Core Viewpoint - Intel is lagging in chip business but has competitive options in advanced packaging technology, which is becoming essential in the supply chain as demand for powerful computing solutions grows rapidly [2][7]. Group 1: Advanced Packaging Technology - Advanced packaging solutions have become indispensable in the supply chain, with companies like AMD and NVIDIA integrating multiple chips into single packages to enhance chip density and platform performance [2]. - Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology connects multiple chipsets within a single package without the need for large intermediary layers, making it a viable alternative to TSMC's CoWoS [4]. - Intel also offers Foveros Direct 3D packaging technology, which utilizes TSV (Through-Silicon Via) for stacking on substrates, recognized as one of the industry's most esteemed solutions [4]. Group 2: Market Demand and Competition - Companies like Qualcomm and Apple are actively seeking talent skilled in Intel's EMIB technology, indicating a strong demand for advanced packaging expertise in the industry [2]. - Intel's advanced packaging solutions are seen as a strategic move for companies like Apple, Qualcomm, and Broadcom, especially as TSMC faces capacity bottlenecks due to high order volumes from competitors like NVIDIA and AMD [7]. - NVIDIA's CEO has praised Intel's Foveros technology, suggesting a promising market outlook for Intel's advanced packaging solutions, despite recruitment listings not guaranteeing adoption [9].