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超越EUV光刻,新进展
3 6 Ke· 2025-09-18 02:30
Core Viewpoint - The article discusses advancements in chip manufacturing technology, particularly focusing on a new method called "Beyond-EUV" (B-EUV) that utilizes a wavelength of 6.5nm to 6.7nm, potentially allowing for resolutions below 5nm, which could replace the current EUV technology [1][2][5]. Group 1: Technology Development - The B-EUV method aims to improve lithography resolution by using shorter wavelengths and higher numerical apertures, with the current industry standard being EUV at 13.5nm [2][4]. - The evolution of lithography has progressed from UV sources to DUV and now to EUV, with significant advancements in the wavelengths used [2][4]. - The B-EUV technology is still in the research phase, with researchers acknowledging that it will take several years to develop even experimental tools [1][5]. Group 2: Challenges and Considerations - The B-EUV light source is not yet mature, and various methods to generate 6.7nm radiation have been explored without a standardized approach [5][6]. - The efficiency of the B-EUV process is hindered by the need for high reflectivity mirrors, which are challenging to produce for shorter wavelengths [5][6]. - The interaction of high-energy photons with traditional photoresist materials poses additional challenges for B-EUV technology [5][6]. Group 3: Innovations in Materials - Researchers at Johns Hopkins University have discovered that metals like zinc can effectively absorb B-EUV light and trigger chemical reactions in photoresist materials, enabling finer pattern etching on semiconductor wafers [13][15]. - The development of a chemical liquid deposition (CLD) technique allows for the creation of thin films that can be used in conjunction with B-EUV technology, enhancing flexibility in material selection [14][15]. - The findings suggest that various metals could be optimized for different wavelengths, opening new avenues for semiconductor manufacturing [14][15]. Group 4: Industry Implications - The advancements in B-EUV technology and materials could significantly impact the semiconductor industry, potentially leading to lower costs and improved production efficiency [12][15]. - Companies like Inversion and xLight are exploring innovative light sources and technologies that could complement or enhance EUV lithography, indicating a competitive landscape in the chip manufacturing sector [10][12].