Key Points TSMC’s accelerating AI demand has improved long-term visibility for its foundry business. The company is expanding its CoWoS packaging capacity. TSMC can continue to witness even more share price gains in 2026. 10 stocks we like better than Taiwan Semiconductor Manufacturing › Taiwan Semiconductor Manufacturing's (NYSE: TSM) shares are already up by over 40% in 2025, but several Wall Street analysts believe that the rally may not be over. The most bullish among them is Susquehanna analy ...

Core Viewpoint - TSMC's investment plans in the U.S. have become increasingly complex, with U.S. Secretary of Commerce Gina Raimondo stating that TSMC's previous commitments are insufficient, now requiring a minimum investment of $200 billion and the creation of 30,000 jobs [1][4]. Group 1: Investment and Financial Implications - The starting point of this negotiation was the CHIPS Act signed during the Biden administration, which provided TSMC with $6 billion in subsidies, but only resulted in an initial investment of approximately $60 billion for factory construction, which Raimondo deemed inadequate [4]. - TSMC has since raised its planned investment to $165 billion, but U.S. expectations have now increased to $200 billion, which is a reduced target from earlier internal expectations exceeding $300 billion [4]. - TSMC's U.S. subsidiary reported a significant drop in profits, with earnings of only NT$41 million in Q3 2025, down 99% from NT$4.223 billion in Q2, reflecting the financial pressures and challenges faced in the U.S. market [6]. Group 2: Technological and Operational Challenges - TSMC is facing multiple challenges in the U.S., including high costs, talent shortages, and cultural conflicts, which have directly impacted its financial performance [5]. - The advanced process and packaging technologies, previously considered core assets, are gradually being transferred to the U.S., with TSMC's Arizona facility already producing 4nm chips and plans for 3nm and 2nm processes in the future [4].

Core Viewpoint - TSMC's chairman, Wei Zhejia, is set to visit mainland China for the OIP ecosystem forum, indicating a strategic shift in TSMC's approach to collaboration with local companies amidst ongoing U.S. chip restrictions [5][6][10]. Group 1: TSMC's Strategic Moves - Wei Zhejia's participation in the OIP forum in Nanjing marks the culmination of a global tour aimed at enhancing TSMC's ecosystem, emphasizing the importance of the Chinese market for TSMC's operations [7][8]. - The forum will focus on the integration of AI potential with TSMC's advanced processes and packaging technologies, particularly addressing energy efficiency challenges in next-generation AI chips [7][8]. - TSMC's engagement with Alibaba and other local firms reflects a commitment to deepening partnerships in the semiconductor sector, especially in AI and IoT applications [8][12]. Group 2: Market Dynamics and Challenges - Despite U.S. restrictions, the projected demand for chips in China is expected to reach between 100 billion to 200 billion units by 2025, presenting a significant opportunity for semiconductor companies [14]. - TSMC's current operations in mainland China are primarily focused on 28nm mature processes, which local companies have already mastered, indicating a potential competitive landscape [14][16]. - The visit is seen as a balancing act for TSMC, navigating compliance with U.S. regulations while seeking to expand its market presence in China [10][18]. Group 3: Potential Collaboration and Impact - Possible collaboration areas include deepening partnerships in mature process technologies and developing solutions for IoT and automotive electronics [18]. - TSMC's expertise in advanced packaging and process technologies could enhance the performance of local chip designs, fostering innovation within the Chinese semiconductor ecosystem [16][18]. - The visit underscores the complex dynamics of the semiconductor industry, where TSMC's strategic adjustments could influence the entire supply chain amid geopolitical tensions [18][19].

如果您希望可以时常见面，欢迎标星收藏哦~ 根据Wccftech 报导，传英伟达极可能成为台积电A16 制程（1.6 纳米）的唯一客户，并已将此 技术锁定于英伟达新一代GPU「Feynman」。 供 应 链 消 息 显 示 ， 英 伟 达 的 Rubin 与 Rubin Ultra 系 列 将 率 先 采 用 3 纳 米 ， 而 再 下 一 代 的 Feynman 则计画直接跨入A16。为配合此时程，台积电高雄P3 厂正加速建置，预计在2027 年 替英伟达启动量产。近期台积电扩充3 纳米产能，也被业界解读为因应英伟达大量拉货、并提 前为A16 布局。 A16 采用纳米片电晶体架构，并搭配SPR 背面供电技术，可释放更多正面布局空间、提升逻辑 密度并降低压降，其背面接面（Backside Contact） 亦能维持传统版图弹性，是业界首创的背 面供电整合方案。相较N2P，A16 在相同电压下速度提升8–10%，相同速度下降低15–20% 功 耗，芯片密度提升至1.10 倍，特别适合AI 与HPC 等高运算密度芯片。 除了台积电外，其他晶圆大厂也正加速布局背面供电技术。三星已在今年的晶圆代工论坛宣 布，将于202 ...

