海水中的原料，如何点亮万家灯火？ 月球上建造基地、供应生活用水，能否就地取材？ 这些充满科技感的想象，在安徽，都能看得真切： 在他看来，BEST装置本身就是一个巨大的商业应用场景，零部件数量以百万计。"我们早早布局产业链 国产化能力，走通从基础研究'最先一公里'到成果转化'最后一公里'的创新路径，在合肥及周边孵化多 家核聚变相关企业，部分已经上市。"严建文说。 稳态强磁场实验装置多次刷新世界纪录，"聚变堆主机关键系统"牵引前沿探索……聚木成林，合肥布局 建设的13个大科学装置集群形成独特引力场，累计孵化科技型企业近50家，带动相关未来产业蓬勃发 展。 输入一句话，等待片刻，人工智能初创企业智象未来开发的人工智能大模型，就能"变"出一段画质清晰 的视频；高分通过国家执业医师资格考试医学综合笔试，科大讯飞开发的智医助理，已为基层医疗机构 提供超10亿次人工智能辅诊建议；转动"手臂"，电子眼"环视"工件一圈，只用3分钟，埃夫特智能机器 人公司研发的免编程焊接机器人就能自动完成焊接…… 解放生产力，释放想象力，人工智能企业从大众日常生活中找需求，以场景为牵引，让创新科技赋能千 行百业。围绕工业、教育、医疗等领域，安徽 ...

金融界2025年7月10日消息，国家知识产权局信息显示，深南电路股份有限公司申请一项名为"一种封装 基板的制造方法、封装基板及电子设备"的专利，公开号CN120280345A，申请日期为2025年03月。 专利摘要显示，本申请公开了一种封装基板的制造方法、封装基板及电子设备，该封装基板的制造方法 包括：提供封装芯板，在封装芯板的一侧面上开设暴露出导电层的槽体；在槽体中的导电层上形成焊锡 垫；其中，焊锡垫的厚度小于槽体深度；在封装芯板的一侧面上形成阻焊桥；在焊锡垫上形成焊球，以 使焊球凸出阻焊桥背离封装芯板的一侧面设置；将焊球背离封装芯板的一侧面整平至与阻焊桥背离封装 芯板的一侧面之间的距离在设定阈值范围内；其中，设定阈值范围大于0。上述方式，本申请中的封装 基板的制造方法通过在焊球与封装芯板内部导电层之间设置焊锡垫，有效避免了对封装芯板外侧造成损 伤，并降低了压断封装芯板内部导电层的风险，提高了封装基板的可靠性。 天眼查资料显示，深南电路股份有限公司，成立于1984年，位于深圳市，是一家以从事计算机、通信和 其他电子设备制造业为主的企业。企业注册资本51287.7535万人民币。通过天眼查大数据分析，深南电 ...

Core Viewpoint - Bank of America projects a compound annual growth rate (CAGR) of 35% for Ibiden's electronic components business over the next five years, driven by surging demand for GPU packaging substrates used in AI chip production [1] Group 1: Company Performance and Projections - Ibiden is expected to significantly increase its production capacity by 60-70% from 2024 to 2026, capitalizing on the historical expansion opportunities in ASICs [1][13] - The EPS forecast for Ibiden has been raised substantially through fiscal year 2028 due to the explosive growth in demand for ABF advanced packaging substrates [1] - Bank of America has upgraded its earnings expectations and 12-month target price for Ibiden, indicating strong confidence in the company's future performance [9] Group 2: Market Demand and Trends - The demand for ABF packaging substrates is closely tied to the production of AI chips, particularly Nvidia's Blackwell series, which is expected to enter a "super growth cycle" in the second half of the year [2][5] - The AI chip market, including GPUs and ASICs, is projected to grow from $126 billion in 2024 to over $400 billion by 2027, and reach at least $650 billion by 2030 [16] - The increasing reliance on ABF substrates for high-performance AI chips is driven by their superior electrical and thermal properties, which are essential for advanced packaging systems [7][8] Group 3: Competitive Landscape - Nvidia's AI GPUs currently account for over 80% of Ibiden's ABF substrate sales, but the share of AI ASICs is expected to approach 20% by 2030 [9][16] - Major cloud computing giants are securing long-term orders with Ibiden and other select Taiwanese packaging manufacturers, indicating strong demand for advanced packaging solutions [9][10] - The rapid growth in AI chip shipments is forcing substrate manufacturers to expand their high-end ABF production capacity ahead of schedule to meet the increasing output [10]

智通财经7月3日电，深南电路(002916.SZ)发布投资者关系活动记录表，公司近期各项业务经营正常， 综合产能利用率仍处于相对高位，其中PCB业务因目前算力及汽车电子市场需求延续，近期工厂产能利 用率保持高位运行；封装基板业务因近期存储领域需求相对改善，工厂产能利用率较2024年第四季度、 2025年第一季度均有所提升。公司FC-BGA封装基板现已具备20层及以下产品批量生产能力，最小线宽 线距能力达9/12μm。各阶产品相关送样认证工作有序进行。20层以上产品的技术研发及打样工作按期 推进中。 深南电路：PCB工厂产能利用率保持高位运行 ...

