【12月12日恒坤新材首发募资10.10亿，调整募投项目金额】12月12日，恒坤新材发布公告，公司首次 公开发行6739.7940万股，每股发行价14.99元，募集资金总额达10.10亿元，净额为8.92亿元。因实际募 资净额低于招股书披露的募投项目拟投入金额，公司决定调整募投项目拟投入金额。"集成电路前驱体 二期项目"金额不变，"集成电路用先进材料项目"调至4.92亿元，合计调至8.92亿元，不足部分由公司用 自有或自筹资金解决。此次调整已通过监事会审议，保荐人也无异议。 和讯财经 和而不同 迅达天下 扫码查看原文 本文由 AI算法生成，仅作参考，不涉投资建议，使用风险自担 和讯猎报 12.12 20:21:15 周五 恒坤新材:首发募资10.1亿 募投项目 金额调至8.92亿 【12月12日恒坤新材首发募资10.10亿,调整募投 项目金额】 12月12日,恒坤新材发布公告,公司首 次公开发行6739.7940万股,每股发行价14.99元, 募集资金总额达10.10亿元,净额为8.92亿元。因实 际募资净额低于招股书披露的募投项目拟投入金 额,公司决定调整募投项目拟投入金额。"集成电 路前驱体二期项目"金额 ...

恒坤新材公告称，公司首次公开发行 6739.7940 万股，每股发行价 14.99 元，募集资金总额 10.10 亿 元，净额 8.92 亿元。鉴于实际募资净额低于招股书披露的募投项目拟投入金额，公司拟对募投项目拟 投入金额进行调整，"集成电路前驱体二期项目"不变，"集成电路用先进材料项目"调至 4.92 亿元，合 计调至 8.92 亿元，不足部分由公司以自有或自筹资金解决。该调整已通过董事会和监事会审议，保荐 人无异议。 ...

Core Viewpoint - Hengkun New Materials (688727.SH) experienced a significant decline in stock price, closing at 51.54 yuan, with a drop of 11.47% on November 21, 2025 [1] Group 1: IPO Details - Hengkun New Materials was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on November 18, 2025, with an initial public offering (IPO) of 67,397,940 shares at a price of 14.99 yuan per share [1] - The total amount raised from the IPO was 1,010,295,120.60 yuan, with a net amount of 891,734,601.30 yuan after expenses [1] - The final net amount raised was 115 million yuan less than the original plan [1] Group 2: Fund Allocation - The company plans to use the raised funds for the second phase of the integrated circuit precursor project and for advanced materials for integrated circuits, with a total planned fundraising of 1,006.695 million yuan [1] Group 3: Underwriting and Fees - The total issuance expenses amounted to 118.5605 million yuan, with underwriting and sponsorship fees accounting for 82.3721 million yuan [1]

Core Points - The Shanghai Stock Exchange's Listing Review Committee is scheduled to hold its 32nd meeting on August 29, 2025, to review the listing application of Xiamen Hengkang New Materials Technology Co., Ltd. (referred to as "Hengkang New Materials") [1] - Hengkang New Materials plans to raise funds amounting to 1,006.695 million yuan, which will be allocated to the second phase of the integrated circuit precursor project and the advanced materials project for integrated circuits [1] - The sponsor (lead underwriter) for Hengkang New Materials is CITIC Securities Co., Ltd., with representatives Wu Jianhang and Liu Shaoqian [1]