Core Viewpoint - The company has stated that its monthly supply of thermal copper powder is currently between 4 to 5 tons, indicating that there will not be a significant impact on its performance for the second half of the year. Additionally, the price of thermal copper powder is expected to be influenced by the rising copper prices [1]. Group 1 - The company currently supplies 4 to 5 tons of thermal copper powder per month [1] - There will not be a major impact on the company's performance for the second half of the year [1] - The price of thermal copper powder is affected by the increase in copper prices [1]

Core Viewpoint - The company has confirmed that its monthly supply of thermal copper powder is currently between 4 to 5 tons, and it does not expect a significant impact on its performance in the second half of the year [1] Group 1 - The company reported a monthly average supply of thermal copper powder at 4 to 5 tons [1] - The company indicated that the price of thermal copper powder will be influenced by the rising copper prices [1]

Core Viewpoint - The company has confirmed that its thermal copper powder is utilized in Huawei's Ascend 910 chip series [1] Group 1 - An investor inquired whether the company's thermal copper powder is applied in Huawei's Ascend chips [1] - The company responded affirmatively, stating that its thermal copper powder is indeed used in the Ascend 910 chip [1]

Group 1 - The company Youyan Powder Materials (688456.SH) has announced that its heat dissipation copper powder is being used in the Ascend series 910 chips [1]

Core Viewpoint - The company has developed a new heat dissipation copper powder that is not suitable for use as a 3D printing material and currently has no export plans [1] Company Summary - The newly developed copper powder has complete ownership rights by the company [1]

Core Viewpoint - The newly developed heat dissipation copper powder by the company cannot be used as a 3D printing material, and there are currently no export plans [1] Company Summary - The company, Youyan Powder Materials (688456.SH), has announced that its newly developed heat dissipation copper powder is not suitable for 3D printing applications [1] - The company has indicated that there are no plans for exporting this new product at the moment [1]

Group 1 - The company has successfully developed a new thermal copper powder that is used in VC boards, GPUs, and data centers, marking an industry first [2] - The VC board is experiencing explosive growth in the liquid cooling sector, indicating a significant market opportunity [2] - The company confirmed that its current production capacity of thermal copper powder is sufficient to meet the surging demand in the industry [2]

Core Viewpoint - The company has successfully developed and applied its heat dissipation copper powder in certain GPU cooling devices, with positive feedback on its performance in various applications, including AI computing servers and telecommunications equipment [2]. Group 1: Product Development and Application - The company's heat dissipation copper powder is a product developed in collaboration with a leading end-user and has been successfully applied in some GPU cooling devices [2]. - The copper powder is categorized under air cooling, while liquid cooling is based on thermal conduction, indicating that both methods can work synergistically in certain applications [2]. - The copper powder has been partially applied in AI computing servers, base stations, large routers, and switches, with good feedback on its application performance so far [2]. Group 2: Market Potential and Future Outlook - The potential for large-scale application of the copper powder will depend on whether downstream users will promote its use in more application scenarios [2].

Core Viewpoint - The company has successfully applied its thermal copper powder and certain copper materials in AI computing servers, indicating a stable shipment volume and potential for profit growth due to increasing demand in the AI sector [1] Group 1: Product Innovation - The new thermal copper powder is produced using a chemical method, featuring a gradient pore structure, developed specific surface area, and low bulk density [1] - The performance of the new thermal copper powder improves heat dissipation efficiency by 10%-20% compared to traditional atomized copper powder, with a thermal end benefit of 3-5℃ [1] Group 2: Market Demand - The growing popularity of AI applications, such as deepseek, is driving higher requirements for hardware cooling and speed, which positions the company's new thermal copper powder for expanded sales [1] - The company’s innovative products are expected to create a new profit growth point as demand in the AI sector increases [1]

Core Viewpoint - The company has successfully applied its thermal copper powder and certain copper materials in AI computing servers, indicating a stable shipment volume and potential for growth in sales and profits due to increasing demand in the AI sector [1] Company Summary - The new thermal copper powder is produced using a chemical method, featuring a gradient pore structure, developed specific surface area, and low bulk density [1] - Performance improvements in thermal efficiency range from 10% to 20% compared to traditional atomized copper powder, with thermal end benefits of 3 to 5 degrees Celsius [1] - The innovative product is a first in the industry, positioning the company favorably as AI applications like DeepSeek become more prevalent [1] Industry Summary - The growing demand for hardware cooling and acceleration in AI applications is expected to drive further sales expansion for the company's new thermal copper powder [1]