Core Viewpoint - Samsung is facing challenges in its semiconductor business due to setbacks in HBM and lagging wafer foundry capabilities, leading to performance issues and loss of market leadership in DRAM to SK Hynix and TSMC [1][2] Group 1: Semiconductor Production Adjustments - Samsung has officially postponed the mass production of 1.4nm semiconductors to 2029, two years later than previously planned, in an effort to enhance the profitability of its 2nm and higher processes [4] - The decision to delay 1.4nm production is seen as a response to a decline in operational rates that resulted in a loss of 4 trillion KRW for Samsung's foundry division last year [4] - Samsung plans to focus on stabilizing its 2nm process and improving the operational rates of its 4, 5, and 8nm processes to ensure profitability [5] Group 2: HBM Supply and Partnerships - Samsung is negotiating with Nvidia for the supply of HBM3E 12-layer chips, emphasizing that its quality is competitive with rivals [7] - The company has also secured supply agreements with AMD for its AI accelerator MI350X series, which has boosted confidence in Samsung's HBM3E 12-layer memory quality [7] - Nvidia is expected to begin shipping its Blackwell Ultra AI accelerator by the end of this year, with initial supply contracts already established with SK Hynix and Micron [8] Group 3: Market Dynamics and Competitive Position - The demand for Blackwell Ultra is anticipated to grow not only next year but also in the following year, as the initial production of the next-generation Vera Rubin is likely to be limited [10] - Samsung's entry as a third major supplier of HBM3E 12-layer memory could provide Nvidia with leverage in price negotiations with existing suppliers [10] - The average selling price (ASP) of HBM3E provided by SK Hynix is reportedly about 60% higher than that of the 8-layer version, indicating a competitive pricing environment [10]