Tokyo Electron在台湾的办公地点（8月6日，台湾新竹） 在被扣留的3人中，两人是台积电的员工，1人是以前曾在台积电任职的Tokyo Electron的技术人员。台 积电的员工涉嫌将机密信息拍成照片等泄露给Tokyo Electron的技术人员…… 日本大型半导体设备企业Tokyo Electron于8月7日发布消息称，关于台湾当局以涉嫌非法获 取台积电（TSMC）机密信息为由展开调查的案件，已证实与Tokyo Electron台湾子公司的1 名前员工有关。台湾于2022年新设"经济间谍罪"，正在致力于遏制技术外流。在台湾开展业 务的日本企业被要求进行严格的信息管理。 Tokyo Electron表示，涉案的前员工已被惩戒解雇，公司正在全面配合台湾司法部门的调 查。在Tokyo Electron的调查中，"目前并未发现相关机密信息泄露至外部"。 8月5日，台湾高等检察署发布消息称，已以涉嫌非法获取台积电的机密信息为由，扣留了台 积电的3名前员工。这些人涉嫌试图非法获取与2纳米尖端半导体相关的机密信息。 据当地媒体报道，在被扣留的3人中，两人是台积电的员工，1人是以前曾在台积电任职的 Tokyo El ...

Rap idus社长小池淳义在记者会上致辞（7月18日上午，北海道千岁市） 日本新兴半导体企业Rapidus在工厂投产后仅3个月便公开了试制品，生产启动速度是常规情况 下的两倍，为此提供支撑的是曾在日本半导体位居世界第一时代积累丰富经验的资深工程师和供应 商…… 力争实现最尖端半导体国产化的日本Rapidus加快了迈向量产的步伐。工厂投产后仅3个月便公开了试制 品。生产启动速度是常规情况下的两倍，为此提供支撑的是曾在日本半导体位居世界第一时代积累丰富 经验的资深工程师和供应商。为了实现半导体产业的复兴，供应链的力量正在凝聚在一起。 "这是值得纪念的一天"，7月10日在确认了试制的2纳米（1纳米为十亿分之一米）电路线宽半导体的运 行效果后，Rapidus社长小池淳义难掩喜悦之情。 4月中旬，Rapidus建在北海道千岁市的工厂"IIM-1"将晶圆（基板）投放到设备中，使用全球最先进的 技术，3个月完成了试制品，大幅缩短了通常需要半年时间的试制工序。 Rapidus加紧取得成果的原因是担心开发进度越滞后，与海外竞争对手的差距越大，从而在获取客户和 资金筹措方面陷入不利境地。 据说2纳米半导体的生产工序超过2000 ...

Core Viewpoint - Rapidus has successfully demonstrated a 2-nanometer semiconductor wafer, confirming operational performance that meets customer expectations, with plans to further enhance transistor performance and achieve mass production by 2027 [1][4][8]. Group 1: Company Overview - Rapidus was established in August 2022, funded by eight private companies, including Toyota, with a total investment of 73 billion yen, alongside 1.7 trillion yen in government support [4]. - The company aims to develop logic semiconductor foundry services essential for electronic devices, utilizing design technology from IBM [4]. Group 2: Recent Developments - On July 18, Rapidus held its first official event in Chitose since the factory's launch, showcasing a 30 cm diameter golden wafer and confirming its operational capabilities [3][5]. - The wafer is still in the intermediate stage, containing only essential functions, with plans to improve its performance and complete development within the year [4][6]. Group 3: Market Position and Competition - Rapidus faces intense global competition, with TSMC and Samsung planning to mass-produce 2-nanometer products by 2025, and Intel targeting 1.8-nanometer production [8]. - Current production capacity is approximately 7,000 12-inch wafers per month, with plans to scale up to 25,000 to 30,000 wafers upon mass production, but still significantly lower than TSMC's expected output of over 100,000 wafers [8]. Group 4: Future Challenges - Rapidus must address three critical challenges: customer acquisition, mass production, and financing, to reduce reliance on government support and attract private investment [9]. - The company aims to provide the latest Process Design Kits (PDK) to potential customers within the fiscal year, which will help assess its technological capabilities [4][9].

