Austemper功能安全平台

Search documents
克服汽车芯片设计面临的三重挑战,快速平稳地驶向未来!
半导体行业观察· 2025-09-27 01:38
Core Viewpoint - Automotive chips are essential for the development of electric and intelligent vehicles, facing challenges such as high reliability requirements, large-scale circuit verification, and stringent functional safety standards [2][14]. Group 1: Quality, Safety, and Reliability Challenges - Automotive chips must meet high-quality testing and zero-defect (0 DPPM) requirements, eliminating defects introduced during manufacturing [4]. - The verification cycle for automotive-grade chips is longer than for consumer-grade chips, requiring rigorous testing certifications like AEC-Q100, which increases design cycle and cost challenges [4]. - The complexity of fault types and testing scales has increased with the development of large-scale integrated circuits, leading to higher testing difficulty, time, and costs [4]. Group 2: Testing Solutions - Siemens EDA's Tessent™ solution helps automotive chip designers ensure high quality, enhance safety, and improve reliability, accelerating time-to-market [4]. - Tessent DFT technology provides high-quality testing to ensure zero defects, generating defect-oriented fault models for comprehensive testing coverage [5]. - Tessent™ LogicBIST and MemoryBIST solutions enable in-chip self-testing capabilities and non-destructive memory testing during system operation, respectively [8]. Group 3: Verification Challenges - Accurate functional verification before chip tape-out is crucial, with increasing complexity in automotive chips making this process more challenging [10]. - The new Veloce™ CS hardware-assisted verification system from Siemens EDA significantly enhances hardware acceleration performance, supporting over 40 billion gates [11]. - Veloce proFPGA CS allows for rapid execution of silicon verification, facilitating firmware and application development [12]. Group 4: Functional Safety Requirements - The performance and safety of chips directly impact driving safety, necessitating compliance with functional safety standards like ISO 26262 [14]. - There is a growing demand for higher safety levels in automotive chips, particularly for ASIL-D level designs related to advanced driver-assistance systems (ADAS) [15]. - Siemens EDA's Austemper platform enhances efficiency in safety analysis and verification, supporting clients in meeting ASIL-B and ASIL-D requirements [15][17]. Group 5: Industry Impact - Automotive chips play an indispensable role in the intelligent and electric transformation of modern vehicles, with Siemens EDA providing advanced solutions to ensure high quality and reliability [17].
观汽车IC、3D IC、AI 赋能技术变革,以技术创新驱动未来
半导体行业观察· 2025-03-26 01:09
以下文章来源于西门子EDA ,作者SIEMENS 西门子EDA . 电子领域的创新步伐正在不断加快。为了让我们的客户能够加快推出改变生活的创新产品,并成为市场 的领导者,我们致力于提供世界上最全面的电子设计自动化 (EDA) 软件、硬件和服务组合。 在当今快速发展的科技时代,半导体行业正经历着前所未有的变革。随着汽车智能化、电动化 的不断推进,人们对车载影音娱乐、智能交互、智能驾驶提出了全新的需求,促进了座舱和智 驾芯片等汽车IC的发展与变革;与此同时,随着芯片制造工艺接近物理极限,传统的集成电路 在性能提升和功耗降低方面遇到了瓶颈,3D IC也迎来了快速发展,作为先进的封装技术通过 垂直堆叠多个芯片,提高芯片密度和性能,从而延续摩尔定律;此外,AI技术在芯片设计工具 上的应用也迎来了大发展,EDA工具的自动化、智能化能够加速设计过程,减少人为错误,提 高整体设计质量。 西门子EDA工具以其先进的技术和解决方案,在全球半导体设计领域扮演着举足轻重的角色。 本文将从汽车IC、3D IC和EDA AI三个方向,深入探讨西门子EDA工具如何助力行业克服技 术挑战,推动创新发展。 助力应对汽车IC革新的技术趋势与挑战 ...