整个封装还可以容纳 PCIe 7.0、光引擎、非相干结构、224G SerDes、用于安全等的专用加速器，甚 至还可以容纳 LPDDR5X 内存以增加 DRAM 容量。 公众号记得加星标⭐️，第一时间看推送不会错过。 英特尔率先打造了由 47 个芯片组成的显式解耦式芯片设计，其面向人工智能和高性能计算应用的 Ponte Vecchio 计算 GPU 便是其中之一。该产品至今仍保持着多芯片设计数量最多的纪录，但英特 尔晶圆代工计划推出一款更为极致的产品：一款多芯片封装，在八个基本芯片上集成至少 16 个计算 单元、24 个 HBM5 内存堆栈，其尺寸可扩展至市面上最大 AI 芯片的 12 倍（光罩尺寸为 12 倍，超 过了台积电的 9.5 倍）。当然，我们不禁要问，如此强大的处理器需要怎样的功耗和散热？ 英特尔的概念性 2.5D/3D 多芯片封装展示了 16 个大型计算单元（AI 引擎或 CPU），这些单元采用 英特尔 14A 甚至更先进的 14A-E 工艺技术（1.4nm 级、增强功能、第二代 RibbonFET 2 环栅晶体 管、改进的 PowerVia Direct 背面供电）制造。 这些芯片位于八个（大 ...

Core Viewpoint - Intel is lagging in chip business but has competitive options in advanced packaging technology, which is becoming essential in the supply chain as demand for powerful computing solutions grows rapidly [2][7]. Group 1: Advanced Packaging Technology - Advanced packaging solutions have become indispensable in the supply chain, with companies like AMD and NVIDIA integrating multiple chips into single packages to enhance chip density and platform performance [2]. - Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology connects multiple chipsets within a single package without the need for large intermediary layers, making it a viable alternative to TSMC's CoWoS [4]. - Intel also offers Foveros Direct 3D packaging technology, which utilizes TSV (Through-Silicon Via) for stacking on substrates, recognized as one of the industry's most esteemed solutions [4]. Group 2: Market Demand and Competition - Companies like Qualcomm and Apple are actively seeking talent skilled in Intel's EMIB technology, indicating a strong demand for advanced packaging expertise in the industry [2]. - Intel's advanced packaging solutions are seen as a strategic move for companies like Apple, Qualcomm, and Broadcom, especially as TSMC faces capacity bottlenecks due to high order volumes from competitors like NVIDIA and AMD [7]. - NVIDIA's CEO has praised Intel's Foveros technology, suggesting a promising market outlook for Intel's advanced packaging solutions, despite recruitment listings not guaranteeing adoption [9].