据台积电官网显示，2025年台积电开放创新平台（OIP）生态系统论坛于9月24日在硅谷圣克拉拉启动，随后先后在东京、新竹、阿姆斯特丹举 行，最后一站预计于12月4日在南京举行。 今年的论坛将重点介绍该生态系统如何利用人工智能的巨大潜力，为台积电先进的工艺和封装技术打造下一代设计解决方案，内容涵盖针对下一 代人工智能芯片的能源效率及其他挑战的解决方案，以及涉及台积电A16、N2和N3工艺的相应设计流程和方法等。 魏哲家上次访问大陆，还是2023年在上海举行的台积电技术论坛。当时，业务开发及海外运营办公室资深副总裁张晓强、欧亚业务及技术研究资 深副总裁侯永清随行。 工商时报认为，若此行成真，将是台积电探索与大陆合作的最新动作，或将推动新的建厂计划。 据中时新闻网、工商时报等台媒12月2日消息，台积电董事长魏哲家计划时隔两年半再次访问大陆。魏哲家拟率领两位副总裁一同出席在南京举办 的台积电开放创新平台（OIP）生态系统论坛。 期间，魏哲家还将拜访多家大陆本土芯片设计公司。 魏哲家（资料图） 图片转自中时新闻网 本文系观察者网独家稿件，未经授权，不得转载。 ...

Core Viewpoint - The case involving TSMC's former senior vice president, Luo Wei-ren, who allegedly took confidential information related to advanced semiconductor processes before joining Intel, has raised significant concerns and led to legal actions by TSMC against him [2][4]. Group 1: Allegations and Legal Actions - TSMC has filed a lawsuit against Luo Wei-ren for violating a non-compete agreement and potentially leaking trade secrets after he joined Intel [2][4]. - Taiwanese prosecutors have initiated an investigation into Luo, conducting searches at his residences and seizing computers and USB drives [2][5]. - The prosecutors have also obtained approval to freeze Luo's TSMC stocks and real estate assets [2]. Group 2: Background of Luo Wei-ren - Luo Wei-ren, who retired from TSMC in July 2023, was a key figure in the company's advancement towards 2nm technology and had previously worked at Intel for 18 years [4][5]. - He was recognized for his contributions to TSMC, including the implementation of the "Night Hawk Plan" to enhance 10nm process development [5]. Group 3: Intel's Response - Intel's CEO, Pat Gelsinger, stated that the company adheres to strict policies regarding the use of third-party confidential information and expressed confidence in Luo's return to the team [5][6]. - Gelsinger emphasized that talent mobility is essential for innovation in the semiconductor industry and that Intel is focused on strengthening its engineering culture and advancing its technology strategies [5][6]. Group 4: Industry Implications - Analysts suggest that Luo's expertise could be crucial for Intel's transformation, especially as the company seeks to recover from its manufacturing setbacks [6][7]. - The ongoing investigation and legal proceedings may have broader implications for the semiconductor industry, particularly regarding the protection of trade secrets and competitive dynamics between TSMC and Intel [7].

Core Viewpoint - The article discusses the legal actions taken by TSMC against former executive Luo Wei-ren, who has transitioned to Intel, highlighting concerns over potential trade secret leaks and the implications for Taiwan's semiconductor industry [1][3]. Group 1: Legal Actions and Implications - TSMC has filed for a "temporary status injunction" to prevent Luo Wei-ren from joining Intel, citing risks of leaking company secrets [1][3]. - The case has garnered significant attention, particularly regarding the potential impact on Luo's status as an "Academician" at the Industrial Technology Research Institute [3]. - The Taiwanese economic department has initiated procedures to revoke Luo's academic title, indicating that his actions may violate the "Security Law" and "Trade Secrets Law" [3]. Group 2: Background on Luo Wei-ren - Luo Wei-ren joined TSMC in 2004 and has held several key technical positions over his 21-year tenure, contributing to over 1,500 patents [4]. - He played a crucial role in overcoming the 10nm process development challenges and led the "Night Hawk Project," which established a continuous R&D system [4].

