证券日报网讯1月7日，卓胜微（300782）在互动平台回答投资者提问时表示，公司严格遵守各项法律法 规，坚持合法、合规运营。本次扩建的射频芯片制造产线与此前募投项目建设并不相同，并非是前募项 目的简单重复扩产，此次项目扩建是前募项目的必要补充和完善，可更好地满足客户旺盛的定制化和高 端化的模组产品需求。随着公司产线建设顺利、自研自产芯片产品获得广泛的客户认可，既存市场的产 品高端产品定制化差异化发展路径的优势逐渐显现，公司本次拟投资的射频芯片制造扩产项目，可保障 公司稳固现有供应链的基础上，强化应变能力，进一步满足下游市场群体不同的产品与技术需求，持续 提升品牌影响力和市场渗透率。 ...

IT之家 1 月 1 日消息，据路透社今日报道，台积电表示，美国政府已向其颁发年度许可，允许其将美国 芯片制造设备进口至南京的设施。 台积电南京工厂生产 16 纳米及其他成熟节点的芯片，台积电还在上海设有芯片制造工厂。IT之家注意 到，在 2024 年年度报告中，台积电表示其南京工厂贡献了约 2.4% 的营收。 报道还称，韩国的三星电子和 SK 海力士也获得了类似的进口许可。 台积电向路透社发表声明称，该批准"确保晶圆厂运营和产品交付不间断进行"。 台积电在其声明中表示："美国已向台积电南京颁发了年度出口许可，允许美国受控出口物品供应给台 积电南京，而无需每个供应商单独申请许可证。" ...

长江商报记者注意到，2022年至2025年上半年，粤芯半导体合计实现营业收入53.23亿元，归母净利润合计亏损 64.14亿元。其中，公司机器设备折旧费用就高达55.28亿元，研发费用合计为18.38亿元。粤芯半导体预计，公司 最早于2029年整体实现盈利。 按照计划，粤芯半导体拟在创业板上市，募资75亿元推进产能扩张。大规模的固定资产建设意味着后续仍需持续 大额资金投入，这对公司的长期资金安排提出了更高要求。截至2025年6月末，粤芯半导体合并口径资产负债率已 攀升至76.08%。 尽管承载着广东芯片制造"从0到1"的突破使命，粤芯半导体仍需在产能扩张与财务稳健之间寻求平衡。 尚处产能爬坡期面临大额资产折旧 资料显示，粤芯半导体是一家致力于为芯片设计企业提供12英寸晶圆代工服务和特色工艺解决方案的集成电路制 造企业。自2017年成立以来，公司专注于特色工艺晶圆代工业务。 长江商报消息 ●长江商报记者 徐佳 作为广东省自主培养且首家进入量产的12英寸晶圆制造企业，粤芯半导体为广东省实现了12英寸芯片制造"从0到 1"的突破。 广东首家量产12英寸晶圆的代工企业粤芯半导体技术股份有限公司（以下简称"粤芯半导体" ...

周四，台积电(TSM.US)涨逾3%，报286.17美元。消息面上，据报道，台积电2nm的量产工作会在今年 底正式启动，目前两座工厂的2nm产能已经被预订一空，台积电需要额外新建工厂来满足客户需求，这 项工程预计需要286亿美元的投资。据悉，苹果、高通、联发科、AMD等多家企业都是台积电2nm工艺 的客户，台积电难以满足所有客户的需求，目前苹果拿下了超半数的初始产能，剩下的产能则由其它客 户瓜分。按照计划，台积电将在2026年底前把月产量提升至10万片。 摩根士丹利上调台积电目标股价，从1688元台币上调至1888元台币。该行认为其营收和利润率具有增长 潜力，并建议投资者在2026年初之前增持该股。预计台积电将在指引中显示2026年营收增长在20%中段 区间，最终实现同比增长30%；并预计公司在2025年第四季度毛利率将突破60%，2026年全年保持在 60%以上。 ...

