以下文章来源于睿兽Pro ，作者Bestla 睿兽Pro . 创业邦旗下横跨一二级市场的科创数据平台。实时投资数据、追踪产业创新。找数据、做分析、链资 源，就上睿兽分析。 全球投融资周报 睿兽分析每周整理当周最值得关注的国内外热门投融资事件，帮助大家及时了解全球市场动向。 一级市场投融资概览 根据睿兽分析监测数据，本周国内一级市场披露的融资事件87个， 与上周相比减少26个， 其中已披 露融资金额的事件28个， 总融资规模为41.86亿元人民币， 平均融资金额为1.50亿元人民币。 行业分布 从融资事件数量来看，本周智能制造、医疗健康、人工智能领域融资最活跃。 分别为智能制造22 个、医疗健康17个、人工智能14个。 从已披露金额事件的融资规模来看，汽车交通最高，融资总规模约为16.00亿元人民币。 其中汽车电 子芯片研发商 「芯擎科技」 获过10亿人民币B轮融资。 芯擎科技是一家专注于汽车电子芯片整体方案提供的中外合资高科技公司。公司致力于为汽车产业的 未来发展提供技术先进的SOC解决方案，通过集成电路设计、制造与销售，以及智能车载设备、软件 的开发，推动汽车智能化进程。 其次是智能制造行业，已披露融资总额 ...

以下文章来源于RimeData 来觅数据 ，作者来觅研究院 RimeData 来觅数据 . 全面的一级市场数据平台 ⌜ 投融概况 ⌟ 截至2025年08月22日18:00， 本周融资事件共141起（不包括并购、定增），较上周增加了4起，融资金额总计约95.23亿元（谨慎估计），较上周减少了 79.99亿元。在所有融资事件中，本周融资金额在亿元及以上的融资事件有20起，较上周增加了7起。本周公开退出案例18个，较上周减少了6个。另外， 本周有173家机构参与了一级市场投资，较上周减少了6家。 请读者留意，由于本周有15起融资事件未公布准确的融资金额，出于谨慎考虑，笔者做了暂取较小值处理，涉及金额至少13.11亿元，约占融资总额的 13.77%。另外，因融资事件的延迟披露，本期周报仅收录了本周五18:00前公开披露的融资事件，可能导致统计分析与实际情况存在细微偏差，感兴趣的 读者可以登录Rime PEVC平台获取全量融资事件、被投项目及深度数据分析。 本周已披露金额的融资事件48起，较上周减少了13起，融资金额区间分布结构与上周有明显变化，本周500万以下的融资事件2起，较上周减少了3起；500 万-1000万（ ...

Core Viewpoint - The stock price of Zhaoyi Innovation (603986) has increased significantly, reaching a new high, with a current market capitalization of 100.19 billion yuan, ranking 9th in the semiconductor sector and 164th in the A-share market [1][4]. Trading Information Summary - On August 19, Zhaoyi Innovation recorded a large transaction amounting to 2.4652 million yuan [2][8]. Shareholder Changes - As of June 30, 2025, the number of shareholders for Zhaoyi Innovation decreased to 137,800, a reduction of 8,208 shareholders, representing a decline of 5.62%. The average number of shares held per shareholder increased from 4,550 to 4,821, with an average holding value of 609,900 yuan [3][8]. Performance Disclosure Highlights - For the first half of 2025, Zhaoyi Innovation reported a total revenue of 4.15 billion yuan, a year-on-year increase of 15.0%. The net profit attributable to shareholders was 575 million yuan, up 11.31% year-on-year. The net profit excluding non-recurring items was 544 million yuan, reflecting a 14.99% increase. In Q2 2025, the company achieved a revenue of 2.241 billion yuan, a 13.09% increase year-on-year, with a net profit of 341 million yuan, up 9.17% year-on-year [4][8]. Company Announcement Summary - The fifth meeting of the fifth board of directors of Zhaoyi Innovation approved several resolutions, including the approval of the 2025 semi-annual report and the special report on the use of raised funds. The company agreed to increase the implementation subject and location of the "automotive electronic chip R&D and industrialization project" and to use part of the raised funds for capital increase to its wholly-owned subsidiary. The company also confirmed the achievement of conditions for stock option and restricted stock incentive plans [5][6][8].

