Group 1 - The company, Hengkun New Materials, announced its initial public offering (IPO) on December 12, raising a total of 1.01 billion yuan, with a net amount of 892 million yuan after expenses [1][3] - The company issued 67,397,940 shares at a price of 14.99 yuan per share [1][3] - Due to the actual net fundraising being lower than the amount disclosed in the prospectus for investment projects, the company decided to adjust the investment amounts for its projects [1][3] Group 2 - The funding for the "Integrated Circuit Precursor Phase II Project" remains unchanged, while the investment for the "Advanced Materials for Integrated Circuits Project" has been adjusted to 492 million yuan, totaling 892 million yuan for both projects [1][3] - The shortfall in funding will be addressed by the company using its own or self-raised funds [1][3] - The adjustment has been approved by the supervisory board, and the sponsor has no objections [1][3]

恒坤新材公告称，公司首次公开发行 6739.7940 万股，每股发行价 14.99 元，募集资金总额 10.10 亿 元，净额 8.92 亿元。鉴于实际募资净额低于招股书披露的募投项目拟投入金额，公司拟对募投项目拟 投入金额进行调整，"集成电路前驱体二期项目"不变，"集成电路用先进材料项目"调至 4.92 亿元，合 计调至 8.92 亿元，不足部分由公司以自有或自筹资金解决。该调整已通过董事会和监事会审议，保荐 人无异议。 ...

Core Viewpoint - Hengkun New Materials (688727.SH) experienced a significant decline in stock price, closing at 51.54 yuan, with a drop of 11.47% on November 21, 2025 [1] Group 1: IPO Details - Hengkun New Materials was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on November 18, 2025, with an initial public offering (IPO) of 67,397,940 shares at a price of 14.99 yuan per share [1] - The total amount raised from the IPO was 1,010,295,120.60 yuan, with a net amount of 891,734,601.30 yuan after expenses [1] - The final net amount raised was 115 million yuan less than the original plan [1] Group 2: Fund Allocation - The company plans to use the raised funds for the second phase of the integrated circuit precursor project and for advanced materials for integrated circuits, with a total planned fundraising of 1,006.695 million yuan [1] Group 3: Underwriting and Fees - The total issuance expenses amounted to 118.5605 million yuan, with underwriting and sponsorship fees accounting for 82.3721 million yuan [1]

Core Points - The Shanghai Stock Exchange's Listing Review Committee is scheduled to hold its 32nd meeting on August 29, 2025, to review the listing application of Xiamen Hengkang New Materials Technology Co., Ltd. (referred to as "Hengkang New Materials") [1] - Hengkang New Materials plans to raise funds amounting to 1,006.695 million yuan, which will be allocated to the second phase of the integrated circuit precursor project and the advanced materials project for integrated circuits [1] - The sponsor (lead underwriter) for Hengkang New Materials is CITIC Securities Co., Ltd., with representatives Wu Jianhang and Liu Shaoqian [1]