在显示领域，公司产品主要应用于LCD、OLED和Mini LED等显示面板产品，与京东方、LG集团等全 球领先的显示面板制造商建立了长期稳定的合作关系，并获得全球显示面板行业龙头京东方颁发的"质 胜杯DAS BG质量工具创新应用大赛金奖"。在储存领域，公司产品主要应用于机械硬盘、固态硬盘、 内存条等，与全球机械硬盘制造商龙头希捷、西部数据及全球知名固态硬盘制造商海力士等建立了稳定 的合作关系。 来源：上海证券报·中国证券网 对于上市后的发展规划，公司表示，将进一步加深对HDI板、高频板、厚铜板等产品的工艺技术开发， 并以现有优势领域市场为基础，深挖客户需求，改善工艺技术，不断引进国内外先进的生产和检测设 备，不断提高生产线的自动化水平。 上证报中国证券网讯（记者 荆淮侨）9月26日，国内印制电路板（PCB）行业领军企业超颖电子电路股 份有限公司（以下简称 "超颖电子"）披露招股意向书，正式启动沪市主板招股工作。公司拟发行股票 数量为5250万股，占本次发行后公司股份总数的12.01%。 超颖电子主要从事PCB的研发、生产和销售，通过持续不断的研发创新，公司已拥有多项自主研发的核 心技术，具备生产高端PCB产品 ...

Summary of Key Points from the Conference Call Industry Overview - The conference call focuses on the **PCB (Printed Circuit Board)** industry, particularly the **high-density interconnect (HDI)** and **high multilayer boards** due to their complex designs and high manufacturing difficulty, leading to limited market supply and higher profit margins [1][2][3]. Core Insights and Arguments - **AI Demand Impact**: The demand for AI computing servers is significantly driving the growth of the PCB industry, especially in high-end processes. The primary types of PCBs used include high multilayer boards and high-density interconnect (HDI) boards, which involve complex designs that exceed traditional PCBs [2][3]. - **Manufacturing Complexity**: High-density HDI boards require multiple blind hole processing steps, with each step involving chemical copper deposition, electroplating, and imaging, leading to equipment usage that is over five times that of standard HDI boards [1][4]. - **Exposure Process Challenges**: The exposure process for high-density HDI boards faces challenges in resolution and alignment accuracy, with requirements for exposure machines to achieve resolutions below 40 micrometers due to the finer lines used in AI boards [5][6]. - **Pressing Process Requirements**: The pressing process for high-density HDI boards requires uniform temperature control and the use of thermal oil for heat transfer, with pressing temperatures exceeding 250°C for advanced materials [7][8]. - **Drilling Precision**: The drilling stage is critical, with AI applications requiring blind hole diameters of 60-70 micrometers, necessitating high precision in drilling locations to avoid circuit failures [9][10]. Additional Important Content - **Equipment Configuration**: For a production line capable of 50,000 square meters of high-density HDI per month, specific equipment configurations are required, including approximately 18 exposure machines and 10 pressing machines [17][18]. - **Market Trends**: The PCB industry is experiencing an upward expansion trend, with leading manufacturers actively increasing production capacity to meet the growing demand from AI clients [33][34]. - **Supplier Landscape**: Key suppliers in the exposure segment include Japanese and American brands known for their resolution and stability, while domestic brands are gradually improving but still lag in experience and reliability [22][23]. - **Technological Upgrades**: The transition from materials like M7 to M9 presents new challenges for laser drilling, impacting efficiency and requiring further validation [13][26]. This summary encapsulates the critical aspects of the conference call, highlighting the complexities and advancements within the PCB industry driven by AI demand and technological innovations.

Group 1 - The company showcased its robust performance and innovative achievements in the high-end PCB sector during the investor reception event, with a significant revenue increase [1] - In the first half of 2025, the company achieved operating revenue of 658 million yuan, a year-on-year growth of 27.47%, driven by market expansion and increased shipments in the new energy vehicle PCB product segment [1] - The company has established a flexible production advantage with a focus on "multiple varieties and small batches," covering various PCB types used in high-value sectors such as industrial control, medical, automotive electronics, and aerospace [1] Group 2 - The company completed the Tianjin green factory certification in 2024, promoting low-carbon manufacturing through initiatives like purchasing green electricity and implementing energy-saving modifications [2] - The company has successfully entered the qualified supplier systems of many global leading enterprises, maintaining long-term strategic partnerships with high-quality clients across multiple countries [2] - Looking ahead, the company aims to leverage its technological advantages in the high-end PCB field, optimize product structure, and enhance core competitiveness to create sustained value for investors [2]

