Investment Rating - The report rates the communication industry as "Outperform" [4] Core Insights - The communication sector has shown strong performance, with the Shenwan Communication Index rising by 6.27% during the week of December 8-14, 2025, significantly outperforming the broader market [12] - Cignal AI has raised its market size forecast for Optical Circuit Switches (OCS) to at least $2.5 billion by 2029, a 40% increase from previous estimates, driven by the expansion of AI and data center deployments [31] - UMC has obtained technology licensing for 300mm silicon photonics process from imec, which will accelerate the development of silicon photonics technology, addressing the bottlenecks of traditional copper interconnects [2] Summary by Sections Market Review - The communication sector ranked first among 31 Shenwan primary industries in terms of growth, with significant contributions from sub-industries such as communication network equipment (up 8.62%) and communication cables (up 8.28%) [15] - Notable stock performances included Dekoli (up 43.66%) and Zhongci Electronics (up 40.65%), while *ST Jinglun saw a decline of 13.99% [19] Industry Dynamics - UMC's licensing agreement with imec for the iSiPP300 silicon photonics process will enhance its capabilities in optical interconnect solutions, crucial for data centers and high-performance computing [24] - Nvidia has been granted permission to export its H200 AI chips to China, which could generate significant revenue despite a 25% revenue share to the U.S. government [28] - Cignal AI's report indicates that OCS technology is evolving from a niche application to a foundational technology for large-scale AI systems, with a growing number of active suppliers and deployment scenarios [31][32] - Broadcom's Q4 financial results showed a record revenue of $64 billion, driven by AI semiconductor sales, with expectations for continued growth in the upcoming quarters [35]

晶圆代工业者联电昨（8）日宣布与比利时微电子研究中心（imec）签署技术授权协议，取得imec iSiPP300硅光子制程，该制程具备共封装光学（CPO）相容性，藉由此次授权合作，联电将推出12 吋硅光子平台，瞄准下世代高速连接应用市场。 联电表示，AI数据负载日益增加，传统铜互连面临瓶颈，硅光子技术以光传输数据，成为数据中心、 高效能运算及网路基础设施在超高频宽、低延迟及高能源效率的解决方案。联电将结合imec经验证的 12吋硅光子制程技术、加上联电绝缘层上覆硅（SOI）晶圆制程，为客户提供高度可扩展的光子芯片 （PIC）平台。 联电资深副总经理洪圭钧指出，取得imec最先进的硅光子制程技术授权，将加速联电12吋硅光子平 台的发展进程。联电正与多家新客户合作，预计在此平台上提供用于光收发器的光子芯片，并于2026 及2027年展开风险试产。此外，联电未来系统架构将朝CPO与光学I/O等更高整合度的方向迈进，提 供资料中心内部及跨数据中心需要的高频宽、低能耗且高度可扩展的光互连应用解决方案。 IC-Link by imec副总裁Philippe Absil表示，iSiPP300平台具备精巧且高效能的元件，包括 ...