Core Viewpoint - TSMC has filed a lawsuit against former senior vice president Luo Wei-ren for allegedly violating a non-compete agreement and potentially leaking confidential information to Intel [1][3]. Group 1: Legal Action - TSMC announced on November 25 that it has initiated legal proceedings against Luo Wei-ren, who served as a senior vice president since 2014 and is accused of breaching his non-compete agreement by joining Intel [1]. - The company claims that Luo's actions could lead to the disclosure of trade secrets and confidential information to Intel, necessitating legal action for breach of contract [1]. Group 2: Background of Luo Wei-ren - Luo Wei-ren has been with TSMC since July 2004 and was promoted to senior vice president in February 2014, with plans to retire on July 27, 2025 [1]. - After being reassigned to the "Corporate Strategy Development Department," Luo continued to request information from the R&D department, raising concerns about his intentions [1]. Group 3: Industry Reactions and Speculations - The news of Luo's potential move to Intel has sparked widespread speculation in Taiwan, with some questioning the motivations behind his actions, given his established career and status [3]. - Industry analysts suggest that there may be underlying strategic considerations, possibly involving tacit approval from TSMC's decision-makers to allow Luo's transition to Intel [4]. Group 4: Broader Implications - The situation reflects ongoing tensions in the semiconductor industry, particularly with U.S. government efforts to bolster domestic chip production and the implications for companies like TSMC [3][4]. - The lawsuit may serve to address public concerns while the true motivations and potential strategic alignments behind Luo's move remain uncertain [5].

Core Viewpoint - The article discusses the recent controversy surrounding TSMC's former senior vice president, Luo Wei-ren, who allegedly took confidential documents related to advanced semiconductor processes when he joined Intel, leading to a lawsuit from TSMC against him for potential breach of confidentiality [2][3][4]. Group 1: TSMC's Legal Action - TSMC has filed a lawsuit against Luo Wei-ren, who retired in July and subsequently joined Intel as an executive vice president, for potentially using or leaking confidential information [3]. - TSMC's legal action is based on Luo's failure to disclose his intention to join Intel during his exit process, despite being reminded of his non-compete obligations [3][4]. - The company had previously extended Luo's retirement age from the standard 67 to 75, indicating his significant role within TSMC [4]. Group 2: Background on Luo Wei-ren - Luo Wei-ren has a Ph.D. in solid-state physics and surface chemistry from UC Berkeley and has a history of working at Intel before joining TSMC in 2004 [4]. - Despite being reassigned to a strategic development role in March 2022, Luo continued to request information from the R&D department, raising concerns about his intentions [4]. Group 3: Industry Context - This incident marks the second significant leak of confidential information from TSMC in recent months, following an earlier case involving nine employees who leaked critical data related to TSMC's 2nm process to Tokyo Electron [6]. - TSMC's internal monitoring led to the discovery of this earlier leak, resulting in the termination and legal action against the involved employees [6].

Core Viewpoint - TSMC has filed a lawsuit against former senior vice president Luo Wei-ren for potential breaches of confidentiality and non-compete agreements following his departure to Intel shortly after retirement [1][2]. Group 1: Legal Actions and Allegations - TSMC initiated legal action based on employment contracts, non-compete agreements, and trade secret laws, claiming Luo may misuse or disclose confidential information to Intel [1][2]. - Luo joined TSMC in July 2004, became a senior vice president in February 2014, and was reassigned to the Corporate Strategy Development Department in March 2024, where he had no direct oversight of R&D [1]. - After retiring on July 27, 2025, Luo joined Intel as Executive Vice President (EVP) just three months later, raising concerns about potential information leaks [2]. Group 2: Confidentiality and Non-Compete Agreements - During his tenure, Luo signed confidentiality and post-employment non-compete agreements, committing not to engage in competitive activities after leaving TSMC [2]. - TSMC's legal counsel reminded Luo of his non-compete obligations during his exit interview, where he indicated plans to work in academia but did not disclose his intention to join Intel [2]. Group 3: Investigations and Industry Impact - TSMC is actively gathering evidence regarding Luo's alleged misuse of his position to access sensitive information related to advanced process technologies before his departure [2]. - The Taiwan High Prosecutors Office has opened an investigation to determine if Luo's actions constitute any legal violations [2].