Core Viewpoint - The company has achieved mass production capability for FC-BGA packaging substrates with 20 layers and below, while the technical research and sample production for 22-26 layer products are progressing as scheduled [1] Group 1 - The company’s Guangzhou packaging substrate project phase one has been connected in the fourth quarter of 2023, with continuous improvement in product line capacity [1] - The company is steadily ramping up production capacity and has secured bulk orders for BT type and some FC-BGA products [1] - The loss of Guangzhou Guangxin is expected to narrow on a quarter-on-quarter basis by the third quarter of 2025 [1]

Core Viewpoint - The company, ShenNan Circuit (002916.SZ), reported strong performance in the first half of the year, driven by demand in the computing power upgrade and automotive electronics market, leading to high capacity utilization in its PCB business [1] Group 1: Business Performance - The overall capacity utilization rate of the PCB business remains relatively high due to increased demand [1] - The packaging substrate business has seen a significant increase in capacity utilization month-on-month due to the recovery in storage market demand [1] - The company's comprehensive capacity utilization is still at a relatively high level [1] Group 2: Project Developments - The first phase of the Guangzhou packaging substrate project is set to connect in the fourth quarter of 2023, with continuous improvement in product line capabilities [1] - The company is steadily ramping up production capacity and has secured bulk orders for BT and some FC-BGA products, although it is still in the capacity ramp-up phase [1] - The focus remains on capacity building and market development, with a reduction in losses for Guangzhou Guangxin expected in the first half of 2025 [1] Group 3: Investment and Production - The total investment in the Thailand factory amounts to 1.274 billion RMB (approximately 127.4 million USD), and it has commenced trial production [1]