Core Viewpoint - The 2025 Heterogeneous Integration Frontier Forum will be held in Ningbo, focusing on the challenges and breakthroughs in heterogeneous integration technology for chip applications, promoting industry collaboration and innovation [2][3][33]. Group 1: Event Details - The forum will take place from November 18-19, 2025, at the Pan Pacific Hotel in Ningbo, organized by Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][33]. - The event aims to gather experts from academic institutions, industry groups, and investment institutions to discuss the current state and future trends of advanced packaging technology [3][33]. Group 2: Participating Companies - Notable participants include Beijing Vikaitech, All-Semi Micro Electronics, Oxford Instruments, and several others, showcasing their core products and unique technologies at the forum [3][11][12][16][20]. - The forum will feature a variety of exhibitors, including companies specializing in semiconductor equipment, advanced packaging, and micro-nano fabrication technologies [11][16][22][24]. Group 3: Forum Objectives - The forum aims to facilitate discussions on the integration of material growth, device fabrication, advanced packaging, and reliability assessment, addressing the industry's pressing challenges [5][29]. - It seeks to enhance collaboration among different sectors of the semiconductor industry, including new entrants and established players, to foster innovation and development [3][29]. Group 4: Registration and Participation - Registration for the forum is available, with different ticket types offered, including early bird discounts for those who register before October 31 [34]. - The expected attendance is between 300 to 500 participants, indicating a significant interest in the topics to be discussed [33].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][22]. Event Details - The forum will take place from November 17 to 19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang, with an expected attendance of 300 to 500 participants [22]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][22]. Agenda Highlights - The forum will feature keynote speeches, technical presentations, and parallel sessions covering various topics such as micro-nano manufacturing technologies, advanced packaging trends, and the development of optical chips [4][6][10][12]. - Notable speakers include experts from leading institutions and companies, discussing topics like 2.5D/3D advanced packaging, silicon photonic integration, and Micro LED technology [6][10][12][15]. Registration Information - Registration fees are set at RMB 2500 per person, with early bird discounts available for those who register before October 31, 2025 [22]. - Special rates are offered for students, allowing them to attend for RMB 1500 [22]. Participant List - The article lists several companies and their representatives who have registered for the event, including Huawei, Longxin Storage, and various semiconductor technology firms [23][24].