Core Insights - Taiwan's semiconductor manufacturing company, TSMC, is projected to increase its foundry market share to 38% by Q2 2025, up from 31% year-over-year, driven by a 19% increase in foundry revenue due to AI demand and Chinese subsidies [1] - Advanced packaging technology is becoming increasingly important, with TSMC expected to maintain its leadership in both advanced process nodes and advanced packaging in the foreseeable future [1][2] - The OSAT (Outsourced Semiconductor Assembly and Test) industry is experiencing a revenue growth rate acceleration from 5% to 11%, with companies like ASE and King Yuan benefiting significantly from AI GPU demand [2] Summary by Sections TSMC Market Share and Revenue Growth - TSMC's foundry market share is expected to rise to 38% by Q2 2025, compared to 31% in the same period last year [1] - The overall foundry revenue is anticipated to grow by 19% year-over-year, primarily due to the demand for advanced processes and packaging driven by AI and subsidies from China [1] - Counterpoint Research forecasts moderate single-digit growth in foundry revenue by Q3 2025 [1] Advanced Packaging and Technology Trends - Advanced packaging is becoming a crucial growth driver for chip manufacturers, with TSMC's strong technology and customer relationships positioning it well for future leadership [2] - The shift towards Foundry 2.0 indicates a transition from traditional foundry services to a more integrated technology platform, encompassing various semiconductor manufacturing processes [2] Application Processor (AP) Market Dynamics - TSMC is expected to dominate the application processor market with a projected 90% share in the 5nm or smaller process technology segment [3] - The demand for advanced semiconductor processes is increasing due to the growing need for performance and energy efficiency in high-end smartphones [4] - TSMC's market share in the sub-3nm AP manufacturing segment is projected to be around 87% this year, increasing to 89% by 2028 [4] Competitive Landscape - Samsung is working to improve its yield rates in the 3nm and below processes to catch up with TSMC, having recently stabilized its 3nm process [5] - Despite Samsung's efforts, TSMC continues to lead in advanced process technology, with significant market share in AP manufacturing for major clients like Apple and Qualcomm [4][5]

Core Viewpoint - Samsung Electronics' semiconductor foundry division is accelerating its efforts to secure orders for the 2nm process technology, collaborating with companies like Nvidia and Qualcomm, as it aims to catch up with TSMC, which has already secured significant orders from major clients like Apple and Nvidia [1][2]. Group 1: 2nm Process Development - Samsung is currently in the final stages of evaluating the performance of its 2nm process for Nvidia's GPUs and Qualcomm's application processors [1]. - The yield rate for Samsung's 2nm process is reportedly over 40%, while the yield for its 3nm process has exceeded 60%, providing a foundation for further improvements in the 2nm process [2][3]. - The GAA (Gate-All-Around) technology, which Samsung first introduced in its 3nm process, is designed to minimize leakage current and enhance semiconductor performance compared to traditional FinFET technology [1]. Group 2: Competitive Landscape - TSMC has successfully begun mass production of 2nm technology in Arizona, having already secured orders from Apple and AMD for their next-generation AI accelerators [3]. - The demand for 2nm technology is expected to be significantly higher than that for 3nm, as indicated by TSMC's recent earnings call, where it reported that revenue from advanced processes below 3nm has surpassed 22% [2][3]. - Industry analysts suggest that geopolitical risks are prompting global tech giants to diversify their manufacturing partners beyond TSMC, which may benefit Samsung in securing more orders [2].

半导体创新是改善我们生活的技术的核心所在。在半导体领域，各公司正采取灵活的策略，以获取 更高的投资资本回报率（ROIC）。此外，在芯片结构中，与供应链的合作变得比以往任何时候都更 加必要。我们还注意到，硬件也在发生变化，以适应 GenAI 应用场景以及用户界面的改变。 2025-2027 年，谁在推动什么？ 业务咨询 Rick Cui / 客户服务总监 电话: +86 13801127537 邮箱:rick@counterpointresearch.com 没有完美的解决方案 ：动态随机存取存储器（DRAM） 解决方案有其自身的优缺点。这些技术改善 了带宽、延迟、速度、容量和功耗/热量等特性，但也带来了成本和时效性方面的挑战。为了降低与 创新相关的风险，客户需要作出承诺，而制造商则需要减轻成本负担。 智能手机与 Apple ：短期内，最具创新性的解决方案是处理内存（PIM），但其数量有限，主要支 持神经处理单元（NPU）。移动高带宽内存（HBM）有望提升性能，但应用场景尚不明确。预计到 2026 年，Apple 将从封装堆叠（PoP）转向分立封装，在 iPhone Pro Max 和折叠手机中提高带宽。 此外 ...