以下文章来源于AGI接口 ，作者丸都山 AGI接口 . AI卷起的财富风暴。 编辑 | 苗正卿 头图 | 虎嗅拍摄 "我将全力确保代工业务的成功。" 在4月30日举办的英特尔代工大会上，66岁的陈立武在开场时，抛出了这样一句掷地有声的表态。 5周前，当陈立武被任命为英特尔CEO的消息传出时，部分业内人士认为，考虑到他长期从事于投资行业的背景，可能会削减调晶圆代工业 务，以帮助财务报表恢复到健康的状态。 如今看来，陈立武的态度非常明确，晶圆代工业务不仅要继续做，而且还要将其置于更高的优先级上。 不过，一个无法忽略的问题在于，英特尔近4年花掉900亿美元投资晶圆厂，本质上是为了IDM 2.0的落地，现在的英特尔是否还要遵循这个 框架？ 在今天的会议上，陈立武并没有提到IDM 2.0的相关问题，甚至没有过多渲染代工业务对于自家产品的帮助，而是反复提到一句话"获得客 户信任"。 对于一般公司来说，这似乎是一句"正确的废话"，但对于素来崇尚"工程师文化"的英特尔而言，这样的表述从未被如此密集地提到过。 出品 | 虎嗅科技组 作者 | 丸都山 这句话背后，或许暗藏着英特尔当下正在发生的一场"文化变革"。 01 华裔老将， ...

Core Viewpoint - Intel's new CEO, Pat Gelsinger, emphasizes the importance of the foundry business and aims to prioritize it despite previous concerns about financial health and potential cuts to the division [1][2][4] Group 1: Leadership and Cultural Shift - Gelsinger's commitment to the foundry business marks a significant cultural shift within Intel, moving from an engineering-centric approach to one that prioritizes customer trust and responsiveness [3][5][6] - The focus on gaining customer trust is a departure from Intel's traditional engineering culture, indicating a potential transformation in the company's operational philosophy [4][5] Group 2: Foundry Business Strategy - Intel has invested $90 billion over the past four years in wafer fabrication to support its IDM 2.0 strategy, but the future direction under Gelsinger remains uncertain [2] - The company is building an ecosystem around its foundry services, including partnerships with leading EDA firms to enhance customer support in design processes [6][7] Group 3: Technological Advancements - Intel is advancing its manufacturing processes with multiple technology nodes, including Intel 4, Intel 3, and the highly anticipated Intel 18A, which is entering risk production and set for mass production this year [10][14] - The Intel 18A node features groundbreaking technologies such as RibbonFET and PowerVia, which are expected to significantly enhance performance and efficiency, potentially giving Intel a competitive edge over TSMC [17][18] Group 4: Competitive Landscape - Intel's competition with TSMC is intensifying, with both companies developing advanced nodes; however, Intel's unique technologies may provide it with a strategic advantage [14][21] - The introduction of Intel 14A, which utilizes high-NA EUV lithography, positions Intel to potentially surpass TSMC in technology, although TSMC's cost-effective strategies could pose challenges for Intel [20][21]