Core Viewpoint - The company has made substantial progress in the research and development of 112G high-speed boards, with products certified and entering mass production [1] Group 1: R&D Progress - The company has achieved significant advancements in the R&D of 112G high-speed boards, which have completed certification and are now in the mass import phase [1] - The technology development path of the company is clear, as it is advancing 112G technology while simultaneously laying out and actively researching 224G and other cutting-edge high-speed product technologies [1] Group 2: Focus Areas - The company's R&D investments are primarily focused on high-layer boards, advanced HDI, and IC substrates in high-end fields [1] - The technological achievements have been recognized as "domestically leading" and are being applied in key production bases such as the Zhuhai No. 2 factory [1]

Core Viewpoint - The company is actively delivering high-layer printed circuit boards (PCBs) based on customer demand, with a focus on products ranging from 28 to 40 layers, while 70-layer boards are still in the sample stage [1]. Group 1: Product Development - The high-layer boards are primarily used in communication equipment, servers, and aerospace applications [1]. - The company is advancing the technical development of high-speed products, specifically 112G and 224G [1]. - The technology achievements related to server high-layer PCBs have been recognized as "domestically leading" [1]. Group 2: Production and Application - Relevant research and development outcomes have been implemented in key production bases, such as the Zhuhai No. 2 factory [1]. - The company has disclosed specific technical parameters in its regular reports [1].