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超高纯材料助“中国芯”破局,同创普润启动IPO!
是说芯语· 2025-12-15 04:18
Core Viewpoint - The competition in the 3nm chip manufacturing process is intensifying, making ultra-pure metal materials a strategic focus in the global semiconductor industry. The IPO of Shanghai semiconductor ultra-pure metal material supplier Tongchuang Purun is a significant step in breaking the overseas monopoly in semiconductor materials in China [1]. Group 1: Company Overview - Tongchuang Purun, established just over four years ago, has received over 2 billion yuan in financing and is on a mission to break the overseas monopoly in semiconductor materials [1]. - The controlling shareholder of Tongchuang Purun is Yao Lijun, founder and CTO of Jiangfeng Electronics, who holds 17.61% of the company's shares. He has a history of breaking through foreign technology barriers in the semiconductor materials sector [2][3]. Group 2: Industry Context - The purity of materials directly affects chip performance, with ultra-pure metal materials needing to reach purity levels of 99.9995% (5N5) or even 99.9999% (6N) for advanced process chips. The impurity content for 3nm process ultra-pure manganese materials must be controlled at the level of parts per ten million [3]. - Historically, the technology for producing these core materials has been dominated by companies in the US and Japan, with over 80% of the high-end market in China relying on imports, which has been a bottleneck for the domestic chip industry [3]. Group 3: Financial and Market Insights - In August, Tongchuang Purun secured over 1 billion yuan in financing, followed by another over 1 billion yuan in Pre-IPO financing, indicating strong confidence from industry capital in the ultra-pure metal materials sector [5]. - The global semiconductor sputtering target market is expected to reach 25.11 billion yuan by 2027, with the market for ultra-pure metal materials also expanding. The demand for chips is increasing due to the growth of AI and electric vehicles, providing a broad platform for domestic companies [5]. Group 4: Strategic Positioning - Jiangfeng Electronics has achieved industrialization of sputtering targets from 6 inches to 18 inches, with advanced targets already used in 7nm chip manufacturing. Tongchuang Purun focuses on the R&D and production of ultra-pure metal raw materials, creating a self-sufficient industrial chain from raw materials to target manufacturing [6].