中国国际金融股份有限公司 关于兆易创新科技集团股份有限公司 增加汽车电子募投项目实施主体和地点 并使用部分募集资金向全资子公司增资的核查意见 中国国际金融股份有限公司（以下简称"中金公司"或"保荐机构"）作为兆易创新科 技集团股份有限公司（以下简称"兆易创新"或"公司"）2020 年非公开发行股票的保荐机 构，根据《证券发行上市保荐业务管理办法》 《上市公司募集资金监管规则》 《上海证券 交易所股票上市规则》《上海证券交易所上市公司自律监管指引第 1 号——规范运作》 等有关规定，对兆易创新增加汽车电子募投项目实施主体和地点并使用部分募集资金向 全资子公司增资进行了审慎核查，核查意见如下： 一、募集资金基本情况 经中国证券监督管理委员会《关于核准北京兆易创新科技股份有限公司非公开发行 股票的批复》（证监许可[2020]711 号核准），公司由主承销商中国国际金融股份有限公 司采用非公开发行股票方式，发行人民币普通股（A 股）21,219,077 股，发行价格为人 民币 203.78 元/股，本次发行募集资金总额为人民币 432,402.35 万元，扣除承销费用（不 含增值税）人民币 3,958.49 万元后， ...

中国国际金融股份有限公司 关于兆易创新科技集团股份有限公司 使用自有资金、外汇等方式支付募投项目部分款项 并以募集资金等额置换的核查意见 中国国际金融股份有限公司（以下简称"中金公司"或"保荐机构"）作为兆易创新科 技集团股份有限公司（以下简称"兆易创新"或"公司"）2020 年非公开发行股票的保荐机 构，根据《证券发行上市保荐业务管理办法》 《上市公司募集资金监管规则》 《上海证券 交易所股票上市规则》《上海证券交易所上市公司自律监管指引第 1 号——规范运作》 等有关规定，对兆易创新使用自有资金、外汇等方式支付募投项目部分款项并以募集资 金等额置换的事项进行了审慎核查，核查意见如下： 一、募集资金基本情况 经中国证券监督管理委员会《关于核准北京兆易创新科技股份有限公司非公开发行 股票的批复》（证监许可[2020]711 号核准），公司由主承销商中国国际金融股份有限公 司采用非公开发行股票方式，发行人民币普通股（A 股）21,219,077 股，发行价格为人 民币 203.78 元/股，本次发行募集资金总额为人民币 432,402.35 万元，扣除承销费用（不 含增值税）人民币 3,958.49 万元后，公 ...