Investment Rating - The investment rating for the company is "Accumulate" [5] Core Views - The company reported significant growth in its financial performance, with a 90.31 billion yuan revenue in the first half of 2025, representing an 86% year-on-year increase, and a net profit of 21.43 billion yuan, up 366.89% year-on-year [1][2] - The company is capitalizing on the opportunities presented by artificial intelligence, with a strong performance in the HDI market, which is expected to grow at a compound annual growth rate (CAGR) of 6.4% from 2024 to 2029, while AI-related HDI is projected to grow at a CAGR of 19.1% [2][3] - The company has established a leading position in the high-layer PCB manufacturing sector, with capabilities exceeding 100 layers and significant advancements in HDI technology, which are crucial for AI computing and data center applications [3][4] Financial Performance Summary - In the first half of 2025, the company achieved a revenue of 90.31 billion yuan, with a net profit of 21.43 billion yuan, marking a year-on-year increase of 366.89% [1] - For Q2 2025, the company reported a revenue of 47.19 billion yuan, a 91.51% year-on-year increase, and a net profit of 12.22 billion yuan, reflecting a 390.14% year-on-year growth [1][2] - The company plans to increase its revenue forecasts for 2025-2027, expecting revenues of 203.48 billion yuan, 272.82 billion yuan, and 326.56 billion yuan, with respective year-on-year growth rates of 89.6%, 34.1%, and 19.7% [8][10] Strategic Initiatives - The company is implementing a "China + N" global layout strategy to enhance its supply delivery capabilities, establishing production lines in Thailand and Vietnam to meet overseas demand for high-layer PCBs and advanced HDI [4] - The company has significantly increased its R&D investment, which grew by 78.46% year-on-year, reinforcing its competitive edge in the industry [3]

Investment Rating - The report maintains a "Hold" rating for the company [3][5]. Core Insights - The company's revenue for H1 2025 reached 456 million yuan, representing a year-over-year increase of 17.25%, while net profit attributable to shareholders was 59 million yuan, up 4.87% year-over-year [1][2]. - The growth in the industrial control and communication sectors is driven by the recovery in industrial automation and the demand for computing infrastructure, with projected revenue for 2025 expected to reach 940 million yuan, a 19% increase year-over-year [2][3]. - The company's product structure optimization has led to improved gross margins, with Q2 2025 gross margin increasing by 1.77 percentage points, and expectations for Q3 2025 gross margin to reach 32% [2][3]. Financial Data and Valuation - For 2025, the company is projected to have a revenue of 944 million yuan and a net profit of 128 million yuan, with corresponding P/E ratios of 60x and 48x for 2025 and 2026 respectively [4][3]. - The company's gross margin for H1 2025 was 30.36%, with a net margin of 12.89% [1][2]. - The report forecasts EPS of 1.70 yuan for 2025, with a projected P/E ratio of 60 [4][3].

Core Viewpoint - The company reported significant growth in its financial performance for the first half of 2025, driven by advancements in AI technology and a strong global market demand for high-density interconnect (HDI) products [1][2][3]. Financial Performance - In the first half of 2025, the company achieved operating revenue of 9.031 billion yuan, a year-on-year increase of 86.00%. The net profit attributable to shareholders reached 2.143 billion yuan, up 366.89%, while the net profit after deducting non-recurring items was 2.149 billion yuan, also reflecting a growth of 365.69% [1]. - For the second quarter of 2025, the company reported operating revenue of 4.719 billion yuan, a year-on-year increase of 91.51% and a quarter-on-quarter increase of 9.42%. The net profit attributable to shareholders was 1.222 billion yuan, up 390.14% year-on-year and 32.78% quarter-on-quarter [1]. Market Opportunities - The company is capitalizing on the growing AI market, with the global HDI market expected to grow at a compound annual growth rate (CAGR) of 6.4% from 2024 to 2029. AI server-related HDI is projected to grow at a CAGR of 19.1%, significantly outpacing the overall PCB industry's expected CAGR of 5.2% [2]. - The company has established strategic partnerships with leading global technology firms, enhancing its product offerings in AI computing and data center solutions [2]. Technological Advancements - The company has solidified its position as a leader in the PCB industry by achieving manufacturing capabilities for high-layer boards exceeding 100 layers and being among the first to mass-produce advanced HDI products [3]. - The company increased its R&D investment by 78.46% year-on-year, which is crucial for maintaining its competitive edge in the industry [3]. Global Strategy - The company is implementing a "China + N" global layout strategy to enhance its supply delivery capabilities, establishing production lines in Thailand and Vietnam to meet the overseas demand for high-layer PCBs and advanced HDI products [4]. - This strategy aims to build trust with major clients amid increasing competition and international trade tensions [4]. Profit Forecast - Based on the company's half-year report, revenue forecasts for 2025-2027 have been revised upwards, with expected revenues of 20.348 billion yuan, 27.282 billion yuan, and 32.656 billion yuan, representing year-on-year growth rates of 89.6%, 34.1%, and 19.7% respectively [5]. - The expected earnings per share (EPS) for 2025-2027 are projected to be 5.94 yuan, 8.38 yuan, and 10.15 yuan, reflecting a strong growth trajectory [5].

