KGD芯片分选设备
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凯格精机(301338.SZ):已着手研发面向第三代半导体的SiC晶圆老化测试设备和KGD芯片分选设备
Ge Long Hui· 2025-11-13 07:13
Core Viewpoint - The company emphasizes that technological innovation is the core of its sustainable development and is planning to establish a new division focused on semiconductor packaging to seek new growth opportunities [1] Group 1: Company Strategy - The company adheres to the value concept that "excellence in quality is the starting point of value and dignity, and meeting customer needs is the source of innovation and development" [1] - The company is planning to set up an SIP packaging division that will focus on the semiconductor packaging field and introduce innovative products [1] Group 2: Product Development - The new division will provide various specialized equipment, including printing equipment, ball placement equipment, and dispensing equipment [1] - The company has already begun developing SiC wafer aging test equipment and KGD chip sorting equipment aimed at third-generation semiconductors [1] Group 3: Market Expansion - The company plans to increase resource investment in the semiconductor and related fields, focusing on enhancing new product development capabilities and market expansion abilities to capture a broader market space [1]