Core Viewpoint - United Microelectronics Corporation (UMC) has signed a technology licensing agreement with imec to acquire the iSiPP300 silicon photonics process, aiming to develop a 12-inch silicon photonics platform for next-generation high-speed connectivity applications [2]. Group 1: Technology Development - The iSiPP300 silicon photonics process is compatible with Co-Packaged Optics (CPO) and addresses the bottlenecks of traditional copper interconnects due to increasing AI data loads [2]. - UMC plans to combine imec's proven 12-inch silicon photonics process technology with its Silicon-On-Insulator (SOI) wafer process to offer a highly scalable Photonic Integrated Circuit (PIC) platform [2]. - UMC is collaborating with multiple new customers to provide photonic chips for optical transceivers, with risk production expected to begin in 2026 and 2027 [2]. Group 2: Market Implications - The partnership with imec is expected to accelerate the development of UMC's 12-inch silicon photonics platform, enhancing the market for silicon photonics solutions and facilitating the introduction of next-generation computing systems [3]. - The iSiPP300 platform features compact and efficient components, including micro-ring modulators and GeSi electro-absorption modulators (EAM), which will contribute to diverse low-loss optical fiber interfaces and 3D packaging modules [3].