Investment Rating - The report assigns an "Accumulate" rating for the company, marking its first coverage [1]. Core Insights - The company is enhancing its product structure, with high-end PCB revenue accounting for over 60% of total revenue. Its product range includes high-layer boards, HDI boards, high-frequency boards, thick copper boards, backplanes, and rigid-flex boards, catering to diverse applications in communication, servers, mobile phones, computers, and automotive sectors. The high-end PCB market has high entry barriers due to technology, craftsmanship, capital, and scale [4]. - The company is ramping up production capacity with new factories coming online, which will drive revenue growth. The Shenzhen facility focuses on high-layer PCBs for 5G communication and aerospace, while the Jiangmen plants produce various PCBs for industrial control and automotive applications. The Zhuhai facilities are set to enhance production capabilities significantly by 2025, supporting the company's strategic growth and international market expansion [5]. - The company is committed to R&D, with a 8.35% year-on-year increase in R&D expenditure, amounting to 180 million yuan in the first half of 2025. Key technology developments include advanced packaging substrates and high-precision circuit boards for AI chips and automotive applications [6]. Financial Projections - Revenue projections for 2025, 2026, and 2027 are estimated at 73.1 billion yuan, 83.4 billion yuan, and 92.9 billion yuan, respectively. The net profit attributable to the parent company is forecasted to be 5.7 billion yuan, 6.9 billion yuan, and 7.9 billion yuan for the same years [7]. - The company is expected to see a revenue growth rate of 16.37% in 2025, followed by 14.23% in 2026 and 11.34% in 2027. The net profit growth rates are projected at 120.96% for 2025, 21.43% for 2026, and 13.60% for 2027 [11][14].

Core Insights - The company reported a total revenue of 849.14 million yuan for the first half of 2025, representing a year-on-year increase of 27.84% [3] - However, the net profit attributable to shareholders decreased by 34.13% to 16.78 million yuan, and the net profit after deducting non-recurring gains and losses fell by 30.08% to 13.15 million yuan [3][4] - The company experienced a significant decline in cash flow from operating activities, which turned negative at -35.57 million yuan, a decrease of 147.56% compared to the previous year [3] Financial Performance - Revenue growth was primarily driven by three core business areas: communication and data center business grew approximately 75%, semiconductor packaging applications increased by about 84%, and automotive electronics contributed a stable growth of around 35% [3][4] - Basic earnings per share decreased by 35.71% to 0.09 yuan, while diluted earnings per share fell by 40% to 0.09 yuan [3] - The weighted average return on net assets dropped to 1.19%, down by 0.99% from the previous year [3] Asset and Equity Position - Total assets at the end of the reporting period reached 3.17 billion yuan, reflecting a 6.09% increase from the end of the previous year [3] - The net assets attributable to shareholders increased by 36.44% to 1.63 billion yuan [3] Business Operations and Client Base - The company has established a stable customer base across various sectors, including communication, industrial control, automotive electronics, consumer electronics, and semiconductor packaging, maintaining long-term partnerships with numerous well-known domestic and international enterprises [2] - The company’s products are exported to Europe, Asia, and the Americas, and it focuses on high-reliability, high-performance printed circuit board demands [2] Production Facilities - The company operates four production bases: ShaJing, SongGang, HeShan, and Thailand, each specializing in different production scales and product types [3] - The production bases enable the company to offer a wide range of products, including single/double-layer boards, multi-layer boards, and high-frequency boards, catering to various electronic information product applications [4]

