.31%，科创50指数涨0.99%，沪深北三市合计成交约2.88万亿元，较此前一日增加近500亿元。 全A近3200股飘绿，人脑工程概念跳水，诚益通、爱朋医疗等跌超10%；券商、石油、银行等板块走低 ...

7日，A股早盘强势上扬，沪指盘中逼近4100点，续创逾10年新高；午后一度回落翻绿；港股走势疲弱，恒生指数跌近1%，恒生 科技指数跌1.49%。 半导体产业链股强势 光刻机、存储芯片、先进封装等半导体产业链股盘中集体爆发，截至收盘，南大光电、芯源微、恒坤新材等20%涨停，安集科技涨近 19%，普冉股份涨近12%，北方华创涨逾6%、兆易创新涨近5%。值得注意的是，芯源微、普冉股份、北方华创、兆易创新等盘中均创历史 新高。 | 代码 名称 | � | 涨幅% | 现价 | 涨跌 | 买价 | 卖价 总量 | | --- | --- | --- | --- | --- | --- | --- | | 300346 南大河里 | | R 20.00 | 55.19 | 9.20 | 55.19 | - 196.5万 | | 688037 2 原微 | | K 20.00 | 190.79 | 31.80 | 190.79 | l 107037 | | 688727 恒坤新材 | | K 19.99 | 62.06 | 10.34 | 62.06 | - 209984 | | 688019 安集科技 | | K 18. ...

Core Insights - The report from Jinyuan Securities highlights the exponential growth in costs associated with advanced processes in the semiconductor industry, particularly noting that the design cost of a 2nm chip is approximately $725 million, which is 25 times that of a 65nm chip [1][2] - Capital expenditures (CapEx) for building semiconductor manufacturing facilities also reflect this trend, with the investment required for a 5nm chip factory being five times that of a 20nm factory [1][2] Advanced Packaging Trends - The shift towards advanced packaging is driven by the combination of chiplets and high-end advanced packaging, which allows for mixed processes, reduced time to market, reusability, and improved yield [2] - Chiplets can utilize different processes based on demand, such as using 3nm technology for CPUs while employing mature processes for I/O or analog circuits, thus shortening R&D cycles and design costs [2] - The performance per watt per dollar (Perf/Watt/Dollar) indicates that large chips combined with 3D stacking are more suitable for medium and small systems, while complex systems benefit from the "small die with better yield" approach [2] AI Chip Performance - In terms of raw computational performance, AI-specific chips (ASICs) are weaker than AI GPUs, and even large language models like GPT-4 cannot run on a single chip [3] - To match the performance of AI GPUs, ASICs require larger clusters of dedicated chips, and advanced packaging through chiplets and heterogeneous integration is key to maximizing performance while controlling costs [3] Technological Evolution in Advanced Packaging - The core of technological evolution in advanced packaging is the continuous increase in interconnect I/O count and bandwidth density, transitioning from high-density electronic interconnects to incorporating optical interconnects [4] - The second generation of packaging aims to support higher interconnect I/O demands in the AI era, addressing bandwidth and power consumption bottlenecks [4] 2.5D Packaging Technology - Silicon bridge packaging technology serves as a 2.5D solution, integrating one or more silicon bridges within a specific packaging substrate to ensure interconnectivity between multiple chips [5] - The main factors limiting 2.5D interconnect density include solder bridging risks, intermetallic compounds, and underfill process challenges [5] - Direct bonding and hybrid bonding techniques are crucial for enhancing interconnect density by eliminating solder layers and achieving closer interconnect spacing [5] Advanced Packaging Market Outlook - The advanced packaging market in China is projected to reach approximately 96.7 billion yuan in 2024, accounting for 30.95% of the global market, with expectations to grow to 188.8 billion yuan by 2029, reflecting a compound annual growth rate (CAGR) of 14.30% [7] - By 2029, China's advanced packaging and testing market is anticipated to represent 36% of the global market size [7] - The unit packaging cost is higher due to the complexity of processes and the use of silicon interposers and embedded silicon bridge technology [7] Related Companies - Equipment manufacturers include Tuojing Technology (688072.SH), Zhongwei Company (688012.SH), Shengmei Shanghai (688082.SH), Guangli Technology (300480.SZ), Beifang Huachuang (002371.SZ), and Zhongke Feimiao (688361.SH) [7] - Material suppliers include Dinglong Co., Ltd. (300054.SZ), Anji Technology (688019.SH), and Feikai Materials (300398.SZ) [7] - OSAT companies include Shenghe Jingwei (unlisted), Changdian Technology (600584.SH), and Shenzhen Technology (000021.SZ) [7]

