Core Insights - The company has developed a new CCD six-axis independent drilling machine with 3D back-drilling capabilities, which has been certified by end customers and has received bulk orders from several leading high-multilayer board enterprises [1] - The high-power CO₂ laser drilling machine developed by the company supports high-quality processing of large apertures and cross-layer blind holes, addressing the processing needs for high-multilayer HDI boards [1] - The new laser processing solution overcomes traditional CO₂ laser thermal effects, meeting the processing requirements for micro-holes and high-precision shapes for AI smartphones and 800G+ optical module substrates, and has received formal orders from clients [1]