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2025-26 公司 PCB 业务在深圳、无锡、南通及泰国（工厂在建）均设有工厂。一方面，公司通过 对现有成熟 PCB 工厂进行技术改造和升级，打开瓶颈，提升产能；另一方面，公司有序推 进南通四期项目建设，构建 HDI 工艺技术平台和产能，目前正在推进项目基础工程建设。公 司将结合自身经营规划与市场需求情况，合理配置业务产能。 Q5、请介绍公司泰国工厂投资规模及业务定位。 公司在泰国工厂总投资额为 12.74 亿元人民币/等值外币。目前基础工程建设按期有序推 进中，具体投产时间将根据后续建设进度、市场情况等因素确定。泰国工厂将具备高多层、 HDI 等 PCB 工艺技术能力，其建设有利于公司进一步开拓海外市场，满足国际客户需求， 完善产品在全球市场的供应能力。 Q6、请介绍公司 2025 年第一季度封装基板业务经营拓展情况。 公司封装基板产品覆盖种类广泛多样，包括模组类封装基板、存储类封装基板、应用处 理器芯片封装基板等，主要应用于移动智能终端、服务器/存储等领域。具备了包括 WB、FC 封装形式全覆盖的封装基板技术能力 ...

点击注册小程序 兴森科技通过持续的研发投入提升技术能力，以数字化改造提升工厂的经营管理效率，以稳定的交付和质量表 现提升客户满意度。根据公司年报援引CPCA发布的第二十三届中国电子电路行业排行榜，公司在综合PCB百 强企业位列第十四名、内资PCB百强企业中位列第七名。根据公司年报援引Prismark公布的2024年全球PCB四 十大供应商，公司位列第三十名。 封装基板业务成长空间广阔 公司CSP封装基板业务聚焦于存储、射频两大主力方向，并向汽车市场拓展，产品结构向高附加值高单价的方 向拓展，尤其是多层板难度板，致力于通过优化产品结构增强盈利能力。受益于存储芯片行业复苏和主要存储 客户的份额提升，2024年公司CSP封装基板业务产能利用率逐季提升。公司持续推进客户认证和量产导入工 作，样品订单持续交付，整体良率持续改善提升，高层板进入小批量量产阶段，该业务有望打开广阔成长空 间。 公司营收实现持续增长 查看完整报告 特别申明： 本订阅号中所涉及的证券研究信息由光大证券研究所编写，仅面向光大证券专业投资者客户，用作新媒体形势下研究 信息和研究观点的沟通交流。非光大证券专业投资者客户，请勿订阅、接收或使用本订阅号中 ...

2025 年 7 月 1 日 公司研究 营收持续增长，成长空间广阔 ——兴森科技（002436.SZ）跟踪报告之五 要点 兴森科技专注于先进电子电路方案产业， PCB 和半导体两大业务助力成长。公 司传统 PCB 业务聚焦于样板快件及批量板的研发、设计、生产、销售和表面贴 装，公司深化推进 PCB 工厂的数字化变革，实现从工程设计、制造、供应链等 全流程数字化改造，持续提升客户满意度和经营效率；高阶 PCB 领域，公司完 善 Anylayer HDI 板和类载板（SLP）业务布局，在坚守高端智能手机主赛道的 基础上，全力拓展高端光模块、毫米波通信市场；公司半导体业务聚焦于 IC 封 装基板（含 CSP 封装基板和 FCBGA 封装基板）领域，立足于芯片封装测试环节 的关键材料自主配套。公司产品广泛应用于通信设备、消费电子、工业控制、医 疗电子、服务器、轨道交通、计算机应用、半导体等多个行业领域。 兴森科技持续保持 PCB 行业领先地位。兴森科技通过持续的研发投入提升技术 能力，以数字化改造提升工厂的经营管理效率，以稳定的交付和质量表现提升客 户满意度。根据公司年报援引 CPCA 发布的第二十三届中国电子电路行 ...

