Core Viewpoint - The company is enhancing its advanced packaging capabilities to meet the demand for high-end domestic chips, particularly in the third-generation semiconductor packaging sector [2] Group 1: Company Developments - The company is leveraging its full-process packaging capabilities for 4-12 inch wafers to accelerate the validation of advanced technologies such as SIP, flip chip, and ultra-thin packaging [2] - The company is focusing on deepening its involvement in the third-generation semiconductor packaging to align with the needs of domestic high-end chips [2] Group 2: Market Expansion - With the release of capacity from the company's fundraising projects, it aims to enhance the supply of advanced packaging [2] - The company is striving to expand into core areas of domestic substitution, including automotive electronics and industrial control [2]