半导体创新是改善我们生活的技术的核心所在。在半导体领域，各公司正采取灵活的策略，以获取 更高的投资资本回报率（ROIC）。此外，在芯片结构中，与供应链的合作变得比以往任何时候都更 加必要。我们还注意到，硬件也在发生变化，以适应 GenAI 应用场景以及用户界面的改变。 2025-2027 年，谁在推动什么？ 业务咨询 Rick Cui / 客户服务总监 电话: +86 13801127537 邮箱:rick@counterpointresearch.com 没有完美的解决方案 ：动态随机存取存储器（DRAM） 解决方案有其自身的优缺点。这些技术改善 了带宽、延迟、速度、容量和功耗/热量等特性，但也带来了成本和时效性方面的挑战。为了降低与 创新相关的风险，客户需要作出承诺，而制造商则需要减轻成本负担。 智能手机与 Apple ：短期内，最具创新性的解决方案是处理内存（PIM），但其数量有限，主要支 持神经处理单元（NPU）。移动高带宽内存（HBM）有望提升性能，但应用场景尚不明确。预计到 2026 年，Apple 将从封装堆叠（PoP）转向分立封装，在 iPhone Pro Max 和折叠手机中提高带宽。 此外 ...

Core Insights - Semiconductor innovation is central to improving technology in daily life, with companies adopting flexible strategies to achieve higher returns on investment capital (ROIC) [1] - Collaboration within the supply chain has become increasingly essential in the semiconductor sector [1] - Hardware is evolving to accommodate GenAI applications and changes in user interfaces [1] Group 1: Market Trends and Innovations - From 2025 to 2027, various players are driving advancements in the semiconductor industry [2] - Dynamic Random Access Memory (DRAM) solutions have their own advantages and disadvantages, improving bandwidth, latency, speed, capacity, and power/heat characteristics, but also presenting cost and timeliness challenges [3] - Customers need to commit to reduce risks associated with innovation, while manufacturers must alleviate cost burdens [3] Group 2: Specific Applications and Technologies - In the smartphone sector, Processing In Memory (PIM) is currently the most innovative solution, albeit limited in quantity and primarily supporting Neural Processing Units (NPU) [3] - High Bandwidth Memory (HBM) is expected to enhance performance, although application scenarios remain unclear [3] - By 2026, Apple is anticipated to shift from Package on Package (PoP) to discrete packaging to improve bandwidth in iPhone Pro Max and foldable phones [3] Group 3: Automotive and Other Sectors - In the automotive sector, particularly with Tesla, the use of Application Processors (AP) and Low Power Double Data Rate (LPDDR) memory is increasing alongside the expansion of autonomous driving [4] - HBM4 is expected to be applied in autonomous vehicles post-2027, while Wide I/O usage is projected to expand in augmented reality (XR), drones, and gaming to improve latency performance [4] - NVIDIA's DIGITS technology aims to combine GPUs with HBM to expand memory bandwidth and enhance CPU bandwidth through SOCAMM, expected to be realized by mid-2025 [4]