Core Viewpoint - The credit rating report indicates that Shenzhen Xingsen Quick Circuit Technology Co., Ltd. (referred to as "Xingsen Technology") maintains a stable credit rating of AA, reflecting its leading position in the domestic PCB prototype and small batch board sector, despite facing significant financial challenges due to high upfront costs in semiconductor projects and slow order integration [2][4][5]. Company Overview - Xingsen Technology is recognized as one of the few domestic manufacturers capable of mass production of FCBGA packaging substrates, maintaining a technological edge in the industry [2][17]. - The company has a diversified product application across various sectors, including communication, industrial control, medical electronics, and consumer electronics, with a stable customer base [4][17]. Financial Performance - The company reported total assets of 145.69 billion and total liabilities of 59.44 billion as of March 2025, with operating revenue of 15.80 billion for the year [2]. - The net profit for 2024 was a loss of 5.31 billion, reflecting the impact of high costs associated with semiconductor projects and insufficient order volume [3][5]. - The company's debt-to-equity ratio increased, indicating rising financial leverage and debt repayment pressure [5][19]. Industry Environment - The PCB market is expected to recover in 2024, driven by demand from AI servers and consumer electronics, with a projected global market value of 73.6 billion, representing a 5.8% year-on-year growth [11][12]. - The domestic PCB market in China is anticipated to grow from 41.2 billion to 50.8 billion from 2024 to 2029, with a compound annual growth rate of 4.3% [11][12]. - The industry faces challenges such as high raw material costs and competitive pressures, which may impact profit margins [15][19]. Competitive Position - Xingsen Technology ranks seventh among domestic PCB manufacturers according to the CPCA, showcasing its competitive strength [17]. - The company has invested significantly in R&D, with 4.42 billion allocated in 2024, and has received national awards for its technological advancements [18][19]. - Despite the competitive landscape, Xingsen Technology's PCB business saw a revenue increase of 5.11% in 2024, primarily due to recovery in the consumer electronics sector [19].

Group 1: Industry Overview - The PCB (Printed Circuit Board) sector in the A-share market is experiencing significant activity, with multiple companies' stocks hitting the daily limit up, driven by strong demand from emerging fields such as 5G, AI, and automotive electronics [1] - The PCB industry is moving towards high-end development, supported by national strategic planning and local policies, which emphasize the importance of electronic components in the global electronics information industry chain [1][2] Group 2: Policy Support - National and local governments have established a multi-level support system for the PCB industry, with policies like the "14th Five-Year Plan" and the "14th Five-Year Digital Economy Development Plan" highlighting the cultivation of AI and enhancement of core electronic components [2] - Recent guidelines from the Ministry of Industry and Information Technology focus on automating and upgrading electronic component production, promoting miniaturization and high precision in PCB products [2] Group 3: Market Demand - The demand for high-frequency and high-speed PCBs is surging due to the construction of 5G base stations and the requirements of AI servers and data centers [4] - The automotive electronics market is expanding, driven by the trend of vehicle intelligence, which is expected to increase the value of PCBs per vehicle [6] Group 4: Company Developments - Companies are actively investing in expanding their production capacities, such as Huishi Electronics planning to invest approximately 4.3 billion yuan in a new high-end PCB project for AI chips [4] - Wenzhou Hongfeng and Guangdong Shiyun Circuit are also enhancing their production lines to meet the growing demand for high-performance PCB products [5][6] Group 5: Future Projections - The global PCB market is projected to reach $96.8 billion by 2025, driven by the proliferation of AI technology and the expansion of the electric vehicle market [7] - The PCB market for AI and HPC servers is expected to grow at a compound annual growth rate (CAGR) of 32.5% from 2023 to 2028, reaching a market size of $3.2 billion [7] Group 6: Challenges Ahead - The PCB industry faces challenges such as technological upgrades, environmental constraints, and cost pressures, necessitating agile R&D mechanisms and green process transformations [8] - Companies must focus on digital supply chain management and intelligent production technologies to control costs effectively while transitioning towards high-end, integrated products [8]

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2025-25 Q5、请介绍公司泰国工厂投资规模及业务定位。 公司在泰国工厂总投资额为 12.74 亿元人民币/等值外币。目前基础工程建设按期有序推 进中，具体投产时间将根据后续建设进度、市场情况等因素确定。泰国工厂将具备高多层、 HDI 等 PCB 工艺技术能力，其建设有利于公司进一步开拓海外市场，满足国际客户需求， 完善产品在全球市场的供应能力。 Q6、请介绍公司 2025 年第一季度封装基板业务经营拓展情况。 公司封装基板产品覆盖种类广泛多样，包括模组类封装基板、存储类封装基板、应用处 理器芯片封装基板等，主要应用于移动智能终端、服务器/存储等领域。具备了包括 WB、FC 封装形式全覆盖的封装基板技术能力。2025 年第一季度，公司封装基板业务需求较去年第四 季度有一定改善，主要得益于存储类产品需求提升。 Q7、请介绍公司 FC-BGA 封装基板产品技术能力及广州封装基板项目爬坡进展。 公司 FC-BGA 封装基板现已具备 20 层及以下产品批量生产能力，最小线宽线距能力达 9/12μm。各阶产品相关送样认证工作 ...