智通财经APP获悉，中国银河证券发布研报称，由于适配于高性能计算的硬件供给本身技术难度较高， 目前整体上仍处于供不应求的阶段，因此相对于充分供给下的"泡沫化"程度仍然有限，仍然预留有安全 边际。诚然，能够最大程度消除人们对于"AI泡沫"的担忧仍要来自于AI应用端的重大突破，这一时刻尚 未到来。考虑供不应求的状况，该行仍然维持对硬件端的推荐。 中国银河证券主要观点如下： PCB产能扩张仍然理性 本轮PCB上行周期主要体现为HDI和高多层板出货量的增长，预计2024年至2029年全球高阶HDI PCB市 场和14层以上高多层板的市场规模复合增速将分别达到20.3%、11.6%。高阶HDI和高多层板本身技术壁 垒较高，主要是头部企业在扩产，截止2025年前三季度行业资本开支较2024全年+8.4%，产能扩张对比 需求增长仍然有限。 风险提示 AI应用进展不达预期的风险，国际政治环境不确定性的风险。 当前AI发展阶段与互联网泡沫时期不同 自2022年AI技术开始走入大众，引发了一轮对于AI产业规模空前的基础建设投资，由此也造就了半导 体硬件的一轮景气周期。2026年全球几大云厂商的资本开支预计将超过其合计经营性净现金 ...

PCB 行业 2026 年投资策略：AI 算力依旧是主旋律，把 握产业链技术迭代和供求缺口 20251228 摘要 2026 年 PCB 行业展望乐观，AI 算力仍是主旋律，技术迭代和产业链上 游高阶 HDI、高速材料等环节将提供投资机会。市场规模预计从 2025 年的 845 亿美元增长至 940 亿至 980 亿美元。 AI 算力相关 PCB 市场将在高阶 HDI 和高多层板等环节实现增长，北美 链条中的英伟达体系及其供应链，以及国内华为、升腾等公司的需求增 加，将推动市场扩展。高速材料和电动板技术迭代也值得关注。 CCL 环节具有良好发展前景，高速材料紧缺且持续升级，ASP 显著提升。 国内龙头企业生益科技已导入英伟达供应链，并将在未来几年放量增长。 高速材料涨价带来的业绩弹性也是重要因素。 PCB 设备领域中，钻孔机（包括背钻和激光钻）是核心。大族数控是国 内核心标的，其高端背钻设备今年迎来显著放量，超快激光设备在未来 几年也有望快速增长。 2025 年 PCB 板块行情跌宕起伏，但头部公司业绩超预期推动板块大幅 上涨。展望 2026 年，PCB 行业将继续受益于 AI 相关需求的增长，AI 占 PC ...

12月26日，强达电路发布公告，拟向不特定对象发行可转换公司债券，募集资金总额不超过5.5亿元。 这笔资金将精准投向"南通强达电路科技有限公司年产96万平方米多层板、HDI板项目"。 此次募资是强达电路2024年登陆A股创业板后的关键资本动作，不仅将进一步夯实公司在中高端PCB产 品领域的产能优势，更彰显其锚定AI服务器、光模块、智能驾驶等高景气赛道的发展决心。 作为2024年登陆A股创业板的国家高新技术企业，强达电路2025年业绩持续高增，前三季度实现营收 7.06亿元、归母净利润9632万元，同比分别增长20.74%和20.91%；近三年研发费用累计达1.28亿元，技 术护城河持续筑牢。 此外，长江商报记者注意到，截至2025年三季度末，强达电路总资产攀升至15.29亿元，创历史新高。 二级市场上股价全年震荡走高，年度累计涨幅达13.46%。此次募资将进一步推动公司产能、业绩与市 值的协同增长。 长江商报消息 ●长江商报记者 张璐 PCB行业细分领域的领军企业强达电路（301628.SZ）抛出重磅融资计划。 此外，从财务基本面来看，公司当前的财务状况为可转债发行提供了坚实保障。截至2025年三季度末， 强 ...

