Core Viewpoint - The demand for semiconductor packaging is increasing due to the rise of artificial intelligence, leading companies to shift towards Fan-Out Panel Level Packaging (FOPLP) for better efficiency and cost reduction [1][2]. Group 1: Industry Developments - Taiwan's panel manufacturer Innolux plans to start mass production of FOPLP in the first half of 2025, aiming to surpass competitors like TSMC and ASE [1][2]. - ASE has invested $200 million to develop large-size FOPLP technology, expanding substrate size from 300mm x 300mm to 600mm x 600mm, with equipment expected to arrive in Q2 and trial production in Q3 [2]. - TSMC is focusing on micro FOPLP production lines, with expectations to achieve results within three years, favoring a 300mm x 300mm size over the rumored 515mm x 510mm [2]. Group 2: Technical Advantages - Current CoWoS packaging technology uses circular substrates, which limit chip placement as size increases. In contrast, FOPLP utilizes rectangular substrates, allowing for more chips per panel, thus improving utilization and reducing costs [2].