Group 1 - The company, Youyan Powder Materials (688456.SH), has indicated that its heat dissipation copper powder can be used in chip stacking and semiconductor packaging fields [1] - The company's tin solder powder is not directly used in chip manufacturing but is utilized for soldering interconnections in chips and PCBs after being made into solder paste [1] - The company's tin alloy microsphere products can be applied in advanced semiconductor packaging processes such as 3D packaging, and CCGA solder columns are suitable for high-reliability chip packaging [1] - The company currently has relevant orders for these products [1]