Core Insights - The core point of the news is that Xinhao Semiconductor has completed its IPO counseling work and is entering the final stage of its IPO process, marking a significant milestone for this leading domestic EDA company [1][4]. Financial Performance - In 2024, Xinhao Semiconductor achieved a revenue of 265 million yuan, more than doubling from 106 million yuan in 2023, with a net profit of 48.1282 million yuan, indicating a turnaround from losses in 2023 [1][4]. - The company's growth is attributed to its applications in 5G communication, smartphones, IoT, artificial intelligence, and data centers, as well as the increasing market recognition of its full-stack EDA solutions [1][4]. Product and Technology - Xinhao Semiconductor's core products span the entire chain from chips, packaging, modules, PCB-level interconnections to complete systems, supporting advanced packaging technologies like Chiplet [1][4]. - The self-developed 3DIC Chiplet advanced packaging simulation platform, Metis, won the CIIF award at the China International Industry Fair in September 2025, symbolizing a breakthrough in domestic EDA technology [1][5]. Market Dynamics - The company has been active in capital operations, having initiated its A-share IPO counseling on February 7, 2025, shortly before a proposed acquisition by Huada Jiutian was announced, which was later terminated due to disagreements on core terms [2][5]. - The domestic EDA market has been dominated by foreign companies, with major players like Synopsys, Cadence, and Siemens holding 74% of the global market share in 2024. The domestic EDA localization rate increased from 6% in 2018 to 11% in 2021 [2][5]. - Xinhao Semiconductor's decision to pursue an independent IPO reflects the competitive dynamics in the EDA market and may allow the company to maintain its unique technological path and proactively adjust its market strategy [2][5].

Core Viewpoint - The 25th China International Industry Fair (CIIF 2025) opened in Shanghai, where Chip and Semiconductor won the CIIF Award for its advanced packaging simulation platform, Metis, marking the first time a domestic EDA company has received this honor [1][4]. Group 1: CIIF Award and Evaluation Process - The CIIF Award is the highest accolade at the China Industry Fair, established by the State Council, aiming to create the "Oscar" of China's industrial sector, with a maximum of 11 awards given [4]. - The evaluation process involves a team of academicians, scholars, and industry experts who assess projects based on core technology, patents, and economic benefits, requiring international leading standards [4]. Group 2: Chiplet Technology and EDA Challenges - With the explosion of AI model training demands, traditional SoC single-chip performance improvements are nearing their limits, and Chiplet advanced packaging is emerging as a core path for continued computational growth [4]. - This architectural innovation presents unprecedented challenges for EDA, necessitating tools to expand from single-chip design to packaging-level collaborative optimization, covering interconnect, power, thermal, and stress analyses [4]. Group 3: Metis Platform and Its Impact - The Metis platform utilizes proprietary high-precision 3D electromagnetic field simulation technology and adaptive mesh partitioning, providing a comprehensive solution for multi-chip heterogeneous integration [6]. - It addresses simulation challenges in signal, power, and multi-physical fields, enhancing design iteration efficiency and is widely adopted by leading international and domestic AI chip design companies [6]. Group 4: Future Outlook and Company Vision - The founder of Chip and Semiconductor expressed encouragement at winning the CIIF Award, highlighting that Chiplet advanced packaging is now the preferred architecture for mainstream AI chips, driving the domestic AI industry towards a trillion-level scale [8]. - The company aims to leverage its EDA platform to collaborate with the domestic Chiplet industry chain, contributing to the secure and stable operation of China's AI infrastructure [8]. Group 5: Company Background - Chip and Semiconductor Technology (Shanghai) Co., Ltd. is a high-tech enterprise focused on EDA software tool development, providing comprehensive EDA solutions across various fields including 5G, AI, and data centers [11]. - The company has received numerous accolades, including the National Science and Technology Progress Award, and has established R&D centers in multiple cities across China [11].

Core Viewpoint - The 25th China International Industry Fair (CIIF2025) opened on September 23, showcasing advancements in industrial technology, with a focus on the semiconductor sector [1] Group 1: Event Highlights - The CIIF2025 is held at the National Exhibition and Convention Center in Shanghai [1] - The CIIF Award, regarded as the highest honor in China's industrial sector, aims to represent cutting-edge products in the integration of industry and information technology [1] Group 2: Company Achievement - Chip and Semiconductor Technology (Shanghai) Co., Ltd. won the CIIF Award for its self-developed 3DIC Chiplet advanced packaging simulation platform, Metis [1] - This company is the first domestic EDA (Electronic Design Automation) vendor to receive this prestigious award [1]