公众号记得加星标⭐️，第一时间看推送不会错过。 台积电受惠AI应用火热，驱动3纳米以下先进制程产能吃紧，传出已和客户沟通，将从2026年至2029 年连续四年调升先进制程报价，2026年新报价将从元旦起生效，法人看好将押注台积电明年首季传统 淡季业绩持续冲锋，有望至少持平本季甚是小幅季增，挑战历年最旺的第1季。 台积电预定2026年元月15日召开实体法说会，外界聚焦2026年首季展望及涨价议题。法人认为，台 积电明年首季可望淡季不淡，主因辉达、超微等大客户新平台陆续推出，加上博通等非苹客户积极扩 大AI应用领域，成为台积电3纳米以下先进制程持续供不应求的关键动能。 报价方面，业界传出，台积电为厘清真实需求，已和客户沟通，将自2026年起至2029年连续四年涨 价。不过，即便台积电向客户提出涨价诉求，客户仍踊跃预定先进制程产能，目前AI军备竞赛仍未见 熄火。 据悉，台积电2026年涨价幅度为个位数百分比，借此反映生产成本垫高与产能供不应求盛况。不过， 个别客户依据采购等级与情况，报价涨幅不一。 研究机构与法人预期，台积电2026年先进制程报价有望看涨3%至10%不等，个别先进制程调升幅度 不一，但皆有望比今年高 ...

新奇美妆公司在 PCB 设备领域前景乐观，新产品如二氧化碳激光钻和先 进封装将在明年全面上量，凭借 PCB 景气度提升收入利润，有望实现第 二成长曲线。 预计明年（2026 年），Robin 大批量生产 Switch 版将新增约 400 万米需求。 同时，如果谷歌 TPU V8 系列采用麻九加修补方案，将新增 800 万米需求。因 此，2026 年的总需求有望从初期 1,000 万米增加到 2000 万米以上。展望 2027 年，如果英伟达 ROPIN ULTRA 全系采用马里的方案，以及谷歌 TPU V8 和 V9 芯片排产达到 500 万颗，对应总需求可能突破 8,000 万米。 Q&A 目前 Q 布产业链的整体趋势如何？需求端有哪些超预期的空间？ 整体来看，Q 布产业链的趋势非常明确，需求端存在较大的超预期空间。明年 （2026 年）AI 服务器领域将迎来大规模部署，例如 Robin 的迭代和 CSP A 级 芯片的部署，这些都将推动 PCB 产业景气度持续提升。特别是今年（2025 年）5 月份以来，市场对店铺板块关注度显著提升，主要基于 2026 年 AI PCB 市场规模及 CCL 价值量占比测算 ...

AI 与汽车浪潮驱动先进封装腾飞 安靠技术（AMKOR） 股票研究 /[Table_Date] 2025.12.18 (AMKR.O) [Table_Industry] 海外信息科技 | | |  | 安靠技术（Amkor）首次覆盖报告 | | [Table_Industry] 海外信息科技 | | --- | --- | --- | --- | --- | --- | | [姓名table_Authors] | 电话 | 邮箱 | 登记编号 | [Table_Invest] | | | 秦和平(分析师) | 0755-23976666 | qinheping@gtht.com | S0880523110003 | 评级： | 增持 | | 李潇(分析师) | 021-23183060 | lixiao4@gtht.com | S0880525070003 | | | | 龚浩(研究助理) | 021-23183306 | gonghao2@gtht.com | S0880125090016 | [当前价格 Table_CurPrice] (美元)： | 38.87 | 本报告导读： 完备先进封装完整产品谱 ...

的AI工厂将抵消这一影响。半导体设备成AI和回流趋势的"无名英雄"，报告预测，2026年晶圆制造设备(WFE)销售额将实现近两位数同比增长。 美银美林最新发布的半导体行业展望显示， 2026年将成为AI基础设施建设的关键中点，全球半导体销售额有望首次突破万亿美元大关，达到1.01万亿 美元，同比增长29%。 美银分析师Vivek Arya等人最新发布的研究报告指出， 尽管AI投资回报和超大规模云服务商现金流面临更严格审视，可能导致股价波动，但更新更快的 大语言模型构建者以及服务企业和政府客户的AI工厂将抵消这一影响。报告预测，2026年晶圆制造设备(WFE)销售额将实现近两位数同比增长。 在先进封装领域，美银注意到这一此前规模较小的市场已增长到足以影响主要半导体设备公司的增长能力。过去一年，先进封装销售额(HBM/逻辑)在 覆盖的半导体设备公司中增长22%，约为整体WFE增长的两倍。 模拟半导体保持谨慎，EDA具备追赶潜力 美银认为，尽管AI投资回报和超大规模云服务商现金流面临更严格审视，可能导致股价波动，但更新更快的大语言模型构建者以及服务企业和政府客户 | CAGR | | | | | | | | | | ...