PCB Industry Update Summary Industry Overview - The PCB industry is expected to grow by 5.8% year-on-year in 2024, with a projected market value of $94.6 billion by 2029, reflecting a compound annual growth rate (CAGR) of 5.2% driven by demand from AI systems, servers, storage, and networking equipment [1][3] - The trend towards high-end PCB products is evident, with high-layer count boards (18 layers and above) and HDI boards expected to grow by 40.3% and 18.8% respectively in 2024, with high-layer count boards projected to have a CAGR of 15.7% by 2029 [1][3] Key Trends - Southeast Asia is becoming a new manufacturing hub, with leading PCB companies increasing investments in Vietnam, Thailand, and Indonesia. By 2025, over 25% of the top 100 PCB manufacturers are expected to establish bases in these regions, boosting demand for high-layer count and packaging substrates [1][6] - The COWP (Chip on Wafer Package) technology is enhancing signal integrity and thermal efficiency while reducing costs, thereby increasing the strategic value of China's semiconductor industry [1][10] Manufacturing Process Insights - The PCB manufacturing process includes several key stages: cutting resin materials, inner layer exposure, lamination, drilling (mechanical and laser), electroplating, outer layer exposure, inspection, and packaging. Inner layer exposure accounts for approximately 6% of the process, while mechanical drilling constitutes 15% [7][8] - The drilling process is evolving towards high-precision small-diameter processing, with mechanical drilling currently dominating at 60% of demand, while laser drilling is gaining traction for smaller holes [12] Equipment and Technology Developments - The demand for drilling machines and drill bits is increasing, with the value of single drilling machines nearly doubling. The need for longer and thinner drill bits is creating challenges in manufacturing and maintaining drill bit longevity [13] - The exposure process is transitioning from traditional film exposure to laser direct imaging (LDI), which meets the demands for finer line widths and flexible production [14] - The electroplating process is shifting from traditional direct current to advanced pulse equipment, with over 50% of orders now for pulse devices, leading to a doubling in order value and a 30% increase in prices [15] Market Dynamics - The PCB industry is experiencing a resurgence, with capital expenditures expected to rise due to increased production value and the need for more processing equipment [2] - The detection phase of PCB manufacturing is increasingly incorporating AI automation and machine vision technologies, with companies like Juzhi Technology and Stak leading in the solder paste printing segment [16] Future Outlook - The PCB industry is anticipated to continue its upward trajectory in the coming years, driven by technological advancements and increased production capacity among companies like Jingwang [17]

Group 1: Financial Performance - The company reported an increase in revenue but a decrease in profit for the first half of 2025, indicating a challenging cost control situation compared to peers in the PCB industry [2][3]. - The gross margin was significantly impacted by a 36.57% year-on-year increase in precious metal raw material prices, particularly gold salts, leading to a temporary decline in profitability [3][4]. - The company expects gross margin levels to gradually stabilize as measures to adjust product pricing and improve cost management are implemented [3][4]. Group 2: Market Opportunities and Growth Drivers - Future growth is anticipated to be driven by the ramp-up of high-end products, explosive downstream demand, and the release of production capacity [4][8]. - The company is experiencing strong order demand in sectors such as mobile phones, servers, and communications, with expectations for rapid sales growth in these areas in 2025 [4][8]. - The strategic layout of high-end production capacity in Zhuhai and Thailand is positioned to support the anticipated demand surge [4][8]. Group 3: Competitive Advantages - The company maintains a competitive edge through a deep binding with high-quality customer groups and exceptional responsiveness [4][7]. - A flexible production model focusing on "small batch, multiple varieties" enhances the company's ability to adapt to market changes and meet customer needs [4][7]. - The company aims to deepen its strategy with major domestic and international clients to secure high-value orders and ensure sustainable growth [4][7]. Group 4: Tax and Cost Management - The increase in income tax expenses for the first half of 2025 was primarily due to a temporary reduction in the deductible amount for R&D expenses [3][5]. - The company has implemented a comprehensive dynamic procurement management strategy to address cost pressures and enhance bargaining power, including diversified sourcing and strategic supplier partnerships [6][8]. Group 5: Stock Performance and Investor Relations - The company acknowledges the long-term decline in stock price despite the PCB industry's upward trend and is committed to improving investor communication and performance to enhance market recognition [5][6]. - Measures to optimize business structure, improve profitability, and explore shareholder return strategies, such as dividend policy adjustments, are being considered [5][6].