高测股份：一期10GW最快未来1~2周落地，二期40GW也在加速推进，公司具备50GW切片机交付能力。 【天风电新】太空光伏：节后将迎订单、Starship V3发射密集催化，看好新一轮主升浪 高测股份：一期10GW最快未来1~2周落地，二期40GW也在加速推进，公司具备50GW切片机交付能力。 目前S客户也在对接中。 高测股份50μm超薄硅片下线 高测股份近期于宜宾基地成功下线50μm超薄硅片，这一突破旨在满足商业航天对电源系统轻量化的核心需求。 【天风电新】太空光伏：节后将迎订单、Starship V3发射密集催化，看好新一轮主升浪 目前S客户也在对接中。 高测股份50μm超薄硅片下线 高测股份近期于宜宾基地成功下线50μm超薄硅片，这一突破旨在满足商业航天对电源系统轻量化的核心需求。 此举的投资价值在于，其技术领先性并非单纯的设备优势，而是通过"设备+耗材+工艺"自研闭环构筑的系统性壁 垒，在光伏主业基本面反转的背景下，为其切入太空光伏这一高价值赛道提供了确定性的阿尔法。 关注：高测股份（超薄切片技术龙头，构筑系统性壁垒），迈为股份/奥特维/帝尔激光（太空光伏设备订单预 期），钧达股份/东方日升（P-H ...

Core Viewpoint - The company has successfully launched a 50μm ultra-thin silicon wafer, achieving leading performance metrics and quality standards, which will enhance the production efficiency and application scope of flexible HJT solar cells [2] Group 1: Product Development - The company has developed the ultra-thin silicon wafer through a collaborative approach involving "equipment + consumables + process" [2] - The ultra-thin silicon wafer has passed rigorous performance testing and comprehensive visual inspections, confirming its high quality [2] Group 2: Market Impact - The breakthrough in ultra-thin silicon wafer technology is expected to reduce silicon material waste, contributing to a decrease in production costs [2] - The thinner silicon wafers will improve flexibility, allowing for broader product applications and opening up new potential use cases [2]

Core Viewpoint - The company is focusing on the niche market of photovoltaic silicon wafer cutting, leveraging its "equipment + consumables + process" technology closed-loop advantage to lead the thin wafer trend in the industry [1] Group 1: Product Development - In 2022, the company launched an 80μm ultra-thin silicon wafer, followed by a 60μm ultra-thin silicon wafer in 2023, and recently introduced a 50μm ultra-thin silicon wafer [1] - The demand for ultra-thin silicon wafers is expected to increase with the application of ultra-thin flexible HJT batteries in space photovoltaics [1] Group 2: Technical Barriers and Industry Position - The cutting technology for ultra-thin silicon wafers has relatively high technical barriers, requiring advanced cutting equipment, diamond wires, and cutting processes [1] - The company has laid out and planned a path for continuous improvement in the yield of ultra-thin silicon wafers, aiding the industry in accelerating the mass production pace of ultra-thin silicon wafers [1]

(上证e互动) 1月28日，高测股份在互动平台表示，由于光伏电池技术路线的选择，公司目前批量供应的硅片主流厚 度仍以100-130μm为主，已具备小批量交付60-80μm硅片能力，并已推出50μm超薄硅片。近期已有多家 电池头部客户及研究机构提出50μm硅片送样测试需求，超薄硅片将随着太空光伏超薄柔性HJT电池的 应用逐步打开需求。公司已布局超薄硅片技术，并规划了持续提升良率的路径，将不断通过技术创新助 力行业加快超薄硅片量产节奏。 ...

Summary of Key Points Company Overview - **Company**: 高测股份 (Gaoce Co., Ltd.) - **Industry**: Photovoltaic and Aerospace Core Insights and Arguments - 高测股份 has successfully launched a 50μm ultra-thin silicon wafer at its Yibin base, addressing the critical need for lightweight power systems in commercial aerospace [1] - The investment value of this breakthrough lies in its technological leadership, which is not merely an equipment advantage but is built on a self-developed closed-loop system integrating "equipment + consumables + processes" [1] - This development provides a significant competitive edge, especially as the fundamentals of the photovoltaic industry are reversing, allowing 高测股份 to enter the high-value space photovoltaic sector with a certain degree of alpha [1] Additional Important Content - The focus on lightweight power systems indicates a strategic alignment with emerging trends in commercial aerospace, highlighting the potential for future growth in this niche market [1] - The mention of a self-developed closed-loop system suggests a strong emphasis on innovation and sustainability, which could attract investors looking for long-term value [1]