此外，报告指出，台积电目前的先进封装产能已经全部预定完毕，其中英伟达占到超一半的份额。而台 积电先进封装产能紧张，无法满足行业不断增长的需求，决定将部分订单外包，由日月光和矽品精密等 企业负责分担。(格隆汇) 台积电(TSM.US)盘前跌超2%，报303.12美元。消息面上，台积电公布，11月销售额3436.1亿元新台 币，环比下滑6.5%，同比增长24.5%，仍创历年同期新高；1-11月累计销售额3.47万亿元新台币，同比 增长32.8%。 ...

Core Viewpoint - The semiconductor equipment sector is experiencing a high growth cycle driven by domestic controllability policies and AI technology, with a year-to-date index increase of 57.28% [1] Investment Framework - The investment framework is divided into three levels: industry prosperity cycle (40%-50% weight), company fundamentals (30%-40% weight), and valuation level [2][3] - The semiconductor equipment sector has completed its initial breakthrough and is entering a high growth phase, making it an ideal investment opportunity [2] Semiconductor Equipment Sector Outlook - The semiconductor equipment sector is in the early to mid-stage of a high growth cycle, supported by domestic policies and increasing demand from wafer fabs for mid-to-high-end equipment [4] - The dual drivers of domestic controllability policies and AI applications are expected to sustain the growth of the semiconductor equipment sector over the next three years [5] Investment Opportunities - The increase in domestic production rates and AI-driven demand are seen as key sources of excess returns, with companies successfully positioned in the AI supply chain expected to have significant growth potential [6] - The advanced packaging sector is also viewed positively, as it becomes crucial for enhancing chip performance amid the slowdown of Moore's Law [5][6] Market Dynamics - The storage chip sector is anticipated to experience a high growth cycle due to expansion, with expectations for acceleration in mid to late 2026 [6] - Caution is advised for stocks heavily reliant on price rebounds, particularly in the DRAM market, where prices have more than doubled since last year [7]

Investment Rating - The investment rating for the company is "Buy" and is maintained [7] Core Insights - The company reported a total revenue of 286.69 billion yuan for the first three quarters of 2025, representing a year-on-year increase of 14.78%. However, the net profit attributable to shareholders decreased by 11.39% to 9.54 billion yuan. In Q3 2025, the company achieved a revenue of 100.64 billion yuan, up 6.03% year-on-year, with a net profit of 4.83 billion yuan, reflecting a year-on-year increase of 5.66% and a significant quarter-on-quarter increase of 80.60% [2][5][11] Summary by Sections Financial Performance - For the first three quarters of 2025, the company achieved a revenue of 286.69 billion yuan, a 14.78% increase year-on-year, while the net profit attributable to shareholders was 9.54 billion yuan, down 11.39%. In Q3 2025, the revenue reached a record high of 100.64 billion yuan, with a year-on-year growth of 6.03% and a quarter-on-quarter growth of 8.56%. The gross margin for Q3 2025 was 14.25%, up 2.02 percentage points year-on-year, leading to a net margin increase of 1.94 percentage points to 4.80% [2][11] Business Growth and Structure Optimization - The company has seen significant growth in high-growth sectors, with revenues from computing electronics, automotive electronics, and industrial and medical electronics increasing by 69.5%, 31.3%, and 40.7% year-on-year, respectively. The automotive electronics segment has successfully integrated power module packaging and automotive-grade MCU technology, while the computing electronics sector has expanded into the enterprise SSD market through the acquisition of Shengdie Semiconductor [11] R&D and Future Growth - The company has increased its R&D investment, with expenses reaching 15.4 billion yuan in the first three quarters of 2025, a 24.7% increase year-on-year. Key areas of focus include glass substrates, optoelectronic co-packaging, and high-density SiP technologies. The production capacity for automotive electronics and wafer-level packaging projects is gradually coming online, enhancing the company's delivery capabilities in high-value markets [11]