Core Viewpoint - ROHM Co., Ltd. is integrating its GaN power device technologies with TSMC's process technology to create an end-to-end production system, aiming to enhance supply capabilities for growing demand in AI servers and electric vehicles [1][6]. Group 1: Technology Integration - ROHM will license TSMC's GaN technology to strengthen its production capabilities [1]. - The integration represents an evolution of the existing partnership, with a new license agreement facilitating technology transfer to ROHM Hamamatsu [6]. - The production system is expected to be established by 2027 to cater to the increasing demand in applications like AI servers [6]. Group 2: Market Demand and Applications - GaN power devices are recognized for their high-voltage and high-frequency performance, improving efficiency and reducing size across various applications [2]. - The demand for GaN devices is expanding in high-voltage applications, particularly in AI server power units and electric vehicle onboard chargers [2]. - ROHM has been proactive in developing GaN power devices, having established a mass-production system for 150V GaN in March 2022 and adopted a 650V GaN process since 2023 [3]. Group 3: Strategic Partnerships - ROHM's collaboration with TSMC has deepened, particularly in the automotive sector, with a partnership established in December 2024 [3]. - Upon completion of the technology transfer, the automotive GaN partnership between ROHM and TSMC will conclude, while both companies will continue to collaborate on enhancing power supply systems [7]. Group 4: Product Branding and Adoption - ROHM's EcoGaN brand focuses on energy conservation and miniaturization by maximizing GaN characteristics [9]. - The EcoGaN series has been adopted in various consumer and industrial products, including Innergie's 45W AC adapter in 2023 and power supplies for AI servers from Murata Power Solutions in 2024 [10].

Core Insights - ROHM Semiconductor has released a white paper detailing advanced power solutions for AI data centers based on the 800 VDC architecture, emphasizing its role in driving system innovation within the semiconductor industry [1][3] Group 1: 800 VDC Architecture - The 800 VDC architecture is a highly efficient and scalable power delivery system that is set to transform data center design, enabling gigawatt-scale AI factories [3] - Transitioning to an 800 VDC architecture significantly enhances data center efficiency, power density, and sustainability [5] - The shift to 800 VDC infrastructure is a collective industry effort, with ROHM collaborating with NVIDIA and other stakeholders to deliver essential wide bandgap semiconductor technologies [9] Group 2: Power Solutions and Technologies - ROHM offers a broad portfolio of power devices, including silicon, silicon carbide (SiC), and gallium nitride (GaN), and is among the few companies with the expertise to develop analog ICs that maximize device performance [3] - The white paper includes comprehensive power solutions supported by thermal design simulations, board-level design strategies, and real-world implementation examples [4] - Wide bandgap devices, particularly SiC and GaN, are critical for achieving efficient performance in the 800 VDC system [6] Group 3: Device Innovations - ROHM's EcoSiC™ series features industry-leading low on-resistance and top-side cooling modules ideal for AI servers, while the EcoGaN™ series combines GaN performance with proprietary analog IC technologies [8] - The EcoGaN™ series allows for stable gate drive, ultra-fast control, and high-frequency operation, which have garnered strong market recognition [8] - ROHM has established an integrated production system for SiC devices, solidifying its position as a leading supplier in the field [10]

Core Insights - ROHM Semiconductor has released a white paper on advanced power solutions for AI data centers utilizing an 800 VDC architecture, highlighting its role in semiconductor innovation [1][2] Group 1: 800 VDC Architecture - The 800 VDC architecture is a highly efficient and scalable power delivery system that can transform data center design, enabling gigawatt-scale AI factories [2] - Transitioning to 800 VDC significantly enhances data center efficiency, power density, and sustainability [4] - The relocation of AC-DC conversion from server racks to dedicated power racks optimizes power distribution [4] Group 2: Power Device Technologies - ROHM offers a broad portfolio of power devices, including silicon, silicon carbide (SiC), and gallium nitride (GaN), with expertise in developing analog ICs to maximize device performance [2][8] - Wide bandgap devices like SiC and GaN are essential for achieving efficient performance in the new architecture [5] - ROHM's EcoSiC™ series features low on-resistance and top-side cooling modules ideal for AI servers, while the EcoGaN™ series combines GaN performance with proprietary analog IC technologies [7][11] Group 3: Industry Collaboration - The shift to 800 VDC infrastructure is a collective industry effort, with ROHM collaborating with NVIDIA, data center operators, and power system designers [8] - Strategic partnerships, such as the one with Delta Electronics in 2022, are driving innovation in SiC and GaN power devices [8]

Core Insights - ROHM Semiconductor will participate in electronica India 2025, showcasing its latest SiC and GaN technologies to address power and thermal challenges in industrial and automotive applications [1][2] - The event will feature ROHM's Power Eco Family, which includes a range of power devices and live demonstrations [4][10] - ROHM emphasizes its commitment to local innovation in India, with a focus on design and engineering collaboration [8][9] Group 1: Event Participation - ROHM will exhibit at electronica India 2025 from September 17th to 19th at the Bangalore International Exhibition Centre [1] - The company aims to highlight real-world applications of its advanced power semiconductors during the event [2][12] Group 2: Product Highlights - ROHM will showcase a complete lineup of GaN reference designs ranging from 45W to 5.5kW, including compact AC adapters and server power supplies [9] - The exhibit will also feature 2kV SiC MOSFETs integrated into SEMITRANS20 modules for utility-scale PV and battery systems [9] - New molded SiC modules for EV traction inverters will be presented, offering compact and cost-optimized solutions [9] Group 3: Local Innovation and Collaboration - ROHM is committed to local innovation in India, engaging in design and collaborative engineering through skilled teams and strategic partners [8] - The company has unveiled locally co-developed reference designs under its 'Made in India' initiative to support faster prototyping [9]

Core Insights - The article highlights ROHM's role as a key silicon provider for NVIDIA's new 800 V High Voltage Direct Current (HVDC) architecture, which is a significant advancement in data center design aimed at enhancing efficiency, scalability, and sustainability in AI factories [1][4]. Group 1: ROHM's Technology and Offerings - ROHM's power device portfolio includes both silicon and wide bandgap technologies, such as silicon carbide (SiC) and gallium nitride (GaN), providing strategic solutions for data center designers [2]. - The RY7P250BM, a 100V power MOSFET, is specifically designed for hot-swap circuits in 48V power systems, featuring ultra-low ON resistance of 1.86 mΩ, which is crucial for high-density cloud platforms [3]. - ROHM's SiC MOSFETs excel in high-voltage, high-power environments, offering higher efficiency and reliability, aligning with the requirements of NVIDIA's 800 V HVDC architecture [5]. Group 2: Industry Collaboration and Future Directions - The transition to an 800V HVDC infrastructure is a collaborative effort, with ROHM committed to working with industry leaders like NVIDIA and data center operators to provide essential silicon technologies for next-generation AI factories [8]. - ROHM is advancing its EcoGaN™ brand, which includes GaN technologies that perform exceptionally well in the 100V to 650V range, supporting the demand for smaller, efficient power systems in AI data centers [6]. - The company offers high-power SiC modules optimized for high-efficiency power conversion, particularly suited for the centralized power systems envisioned in NVIDIA's architecture [7].