Core Viewpoint - Xiaomi's ambitious plan to develop its own 3nm SoC chips may face challenges due to potential restrictions on collaboration with TSMC amid ongoing US-China trade tensions [1][2][3] Group 1: Xiaomi's Chip Development - Xiaomi has announced plans to invest at least 50 billion RMB (approximately 6.9 billion USD) over the next decade to develop its own chips, starting from 2025 [1] - The first self-developed SoC chip, "XRING 01," was launched using TSMC's second-generation 3nm process, aimed at competing with advanced chips like Apple's A18 Pro [2][5] - The company has not disclosed how many SoC chips it plans to produce, indicating uncertainty in its production scale [1][5] Group 2: Potential Collaboration Issues - The US government may impose restrictions on TSMC's collaboration with Xiaomi to prevent the rapid advancement of Chinese AI chip technology [2] - Concerns exist that Xiaomi's technology could be shared with other Chinese companies, giving them a competitive edge [2] Group 3: Market Position and Competition - Despite launching its own chip, Xiaomi is expected to continue relying on Qualcomm and MediaTek for approximately 40% of its smartphone components [2][3] - Qualcomm's CEO stated that Xiaomi's announcement of its first smartphone chip would not impact Qualcomm's business, highlighting the ongoing reliance on established suppliers [3] Group 4: Performance of Xiaomi's SoC - Initial performance tests of the "XRING 01" chip showed disappointing results, underperforming by 13% compared to Xiaomi's claims and falling short against Qualcomm's Snapdragon 8 Elite and MediaTek's Dimensity 9400 [4][5] - The integration of hardware and software in Xiaomi's SoC aims to provide a unique user experience, although the initial performance raises concerns about its competitiveness [5]

今晚的小米发布会，被定名为「15 周年战略新品发布会」，意义不言而喻，其中最重要的产品自然是小米 15S Pro 手机，以及小米 YU7 汽车。 雷军也非常久违地在发布会上介绍起了手机，与其说发布的是小米 15S Pro，不如说其实是当中的玄戒O1 芯片。 这块芯片的具体规格，雷军本人已经在发布会之前亲自揭晓：比肩高通骁龙 8 Elite 的台积电二代 3nm 工艺、190 亿晶体管，确实是对标第一梯队 的规格。 而今晚的发布会，玄戒O1 的具体细节正式曝光，15 岁的小米，也可以说因这颗自研芯片，正式成为了一家「硬科技」企业。 小米自研大芯片，性能对标 iPhone 16 Pro 小米肩负的期待，包括那句「为发烧而生」的口号。即使这几年小米已经鲜少提及，但大众依旧希望从小米旗舰手机上，看到第一梯队的性能表 现。 而玄戒O1 很好回应了这个期待：它不是一颗出现在中端机上的试水作，而是真正能扛起旗舰性能大旗的产品。 作为「不服跑个分」的开创者，雷军也以跑分作为玄戒O1 介绍的开场：3004137 分。 这颗芯片采用十核心四丛集 CPU 架构，配备 2 颗超大核+ 4 颗大核+2 颗小核 + 2 颗超小核，并配备 ...

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