Core Viewpoint - The company is advancing its automotive electronic chip business, focusing on high-end products and expanding its market presence among major automotive manufacturers and Tier 1 module suppliers [1][2] Group 1: Product Development and Market Position - The company has established a comprehensive product matrix covering "basic control-high-end intelligence" and "MCU-analog-digital mixed-DSP" for automotive applications [1] - The company’s automotive electronic chips have gained widespread recognition and a good reputation in the industry, being adopted by numerous automotive manufacturers such as BYD, Chery, Geely, SAIC, Changan, Great Wall, FAW, Dongfeng, BAIC, Xpeng, Li Auto, and others [1] - The company is committed to breaking through high-end product technology barriers with its 12 automotive-grade chip product lines gradually evolving towards high-end applications [1] Group 2: Sales and Revenue Projections - By 2025, the company expects to ship 13 million automotive electronic chips, with projected revenue from its self-developed automotive electronic chip business reaching 127 million yuan, representing a year-on-year growth of 82.32% [2] - Cumulative shipments of automotive electronic chips are anticipated to exceed 25 million units by December 31, 2025 [2] - The company has successfully launched high-end automotive-grade MCU and DSP chip series, including CCFC3007PT/BC, CCFC3008PT/BC, CCFC3010PT, CCFC3012PT, and CCD5001, into the market [2]

Core Viewpoint - The company is focusing on the development of domain control MCU chips for automotive intelligent driving, intelligent domain control, and intelligent chassis applications, with several key products launched. Group 1: Product Development - The main chip products launched by the company include CCFC3007PT, CCFC3010PT, CCFC3011PT, and CCFC3012PT [1] - The CCFC3012PT chip is comparable to Infineon TC397/399 series chips [1] - The CCFC3009PT chip has completed development and is now in the tape-out trial stage, designed for automotive assisted driving and cross-domain integration applications [1] Group 2: Performance and Applications - The CCFC3009PT chip has a pre-computing power of over 10,000 DMIPS, which is approximately three times that of the CCFC3012PT chip [1] - The CCFC3009PT chip is at an internationally advanced level and is applicable in scenarios such as real-time control for intelligent driving, network data exchange, radar signal processing, and intelligent sensor signal processing [1]

格隆汇9月5日丨国芯科技(688262.SH)在投资者互动平台表示，在汽车辅助驾驶芯片领域，公司目前主 要产品有CCFC3012PT，可对标Infineon TC397/399系列芯片产品。公司还启动了CCFC3009PT芯片研 发，这是面向汽车辅助驾驶和跨域融合领域应用而设计开发的具有AI功能的更高性能MCU芯片，芯片 基于22nm RRAM工艺，采用高性能 RISC-V 多核架构 CRV6 CPU（6个主核+6个锁步核），集成NPU单 元，运行频率达到500MHz，预计算力可达到10000DMIPS以上，约是CCFC3012PT芯片的三倍，具备国 际先进水平。 ...

Group 1 - The core product in the automotive driver assistance chip field is CCFC3012PT, which is comparable to Infineon TC397/399 series chips [1] - The company has initiated the development of the CCFC3009PT chip, designed for automotive driver assistance and cross-domain integration applications, featuring AI capabilities [1] - The CCFC3009PT chip is based on 22nm RRAM technology, utilizing a high-performance RISC-V multi-core architecture with a CRV6 CPU (6 main cores + 6 lockstep cores) [1] Group 2 - The CCFC3009PT chip integrates an NPU unit, achieving a clock frequency of 500MHz and a pre-computation capability exceeding 10,000 DMIPS, which is approximately three times that of the CCFC3012PT chip [1] - The performance of the CCFC3009PT chip is at an internationally advanced level [1]