Core Viewpoint - The 2025 Heterogeneous Integration Frontier Forum will be held in Ningbo, focusing on the challenges and breakthroughs in heterogeneous integration technology for chip applications, promoting industry collaboration and innovation [2][3][33]. Group 1: Event Details - The forum will take place from November 18-19, 2025, at the Pan Pacific Hotel in Ningbo, organized by Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][33]. - The event aims to gather experts from academic institutions, industry groups, and investment institutions to discuss the current state and future trends of advanced packaging technology [3][33]. Group 2: Participating Companies - Notable participants include Beijing Vikaitech, All-Semi Micro Electronics, Oxford Instruments, and several others, showcasing their core products and unique technologies at the forum [3][11][12][16][20]. - The forum will feature a variety of exhibitors, including companies specializing in semiconductor equipment, advanced packaging, and micro-nano fabrication technologies [11][16][22][24]. Group 3: Forum Objectives - The forum aims to facilitate discussions on the integration of material growth, device fabrication, advanced packaging, and reliability assessment, addressing the industry's pressing challenges [5][29]. - It seeks to enhance collaboration among different sectors of the semiconductor industry, including new entrants and established players, to foster innovation and development [3][29]. Group 4: Registration and Participation - Registration for the forum is available, with different ticket types offered, including early bird discounts for those who register before October 31 [34]. - The expected attendance is between 300 to 500 participants, indicating a significant interest in the topics to be discussed [33].