Core Viewpoint - Samsung is facing challenges in its semiconductor business due to setbacks in HBM and lagging wafer foundry capabilities, leading to performance issues and loss of market leadership in DRAM to SK Hynix and TSMC [1][2] Group 1: Semiconductor Production Adjustments - Samsung has officially postponed the mass production of 1.4nm semiconductors to 2029, two years later than previously planned, in an effort to enhance the profitability of its 2nm and higher processes [4] - The decision to delay 1.4nm production is seen as a response to a decline in operational rates that resulted in a loss of 4 trillion KRW for Samsung's foundry division last year [4] - Samsung plans to focus on stabilizing its 2nm process and improving the operational rates of its 4, 5, and 8nm processes to ensure profitability [5] Group 2: HBM Supply and Partnerships - Samsung is negotiating with Nvidia for the supply of HBM3E 12-layer chips, emphasizing that its quality is competitive with rivals [7] - The company has also secured supply agreements with AMD for its AI accelerator MI350X series, which has boosted confidence in Samsung's HBM3E 12-layer memory quality [7] - Nvidia is expected to begin shipping its Blackwell Ultra AI accelerator by the end of this year, with initial supply contracts already established with SK Hynix and Micron [8] Group 3: Market Dynamics and Competitive Position - The demand for Blackwell Ultra is anticipated to grow not only next year but also in the following year, as the initial production of the next-generation Vera Rubin is likely to be limited [10] - Samsung's entry as a third major supplier of HBM3E 12-layer memory could provide Nvidia with leverage in price negotiations with existing suppliers [10] - The average selling price (ASP) of HBM3E provided by SK Hynix is reportedly about 60% higher than that of the 8-layer version, indicating a competitive pricing environment [10]

Group 1 - Honda plans to invest in Rapidus in the second half of 2025, with expected investment amounting to several billion yen, aiming to secure domestic semiconductor production in Japan [1] - Toyota has also invested in Rapidus, indicating a collaborative effort between major automotive manufacturers to ensure the production of advanced semiconductors in Japan [1] - Honda positions semiconductors as a core technology for next-generation vehicles, seeking stable procurement through its investment in Rapidus [1] Group 2 - Rapidus, established in August 2022, has raised 7.3 billion yen from eight companies, including Toyota, NTT, Sony Group, Denso, and Mitsubishi UFJ Bank [2] - Rapidus is seeking additional funding from existing shareholders like Toyota and plans to raise a total of 100 billion yen, with intentions to enhance its capital [2] - The estimated funding requirement for Rapidus to start mass production by 2027 is 5 trillion yen, with the Japanese Ministry of Economy, Trade and Industry supporting approximately 1.72 trillion yen, leaving a gap of over 3 trillion yen [2]

Core Viewpoint - Rapidus aims to mass-produce cutting-edge 2nm semiconductors, although it will be two years behind TSMC, but it claims to enhance the speed of wafer processing to 2-3 times that of TSMC [1][2]. Group 1: Production Plans and Partnerships - Rapidus is currently negotiating with 40-50 companies as potential clients for its foundry services, including major US tech firms and AI chip startups [1]. - The company has signed cooperation memorandums with two US AI chip design startups, including Tenstorrent, to secure large clients and demonstrate production capabilities [2]. - The company plans to start full operations at its factory in Chitose, Hokkaido, by mid-July, with initial trial production already underway [1]. Group 2: Technology and Competitive Landscape - Rapidus has acquired advanced 2nm manufacturing technology from IBM and aims to achieve mass production by 2027, despite Japan's current capability being limited to 40nm [2]. - The company believes that by shortening the production cycle, it can differentiate itself from competitors like TSMC, which aims for 2025 mass production of 2nm chips [2]. - Rapidus is also optimistic about developing the next generation of semiconductors at 1.4nm, emphasizing the need to focus on next-generation technology within 2.5 to 3 years after 2nm production begins [3].

Core Viewpoint - Taiwan authorities reaffirmed the "N-1" rule for TSMC's investment in the U.S., which mandates that Taiwanese companies can only use one generation older technology when establishing overseas facilities compared to those in Taiwan [2][3]. Group 1: TSMC's U.S. Investment - TSMC's $100 billion investment in the U.S. is subject to the "N-1" rule, meaning advanced processes in Taiwan must be followed by one generation older processes in the U.S. [2][3]. - TSMC's 2nm semiconductor production is set to begin trial production in Taiwan this year, with U.S. production expected around 2028, lagging by at least 48 months [4]. - TSMC is considering joint ventures with major U.S. semiconductor companies like Intel, Nvidia, and AMD, which could enhance its control over yield management [4][6]. Group 2: Impact on Samsung - Experts warn that if TSMC forms joint ventures with U.S. chip design companies, Samsung's foundry business could face severe risks, leading to an inevitable decline in market share [6][9]. - TSMC's market share rose to 67.1% in Q4 2024, while Samsung's dropped from 9.1% to 8.1% [9]. - Samsung's foundry division reported an operating loss exceeding 2 trillion KRW (approximately $14 billion) in Q4 2024, highlighting its struggles in the competitive landscape [11]. Group 3: Market Dynamics - The global top ten foundry companies achieved a total revenue of $38.4 billion in Q4, a 9.9% increase quarter-on-quarter, with TSMC producing about 90% of advanced chips [10]. - The demand for AI chips is increasing, which could further challenge Samsung's foundry business as major industry players collaborate to secure orders [7][10]. - Samsung's new chip manufacturing facility in Texas is nearing completion, but its operational timeline has been pushed to 2025 due to customer acquisition challenges [13].