Core Viewpoint - The company emphasizes that technological innovation is the core of its sustainable development and is planning to establish a new division focused on semiconductor packaging to seek new growth opportunities [1] Group 1: Company Strategy - The company adheres to the value concept that "excellence in quality is the starting point of value and dignity, and meeting customer needs is the source of innovation and development" [1] - The company is planning to set up an SIP packaging division that will focus on the semiconductor packaging field and introduce innovative products [1] Group 2: Product Development - The new division will provide various specialized equipment, including printing equipment, ball placement equipment, and dispensing equipment [1] - The company has already begun developing SiC wafer aging test equipment and KGD chip sorting equipment aimed at third-generation semiconductors [1] Group 3: Market Expansion - The company plans to increase resource investment in the semiconductor and related fields, focusing on enhancing new product development capabilities and market expansion abilities to capture a broader market space [1]

Group 1: AI and Consumer Electronics - The widespread application of AI is driving the demand for hardware facilities, leading to a recovery in consumer electronics demand [1][2] - IDC forecasts global AI smartphone sales to reach 170 million units in 2024, accounting for 15% of total smartphone shipments, with a year-on-year growth rate of 233% [2] - Canalys predicts that AI PC shipments will represent 18% of total PC shipments in 2024, reaching 48 million units, with a compound annual growth rate of 44% from 2024 to 2028 [2] Group 2: LED Industry Insights - The global LED lighting market is projected to reach a value of $56.058 billion in 2024, with significant growth opportunities in smart and plant lighting [3] - Mini LED backlight TV shipments are expected to double in 2024, reaching 9.3 million units by 2025 [3] - The global mini LED direct display market is anticipated to grow at a compound annual growth rate of approximately 40% from 2024 to 2028 [3] Group 3: Semiconductor Business Development - The company plans to establish a SIP packaging division to introduce new products in the semiconductor process, targeting new markets [5] - The company has developed equipment for the third-generation semiconductor field, focusing on applications in new energy vehicles and aerospace [5] Group 4: Market Expansion and Product Development - The company is increasing investment in R&D to enhance product competitiveness, recently launching the MLED specialized ultra-high-speed solid crystal machine S20 [4] - The company’s market share in high-end solder paste printing equipment is expected to continue rising due to the growing demand in emerging industries [6] - The overseas revenue accounted for 14.58% of total revenue in 2024, indicating further potential for market share growth in international markets [6]