Core Viewpoint - The article discusses the advancements and challenges in heterogeneous integration technology, particularly in the context of the 2025 Heterogeneous Integration Frontier Forum held in Ningbo, highlighting the importance of collaboration among industry leaders and research institutions to drive innovation in this field [3]. Group 1: Heterogeneous Integration Technology - Advanced chip technologies such as AI, high-speed computing, and 5G/6G are driving the development of multi-chip heterogeneous integration technology, with mixed bonding technology offering advantages like smaller pitch (<2um), higher I/O density (1000X), and lower power consumption [8]. - The 2.5D/3D stacked chip design is a trend, with 2.5D Chiplet design tools becoming mature, emphasizing the need for collaboration across chip design, packaging, and EDA design [12]. - The period from 2026 to 2028 is critical for the acceleration of advanced packaging technology, which will also drive growth in supply chain materials and equipment markets [16]. Group 2: Market Demand and Applications - The magnetic sensor market has a vast application range across industrial control, medical, automotive, and consumer electronics, with annual sales reaching billions of units and a market value of hundreds of billions of dollars [18]. - High-density integrated circuit manufacturing and advanced packaging materials are crucial for the semiconductor industry chain in China, with a strong emphasis on domestic material innovation and industrialization [24]. Group 3: Technical Challenges and Innovations - Key challenges in semiconductor hybrid bonding integration technology include controlling bonding bubbles, improving edge quality, and ensuring uniform bonding energy [31]. - The development of melting/mixed bonding technology is essential for future 3D integration, with optimized chuck designs reducing local stress and improving overlay performance [37]. - Advanced packaging mass production faces difficulties related to surface smoothness, cleanliness, alignment precision, thermal control, efficiency, and yield [39].