Group 1 - Nvidia is likely to become the sole customer for TSMC's A16 process (1.6 nm), with plans to integrate this technology into its next-generation GPU "Feynman" [1] - TSMC is accelerating the construction of its Kaohsiung P3 plant to start mass production for Nvidia by 2027, in response to Nvidia's significant demand for 3 nm chips and to prepare for A16 [1] - The A16 process utilizes nanosheet transistor architecture and SPR backside power delivery technology, which enhances logic density and reduces power drop, achieving an 8-10% speed increase and a 15-20% reduction in power consumption at the same voltage compared to N2P [1] Group 2 - Other major foundries are also advancing backside power delivery technology, with Samsung announcing plans to mass-produce BSPDN (backside power delivery network) process SF2Z by 2027, and Intel's PowerVia architecture set for the 2026 18A process node [2] - According to Nvidia's product roadmap, the Vera Rubin is expected to launch in the second half of 2026, Rubin Ultra in the second half of 2027, and Feynman in 2028, with A16 anticipated to be a key process for this generation of GPUs [2]