Core Viewpoint - The 2025 Bay Area Semiconductor Industry Eco-Expo aims to showcase the innovation and business opportunities within the global semiconductor industry, featuring a significant scale upgrade and a comprehensive industry ecosystem [1][17]. Group 1: Event Overview - The expo will take place from October 15 to 17, 2025, at the Shenzhen Convention Center, with a total exhibition area exceeding 60,000 square meters, which is equivalent to eight standard football fields [1]. - The event will gather over 600 leading industry companies and is expected to attract 60,000 professional visitors, along with hosting more than 20 cutting-edge technology summits and industry forums [1][9]. Group 2: Industry Coverage - The expo will feature four core exhibition areas: wafer manufacturing, compound semiconductors, IC design, and advanced packaging, covering the entire industry chain from upstream materials and equipment to downstream applications [4][7]. - Each exhibition area is meticulously planned to not only showcase the latest technological achievements but also to focus on practical application scenarios, providing an immersive industry experience for exhibitors and visitors [4]. Group 3: Innovative Display Modes - The expo introduces an innovative "technology + application ecosystem" display mode, with three ecological zones dedicated to AI chip ecosystems, RISC-V ecosystems, and Chiplet and advanced packaging ecosystems [6]. - This approach allows visitors to deeply experience semiconductor technology in various application scenarios, including AI computing centers, robotics, smart vehicles, smart cities, Industry 4.0, and consumer electronics [6]. Group 4: Business Opportunities - The wafer manufacturing exhibition area will showcase top global wafer manufacturing equipment and materials suppliers, presenting comprehensive solutions for the entire wafer manufacturing process, including key technological breakthroughs [7]. - The expo is expected to unlock over 10 billion yuan in industrial cooperation opportunities across various fields, including equipment procurement, technology licensing, production line construction, and material supply [9]. Group 5: Year-Round Service Ecosystem - The expo will establish a year-round service ecosystem, breaking the traditional three-day exhibition time limitation, and will include a demand database and supplier resource library for precise matching before, during, and after the event [10][19]. - An innovative "project procurement exhibition" model will be introduced, focusing on project demand to facilitate efficient matching between suppliers and buyers [11]. Group 6: Collaborative Development - The expo will connect six major semiconductor industry cities in China, leveraging local industrial characteristics and resource advantages to form a collaborative development pattern [12]. - It will provide a platform for global product launches, technical exchanges, and precise procurement matching, inviting key downstream purchasers from the industry [12][14]. Group 7: Comprehensive Professional Services - The organizers will offer a full range of professional services throughout the exhibition process, including pre-exhibition demand research, on-site business coordination, and post-exhibition project tracking [19]. - The expo aims to promote the deep integration of the global semiconductor industry ecosystem, contributing to the transition of China's semiconductor industry from "technology following" to "innovation leading" [17].

Core Insights - The company reported a strong performance in the first half of 2025, achieving a revenue of 3.33 billion yuan, a year-on-year increase of 10.42%, and a net profit of 497 million yuan, up 37.12% year-on-year [2] - The sales of the company's main product lines have seen significant growth, particularly in the smart home sector, with sales increasing over 50% year-on-year [3] - The company has successfully launched several strategic new products in 2025, which have quickly gained market acceptance and contributed to a new high in overall sales volume [4] Financial Performance - In the first half of 2025, the company achieved a revenue of 3.33 billion yuan, an increase of 314 million yuan compared to the previous year [2] - The net profit for the same period was 497 million yuan, reflecting an increase of 134 million yuan year-on-year [2] - In Q2 2025, the company recorded a revenue of 1.80 billion yuan, a year-on-year growth of 9.94% and a quarter-on-quarter increase of 17.72% [2] Product Sales and Market Trends - The company shipped nearly 50 million units in Q2 2025, setting a new record for quarterly shipments [2] - The sales of smart home products increased by over 50% year-on-year in both the first half and Q2 of 2025 [3] - The W series products achieved sales of over 8 million units in the first half of 2025, with Q2 sales surpassing 5 million units [3] R&D Investment - The company invested 735 million yuan in R&D in the first half of 2025, an increase of 61 million yuan compared to the same period last year [4] - The focus on strategic new products has led to rapid market acceptance and significant sales growth [4] - The company anticipates continued growth in overall sales as new products expand their market reach [4]

Trading Information Summary - On August 1, 2025, Nanchip Technology (688484) closed at 40.15 yuan, up 4.94%, with a turnover rate of 4.32%, trading volume of 126,700 shares, and a transaction amount of 501 million yuan [1] - The fund flow on August 1 showed a net outflow of 88,400 yuan from main funds, a net inflow of 23.63 million yuan from retail funds, and a net outflow of 23.54 million yuan from individual investors [4] Company Announcements Summary - Nanchip Technology expects to have daily related transactions with Shenzhen Gan Nan Semiconductor Technology Co., Ltd. in 2025, totaling no more than 10 million yuan (excluding tax), with 9 million yuan for purchasing raw materials and 1 million yuan for purchasing services [2][4] - The company plans to use up to 700 million yuan of idle raised funds for cash management, investing in high-security, liquid financial products, with a usage period not exceeding 12 months [2][5] - Nanchip Technology also intends to use up to 1.5 billion yuan of idle self-owned funds for cash management under similar conditions as above [5] - The registered capital of Nanchip Technology has been changed to 425.702911 million yuan, with the total number of shares increasing to 425.702911 million shares following the completion of stock registration for the first vesting period of the 2023 restricted stock incentive plan [3][4]