Core Viewpoint - AI computing power is the core growth engine for the PCB and copper-clad laminate industry, with high-end HDI/multi-layer boards and low-loss copper-clad laminates becoming key competitive factors [1][5]. Group 1: Copper-Clad Laminate (CCL) Manufacturers - The copper-clad laminate is a core substrate for PCBs, accounting for about 30% of PCB costs, with high technical barriers and long certification cycles leading to high industry concentration [1][6]. - Leading global manufacturers include: - Shengyi Technology: Mainland China's leader in copper-clad laminates, with M9 ultra-low loss products certified by NVIDIA, achieving over 90% yield [2]. - Kingboard Laminates: A global leader in scale, covering mid-to-high-end FR4 and low-loss series, with strong overseas delivery capabilities [2]. - Taiwan's Taisol and Panasonic: Key suppliers for NVIDIA, maintaining stable shares in ultra-low loss products [2]. - Domestic second-tier players like Huazheng New Materials and Jin'an Guoji are accelerating high-end breakthroughs, focusing on low-loss series for AI servers and communication equipment [3]. Group 2: PCB Manufacturers - The core competitiveness of PCB manufacturers lies in customer binding depth, high-end product technology, and overseas capacity layout [4]. - Leading North American players include: - Simmtech: A leader in high-end HDI and multi-layer boards, a core supplier for NVIDIA and other major clients [4]. - Unimicron: A benchmark for high-speed communication boards, with strong growth driven by AI and communication sectors [4]. - Domestic players like Shennan Circuits and Pegatron are positioned for long-term benefits from the rise of domestic computing power and breakthroughs in carrier boards [4]. Group 3: Industry Trends and Competitive Logic - Most PCB manufacturers do not produce their own copper-clad laminates due to high technical barriers and customer specifications [6]. - The competitive core dimensions focus on ultra-low loss product capacity, yield, and customer certification, as well as high-end HDI and multi-layer board technology breakthroughs [7]. - Short-term beneficiaries include Simmtech and Shengyi Technology, while mid-term beneficiaries are Shennan Circuits and Huazheng New Materials, with long-term potential seen in advanced packaging and carrier board manufacturers [7][8].

Investment Rating - The report recommends a positive investment outlook for the PCB industry, particularly highlighting the drilling equipment and consumables sectors as key beneficiaries of the ongoing upgrades and miniaturization trends in PCB technology [7]. Core Insights - The demand for drilling equipment and consumables is expected to rise due to the increasing complexity and density of PCBs driven by AI computing power requirements [3][6]. - The transition from traditional copper cable connections to PCB connections in high-density server architectures, such as NVIDIA's Rubin architecture, is anticipated to further boost PCB demand [21][25]. - The report emphasizes that the drilling segment is the most advantageous area within PCB production, with specific recommendations for leading domestic companies in drilling equipment and consumables [7]. Summary by Sections AI Computing Power and PCB Demand - AI servers utilize advanced PCB designs, such as HDI boards, to meet high-density interconnection requirements, with specific architectures like GB200 and GB300 showcasing the need for increased layer counts and miniaturized features [4][13]. - The report notes that the shift to the Rubin architecture will necessitate further PCB innovations, including the introduction of orthogonal backplanes to replace traditional copper connections [19][29]. Beneficial Segments in PCB Production - The drilling equipment sector is highlighted as the most benefited segment, with domestic manufacturers like Dazhu CNC leading the market due to their cost-effective solutions and improved production efficiency [6][57]. - The report identifies the increasing complexity of PCB designs, particularly in high-layer HDI boards, as a driver for enhanced drilling technology and higher demand for specialized drilling consumables [5][34]. Investment Recommendations - The report recommends focusing on leading domestic companies in the drilling equipment sector, specifically Dazhu CNC, and in the drilling consumables sector, particularly Ding Tai High-Tech, while also suggesting to keep an eye on Zhongtung High-Tech [7][76][81].

Core Viewpoint - The company, Zhongfu Circuit (300814), has developed and owns multiple core technologies through independent research and development, focusing on advanced products and materials in the circuit board industry [1] Group 1: Core Technologies - The company has proprietary technologies related to high multilayer boards, thick copper boards, 5G antenna boards, high-frequency and high-speed boards, rigid-flex boards, embedded component boards, and PSIP [1] - These technologies encompass advanced materials, manufacturing processes, electrical parameter design and control, as well as quality control techniques [1]

Group 1 - The company has developed multiple core technologies through independent research and development, including high multilayer boards, thick copper boards, 5G antenna boards, high-frequency and high-speed boards, rigid-flex boards, embedded device boards, and PSIP products [2] - The company emphasizes its advanced materials, manufacturing processes, electrical parameter design and control, and quality control technologies [2] - The company encourages stakeholders to pay attention to future announcements regarding business expansion progress [2]

