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KrF光刻配套Barc材料光刻胶
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飞凯材料(300398.SZ):在半导体光刻胶领域,公司目前产品主要集中在i-line光刻胶及KrF光刻配套Barc材料光刻胶
Ge Long Hui A P P· 2026-02-09 12:54
Core Viewpoint - Feikai Materials (300398.SZ) is actively engaged in the semiconductor photoresist sector, focusing on i-line photoresists and KrF supporting Barc materials, which have achieved stable mass production and validation from downstream customers [1] Group 1: Product Development - The company has successfully developed thick negative photoresists for advanced semiconductor packaging, which have completed validation and are being introduced to clients [1] - The new product is well-suited for 2.5D/3D advanced packaging processes and exhibits high resolution and other excellent performance characteristics [1]
飞凯材料:在半导体光刻胶领域,公司目前产品主要集中在i-line光刻胶及KrF光刻配套Barc材料光刻胶
Ge Long Hui· 2026-02-09 12:53
Core Viewpoint - Feikai Materials (300398.SZ) is focusing on the semiconductor photoresist sector, with stable mass production of its products and successful validation from downstream clients [1] Group 1: Product Development - The company’s products are primarily concentrated in i-line photoresist and KrF photoresist supporting Barc materials [1] - The self-developed thick negative photoresist for advanced semiconductor packaging has completed validation and is being introduced to clients [1] Group 2: Performance and Application - The thick negative photoresist is well-suited for 2.5D/3D advanced packaging processes and exhibits excellent performance characteristics such as high resolution [1]
飞凯材料:半导体光刻胶领域产品主要集中在i-line光刻胶及KrF光刻配套Barc材料光刻胶
Zheng Quan Ri Bao Wang· 2026-01-20 01:49
Core Viewpoint - Feikai Materials (300398) is focusing on the semiconductor photoresist sector, with stable mass production of i-line photoresists and KrF photoresist supporting materials, validated by downstream customers [1] Group 1: Product Development - The company has successfully developed a thick negative photoresist for advanced semiconductor packaging, which has completed validation and is being introduced to clients [1] - This new product is well-suited for 2.5D/3D advanced packaging processes and exhibits excellent performance characteristics such as high resolution [1] Group 2: R&D and Market Strategy - The company plans to leverage its existing material technology platform and experience to closely monitor the evolution of downstream customer processes and demand upgrades [1] - Increased R&D investment will be made to promote product iteration and application expansion, aiming to strengthen and enhance the company's core competitiveness in the semiconductor materials field [1]