Investment Rating - The report initiates coverage with a "Buy" rating for the company [5]. Core Insights - The company is positioned as a leading player in the global printer market, with its brand BenQ continuously enhancing its competitive edge and solidifying its market leadership [3]. - The semiconductor segment, particularly in automotive and industrial applications, is expanding, creating new growth opportunities for the company [3]. Summary by Sections Printer Business - The company has established itself as a global leader in the printer industry, with a sales network spanning over 110 countries and regions. It has developed a comprehensive supply chain covering key components, printers, and printing management services [10][13]. - BenQ's market share in the global printer market reached 2.9% in Q4 2024, up from 2.6% in Q3 2024, and is projected to increase to 3.1% in Q1 2025 [13]. - The company has a strong R&D team of over 2,000 people and holds more than 6,200 patents, showcasing its technological capabilities [19]. - The A3 printer segment saw a remarkable sales increase of 131.44% year-on-year in 2024, with a quarterly growth of 401.41% in Q4 [23]. - The introduction of AI features and smart printing solutions has further strengthened its position in the consumer market [24]. Semiconductor Business - The semiconductor division has been active for over 20 years, with significant investments leading to accelerated growth. The company has established itself as a key player in the semiconductor industry, particularly in automotive electronics [2][49]. - The company has successfully launched several chips for automotive applications, including the GURC01 ultrasonic sensor, which has been adopted by major automotive manufacturers [2]. - The company has developed a comprehensive product matrix in the semiconductor field, including high-performance microcontrollers and automotive-grade chips [62]. Financial Forecast and Investment Recommendations - The projected net profits for the company from 2025 to 2027 are estimated at 3.93 billion, 13.56 billion, and 19.06 billion CNY, respectively, with corresponding PE ratios of 85X, 25X, and 18X [3]. - The report highlights the potential for significant profit growth, especially after the divestiture of Lexmark, which is expected to enhance the company's focus on its core printing business [48].

Core Viewpoint - The SEMI-e Shenzhen International Semiconductor Exhibition and 2025 Integrated Circuit Industry Innovation Exhibition will take place from September 10-12, 2025, in Shenzhen, serving as a significant indicator of industry transformation in 2025 [1] Group 1: Event Overview - The exhibition is organized by CIOE China Optical Expo and the Integrated Circuit Innovation Alliance, aiming to enhance the scale and influence of the event [1] - The combined exhibition area will reach 300,000 square meters, featuring 5,000 exhibitors and attracting over 160,000 professional visitors [1] - The event will integrate the "Optoelectronics + Semiconductor" industries, creating more cross-industry collaboration opportunities [1] Group 2: Themes and Coverage - The exhibition will focus on three main themes: "IC Design and Application," "IC Manufacturing and Supply Chain," and "Compound Semiconductors," covering the entire industry chain from design to manufacturing [2] - It will showcase the latest technologies from industry leaders, including major companies like Ziguang Zhanrui, ZTE, and SMIC [3][4] Group 3: Industry Trends and Innovations - The exhibition will highlight key industry trends, such as the integration of "Optoelectronics + Semiconductors," and will present core products and technologies across the semiconductor value chain [5] - It will also address advancements in packaging technologies, domestic equipment capabilities, and the commercialization of third-generation semiconductor materials [7] Group 4: Professional Audience and Resources - The event will gather professionals from wafer foundries, packaging and testing, and semiconductor core equipment sectors, facilitating resource sharing across various industries [6] - A series of high-level forums will be held, featuring international analysts and industry experts discussing the most pressing topics of the year [11]