Core Viewpoint - Shengyi Electronics, a leading PCB manufacturer in China, has announced its first equity refinancing plan since its IPO, aiming to raise up to 2.6 billion yuan for AI-related projects and working capital [1][2] Group 1: Financing Details - The company plans to issue no more than 125 million shares, accounting for 15% of its total share capital, with the issue price set at no less than 80% of the average trading price over the previous 20 trading days [2] - The funds raised will be allocated to three main areas: the construction of an AI computing HDI production base, a smart manufacturing project for high-layer circuit boards, and replenishing working capital and repaying bank loans [5][6] Group 2: Performance Highlights - In 2024, Shengyi Electronics reported a revenue of 4.687 billion yuan, a year-on-year increase of 43.2%, and a net profit turnaround from a loss of 25 million yuan in 2023 to a profit of 332 million yuan [4] - The gross profit margin improved significantly from 10.07% in 2023 to 24.95% in 2024, driven by a higher proportion of high-value-added products, particularly in the AI server PCB business [4] - For the first three quarters of 2025, the company achieved explosive growth with total revenue of 6.829 billion yuan, a year-on-year increase of 114.79%, and a net profit of 1.115 billion yuan, up 497.61% [4] Group 3: Strategic Focus - The company aims to expand its presence in high-value markets such as AI servers and high-end switches, with a significant portion of the raised funds directed towards technological innovation [5] - The AI computing HDI production base project will require an investment of 1 billion yuan, while the smart manufacturing project for high-layer circuit boards will receive 1.1 billion yuan [6] - The existing production capacity is insufficient to meet the rapidly growing market demand, making the success of this financing crucial for the company's profitability [6]

Core Viewpoint - The article discusses the recent equity refinancing plan of Shengyi Electronics Co., Ltd., aiming to raise up to 2.6 billion yuan for various projects, including AI computing HDI production and high-layer circuit boards, while addressing liquidity and debt repayment needs [1][2][11]. Group 1: Company Overview - Shengyi Electronics, established in 1985 and headquartered in Dongguan, Guangdong, specializes in high-precision, high-density printed circuit boards (PCBs) and is a national high-tech enterprise [6]. - The company went public on the Shanghai Stock Exchange's Sci-Tech Innovation Board in February 2021, raising 2.066 billion yuan with an initial share price of 12.42 yuan [6]. Group 2: Financial Performance - In 2024, Shengyi Electronics reported a revenue of 4.687 billion yuan, a year-on-year increase of 43.2%, and a net profit of 332 million yuan, recovering from a loss of 25 million yuan in 2023 [8]. - The gross profit margin improved significantly from 10.07% in 2023 to 24.95% in 2024, driven by a higher proportion of high-value-added products, particularly in AI server PCBs [8]. - For the first three quarters of 2025, the company achieved a total revenue of 6.829 billion yuan, a year-on-year growth of 114.79%, and a net profit of 1.115 billion yuan, marking a 497.61% increase [9]. Group 3: Fundraising and Investment Plans - The planned fundraising of 2.6 billion yuan will be allocated to three main areas: the construction of an AI computing HDI production base, a smart manufacturing project for high-layer circuit boards, and to supplement working capital and repay bank loans [2][11]. - The AI computing HDI production base project will receive 1 billion yuan, accounting for 38.5% of the total funds, with an expected total investment of 2.032 billion yuan and a planned annual production capacity of 167,200 square meters [11]. - The smart manufacturing project for high-layer circuit boards will receive 1.1 billion yuan, representing 42.3% of the total funds, with an expected total investment of 1.937 billion yuan and a planned annual production capacity of 700,000 square meters [11].

Group 1: Company Performance - In the first three quarters of 2025, the company achieved a revenue of 5.593 billion yuan, representing a year-on-year growth of 20.27% [3][5] - The net profit attributable to shareholders for the same period was 314 million yuan, with a year-on-year increase of 19.58% [3][5] - In Q3 2025, the net profit reached 92 million yuan, showing a remarkable growth of 252.87% compared to the previous year [3][5] Group 2: Market Position and Challenges - The company has been listed for 9 years but has not gained significant market recognition, with its market value only about one-third of its initial listing value [2][6] - The company acknowledges that its stock price does not reflect its intrinsic value and growth potential [6][7] - The company is currently ranked 6th among domestic PCB manufacturers and 26th globally [9][12] Group 3: Strategic Initiatives - The management is focused on optimizing product structure, enhancing cost control, and accelerating high-end capacity release to improve profitability [3][7] - The company is actively exploring share buybacks and management shareholdings as part of its market value management strategy [6][10] - A new factory in Thailand is under construction, aimed at optimizing global capacity and serving international customers [12] Group 4: Investor Relations and Feedback - The company has received feedback regarding the disparity between employee compensation and company performance, and it is considering reforms to align incentives with performance [10][11] - Investors have expressed concerns about the impact of rising raw material costs on PCB shipments, to which the company is responding with price adjustments and improved material utilization [3][4]