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公司问答丨有研粉材:公司散热铜粉已用于昇腾系列910芯片
Ge Long Hui· 2025-09-28 08:08
Core Viewpoint - The company has confirmed that its thermal copper powder is utilized in Huawei's Ascend 910 chip series [1] Group 1 - An investor inquired whether the company's thermal copper powder is applied in Huawei's Ascend chips [1] - The company responded affirmatively, stating that its thermal copper powder is indeed used in the Ascend 910 chip [1]
有研粉材(688456.SH):散热铜粉已用于昇腾系列910芯片
Ge Long Hui· 2025-09-26 07:44
Group 1 - The company Youyan Powder Materials (688456.SH) has announced that its heat dissipation copper powder is being used in the Ascend series 910 chips [1]
有研粉材:新研发的散热铜粉不能作为3D打印材料使用
Core Viewpoint - The company has developed a new heat dissipation copper powder that is not suitable for use as a 3D printing material and currently has no export plans [1] Company Summary - The newly developed copper powder has complete ownership rights by the company [1]
有研粉材(688456.SH):新研发的散热铜粉不能作为3D打印材料使用
Ge Long Hui· 2025-09-04 08:48
Core Viewpoint - The newly developed heat dissipation copper powder by the company cannot be used as a 3D printing material, and there are currently no export plans [1] Company Summary - The company, Youyan Powder Materials (688456.SH), has announced that its newly developed heat dissipation copper powder is not suitable for 3D printing applications [1] - The company has indicated that there are no plans for exporting this new product at the moment [1]
有研粉材:公司新研发的散热铜粉主要用于风冷散热模块中的VC均热板、热管,目前产能充足
Mei Ri Jing Ji Xin Wen· 2025-08-29 10:23
Group 1 - The company has successfully developed a new thermal copper powder that is used in VC boards, GPUs, and data centers, marking an industry first [2] - The VC board is experiencing explosive growth in the liquid cooling sector, indicating a significant market opportunity [2] - The company confirmed that its current production capacity of thermal copper powder is sufficient to meet the surging demand in the industry [2]
有研粉材:公司的散热铜粉是与某头部终端用户合作开发的产品,现已成功应用于部分GPU散热器件
Mei Ri Jing Ji Xin Wen· 2025-08-01 10:11
每经AI快讯,有投资者在投资者互动平台提问:请问公司的散热铜粉是否进入阿里巴巴、腾讯等国内 大厂算力服务器的供应链,铜粉散热和液冷散热的区别是什么?两者是否是相互协同关系,目前国内上 的服务器采用铜粉散热的多吗,公司的散热铜粉实际应用反响如何,是否有希望大规模应用? 有研粉材(688456.SH)8月1日在投资者互动平台表示,公司的散热铜粉是公司与某头部终端用户合作 开发的产品,现已成功应用于部分GPU散热器件,但具体下游应用客户的信息公司不直接掌握。公司的 铜粉散热属于风冷散热的范畴,液冷散热属于热传导,风冷和液冷可以在某些应用上协同作用。公司的 散热铜粉据了解目前已部分应用于AI算力服务器、基站、大型路由器、交换机等场景,应用效果截至 目前反馈良好,是否有机会大规模应用要看下游是否会将此款铜粉在更多应用场景中推广。 (文章来源:每日经济新闻) ...
有研粉材:散热铜粉和部分铜粉材料已成功应用于AI算力服务器
Ge Long Hui· 2025-07-31 08:58
Core Viewpoint - The company has successfully applied its thermal copper powder and certain copper materials in AI computing servers, indicating a stable shipment volume and potential for profit growth due to increasing demand in the AI sector [1] Group 1: Product Innovation - The new thermal copper powder is produced using a chemical method, featuring a gradient pore structure, developed specific surface area, and low bulk density [1] - The performance of the new thermal copper powder improves heat dissipation efficiency by 10%-20% compared to traditional atomized copper powder, with a thermal end benefit of 3-5℃ [1] Group 2: Market Demand - The growing popularity of AI applications, such as deepseek, is driving higher requirements for hardware cooling and speed, which positions the company's new thermal copper powder for expanded sales [1] - The company’s innovative products are expected to create a new profit growth point as demand in the AI sector increases [1]
有研粉材(688456.SH):散热铜粉和部分铜粉材料已成功应用于AI算力服务器
Ge Long Hui· 2025-07-31 08:28
格隆汇7月31日丨有研粉材(688456.SH)在互动平台表示,公司的散热铜粉和部分铜粉材料已成功应用于 AI算力服务器,目前出货量稳定,新型导热铜粉使用化学法生产,具有梯度孔隙结构、比表面积发 达、松装密度低等特点,在散热效率方面较传统雾化铜粉,性能提升10%-20%,热端收益3-5℃,属于 行业内首创。随着deepseek等AI应用的普及,对硬件的散热及提速要求越来越高,公司新型导热铜粉有 望进一步扩大销售规模,形成新的利润增长点。 ...
有研粉材(688456.SH):散热铜粉可用于芯片堆叠和半导体封装领域
Ge Long Hui· 2025-07-31 08:28
Group 1 - The company, Youyan Powder Materials (688456.SH), has indicated that its heat dissipation copper powder can be used in chip stacking and semiconductor packaging fields [1] - The company's tin solder powder is not directly used in chip manufacturing but is utilized for soldering interconnections in chips and PCBs after being made into solder paste [1] - The company's tin alloy microsphere products can be applied in advanced semiconductor packaging processes such as 3D packaging, and CCGA solder columns are suitable for high-reliability chip packaging [1] - The company currently has relevant orders for these products [1]