Core Viewpoint - The 2025 Heterogeneous Integration Frontier Forum will be held in Ningbo, focusing on the challenges and breakthroughs in heterogeneous integration technology for chip applications, promoting industry collaboration and innovation [2][3][33]. Group 1: Event Details - The forum will take place from November 18-19, 2025, at the Pan Pacific Hotel in Ningbo, organized by Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][33]. - The event aims to gather experts from academic institutions, industry groups, and investment institutions to discuss the current state and future trends of advanced packaging technology [3][33]. Group 2: Participating Companies - Notable participants include Beijing Vikaitech, All-Semi Micro Electronics, Oxford Instruments, and several others, showcasing their core products and unique technologies at the forum [3][11][12][16][20]. - The forum will feature a variety of exhibitors, including companies specializing in semiconductor equipment, advanced packaging, and micro-nano fabrication technologies [11][16][22][24]. Group 3: Forum Objectives - The forum aims to facilitate discussions on the integration of material growth, device fabrication, advanced packaging, and reliability assessment, addressing the industry's pressing challenges [5][29]. - It seeks to enhance collaboration among different sectors of the semiconductor industry, including new entrants and established players, to foster innovation and development [3][29]. Group 4: Registration and Participation - Registration for the forum is available, with different ticket types offered, including early bird discounts for those who register before October 31 [34]. - The expected attendance is between 300 to 500 participants, indicating a significant interest in the topics to be discussed [33].

Core Insights - The article emphasizes the growing activity in the optical chip market, driven by the booming demand for artificial intelligence and data centers, highlighting the importance of optical chips in heterogeneous integration technology [2] - TrendBank is organizing significant conferences in November 2025 to focus on advanced packaging technologies and the development of the optical chip industry [4][5] Group 1: Market Overview - The optical chip sector is experiencing increased market activity, with a focus on new materials, processes, and structures for applications ranging from optical communication to cutting-edge optical quantum computing and storage [2] - The article provides a list of global suppliers of optical chip substrate materials, indicating a competitive landscape with various companies involved in the supply chain [3][4] Group 2: Upcoming Events - TrendBank is set to host the 2025 Heterogeneous Integration Annual Conference from November 17-19 in Ningbo, aimed at fostering collaboration and resource pooling in the advanced electronic information industry [4] - The conference will cover core technologies such as multi-material heterogeneous integration and optoelectronic co-packaging, inviting experts from both industry and academia for in-depth discussions [5]

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 珠海硅芯科技有限公司 诚邀您莅临于2025年4月29日在浙江 · 宁波 （ 甬江实验室） 举办的 2025势银异质异构集成封装产业大会 公司介绍 珠海硅芯科技有限公司主要从事新一代2.5D/3D堆叠芯片EDA软件设计的研发及产业化。创始人团队从2008年开始研究2.5D/3D芯片设计方法，是世界最 早期研究设计方法的研究团队之一，并在堆叠芯片EDA后端布局、布线、可测试、可靠性等方面均有世界领先成果。 公司自主研发3Sheng Integration Platform，分为系统级架构设计、物理实现、Multi-die测试容错、分析仿真、多Chiplet集成验证五大中心，涵盖堆叠 芯片设计所需环节的全流程工具。目前，硅芯科技系列产品已通过先进封装产业验证，完成设计制造闭环，并打造首批客户案例，全方位助力 AI,GPU,CPU, ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 长川科技 董事、副总经理 钟锋浩 已 确认参 加 2025势银异质异构集成封装产业大会 ，并作为嘉宾进行主题为 《 Chiplet异构集成对测试技术 的挑战 》 的演讲。 钟锋浩， 长川科技董事、副总经理，高级工程师，专注集成电路测试装备研究开发近30 年，是集成电路测试装备领域一流资深技术专家，Chiplet测试标准编写组组长，全国集 成电路标准化技术委员会TC599专家成员。目前已申请集成电路测试技术相关专利79 项。 杭州长川科技股份有限公司 成立于2008年4月，是一家专注于集成电路封测装备研发、 生产和销售的高新技术企业，主要产品包括集成电路测试机、分选机、探针台、AOI设备 和自动化检测装备，客户包含了日月光、台积电、华天科技、长电科技、通富微电、矽 力杰等国内外一流集成电路企业。通过17年的技术积累和研发创新， ...