Core Viewpoint - The 25th China International Industry Fair (CIIF 2025) opened in Shanghai, where Chip and Semiconductor won the CIIF Award for its advanced packaging simulation platform, Metis, marking the first time a domestic EDA company has received this honor [1][4]. Group 1: CIIF Award and Evaluation Process - The CIIF Award is the highest accolade at the China Industry Fair, established by the State Council, aiming to create the "Oscar" of China's industrial sector, with a maximum of 11 awards given [4]. - The evaluation process involves a team of academicians, scholars, and industry experts who assess projects based on core technology, patents, and economic benefits, requiring international leading standards [4]. Group 2: Chiplet Technology and EDA Challenges - With the explosion of AI model training demands, traditional SoC single-chip performance improvements are nearing their limits, and Chiplet advanced packaging is emerging as a core path for continued computational growth [4]. - This architectural innovation presents unprecedented challenges for EDA, necessitating tools to expand from single-chip design to packaging-level collaborative optimization, covering interconnect, power, thermal, and stress analyses [4]. Group 3: Metis Platform and Its Impact - The Metis platform utilizes proprietary high-precision 3D electromagnetic field simulation technology and adaptive mesh partitioning, providing a comprehensive solution for multi-chip heterogeneous integration [6]. - It addresses simulation challenges in signal, power, and multi-physical fields, enhancing design iteration efficiency and is widely adopted by leading international and domestic AI chip design companies [6]. Group 4: Future Outlook and Company Vision - The founder of Chip and Semiconductor expressed encouragement at winning the CIIF Award, highlighting that Chiplet advanced packaging is now the preferred architecture for mainstream AI chips, driving the domestic AI industry towards a trillion-level scale [8]. - The company aims to leverage its EDA platform to collaborate with the domestic Chiplet industry chain, contributing to the secure and stable operation of China's AI infrastructure [8]. Group 5: Company Background - Chip and Semiconductor Technology (Shanghai) Co., Ltd. is a high-tech enterprise focused on EDA software tool development, providing comprehensive EDA solutions across various fields including 5G, AI, and data centers [11]. - The company has received numerous accolades, including the National Science and Technology Progress Award, and has established R&D centers in multiple cities across China [11].

人民财讯9月23日电，9月23日，第二十五届中国国际工业博览会(CIIF2025)在国家会展中心(上海)开 幕，芯和半导体科技(上海)股份有限公司凭借其自主研发的3DIC Chiplet先进封装仿真平台Metis，获得 第二十五届中国国际工业博览会CIIF大奖，也成为首家获得该奖项的国产EDA厂商。 据了解，CIIF大奖是中国工博会的最高奖项，目标打造中国工业领域的"奥斯卡金奖"，授奖总数不超过 11项、代表全球工业和信息化融合的前沿水平产品。 ...