# " 趣投教 | # " 当期热文 | | --- | | NO.1 中信保诚基金 | | 市场"慢牛"与投资"求真"——中信保诚基金2026年展望：基本面、科技、新消费与出 海 | | NO.2 景顺 | | 景观宏图 日本国债收益率快速上升与日元贬值 | | NO.3 华夏基金 | | 市场波动加剧，如何把握年底投资机会？听听定投团的基金经理们怎么说 | （点击文章标题跳转原文，下同） # " 热转好文 NO.1 天风证券投教基地 ETF课堂 | ETF进阶课堂vol.91 创新药指数的区别体现在哪里？ NO.2 长城基金 长城"科技+"：科技仍是市场引擎，持续关注AI应用 NO.3 国泰基金 降息预期下的金银抉择 德邦证券投教基地 《财商老友记》第5集：古厝话理财 创金合信基金 普通投资者如何参与美股创新药投资？ 长城基金 投资观察室 | 长城基金曲少杰——美股科技行情有望延续，大模型、芯片制造等核心环节或维持高 景气 # " 热门直播 NO.1： 中欧基金 看见·中欧基金2026年度投资策略会 年末收官，2026债券投资新机遇和新选择！ | # | 媒体号名称 | | --- | --- | | 1 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 日本政府全力支持的新创芯片制造商Rapidus，正试图挑战全球半导体霸主台积电（TSMC）的地 位，目标直接量产全球最先进的2纳米芯片。外媒对此形容，任务难度不亚于当年美国的「阿波罗登 月计划」，堪称一场赌上日本科技命运的「登月级赌注」，如同当年台积电押注28纳米制程战略类 似，日本正面临决定未来数十年技术竞争力的关键时刻。 《彭博》报导，Rapidus成立仅3年，目标是跨越数代技术，直接跃进全球最先进的2纳米逻辑芯片制 成。但这种堪称「不可能的任务」让外界质疑声不断，认为这项技术极为复杂昂贵，即便是全球顶尖 芯片大厂也鲜少能挑战。 然而正因这个赌注，最终让台积电迎来智能型手机大爆发的浪潮，逐步淘汰众多竞争对手，打开台湾 半导体国际地位，也奠定今日所说的「硅盾」。 如今，日本正面临类似的时刻。 AI与数据中心的爆炸式成长，让全球对超先进处理器的需求飙升； 疫情则证明芯片短缺足以瘫痪整个产业。而一通来自IBM传奇研究员的电话，让现任Rapidus董事长 获得制造2纳米芯片的关键技术，日本因此取得光靠砸钱也买不到的珍贵的合作与智财起步优势。 如今日本看到一丝重建本土 ...

台积电标识 资料图 图源：台媒 台"中央社"报道称，台积电晶圆厂建在索诺兰沙漠上，占地465公顷，耗资1650亿美元，"堪称全球最昂 贵工程之一"。美国自2013年以来就缺乏建设大型国内晶圆厂的经验，因此必须依赖大量外部援助。 来源：环球网 【环球网报道】据台湾"中央社"等台媒5日报道，台积电将美国亚利桑那州凤凰城打造成半导体重镇， 同时凸显在美国执行大型建设工程的困难。《纽约时报》记者日前以"在美国兴建晶圆厂为何如此困难 的1.8万个理由"为标题撰写专题报道，提到台积电在凤凰城面临美国繁复法规、人力不足与高成本等挑 战。 报道还提到，台积电在台湾建厂只需当局单一的许可，但在亚利桑那州需面对市、郡、州及联邦多层法 规，动辄数千项审批，甚至被迫自行制定1.8万条规定，耗资3500万美元。 凤凰城虽拥有广阔的土地，且少有自然气候灾害，但最大的挑战是水资源短缺，台积电为此承诺建造废 水处理厂，目标是回收几乎所有用水。 此外，芯片制造需高精度设备与熟练人员，台积电两年前曾引进500多名台湾技工，引发美国工会反 对，并引起美籍员工指控台湾主管排他、沟通使用中文、并忽视安全警示。台积电表示将致力营造安 全、包容的工作环境 ...

Market Overview - The A-share market saw a decline across major indices last week, with the Shanghai Composite Index down by -3.90% and the ChiNext Index down by -6.15% [6][14] - The banking, food and beverage, and media sectors performed relatively better, with returns of -0.87%, -1.36%, and -1.39% respectively, while the comprehensive, electric equipment and new energy, and basic chemicals sectors lagged behind with returns of -9.47%, -9.41%, and -8.24% [19][21] Fund Issuance and Performance - A total of 41 new funds were established last week, with a combined issuance scale of 356.35 billion yuan, marking an increase from the previous week [4] - 54 funds were reported for issuance, including 1 REITs and 3 FOFs, indicating a decrease in the number of new fund applications compared to the previous week [5][6] - The median returns for active equity, flexible allocation, and balanced mixed funds were -4.95%, -4.04%, and -3.13% respectively last week [35] Fund Manager Changes - There were changes in fund managers for 113 fund products across 41 fund companies last week, with notable changes at E Fund (12 funds), Changsheng Fund (11 funds), and Ping An Fund (8 funds) [45] Bond Market - The central bank's net reverse repurchase was 554 billion yuan, with a total of 16,760 billion yuan in net open market operations last week [22] - The yield on government bonds of various maturities decreased, with the yield spread widening by 1.22 basis points [24] ETF Developments - The first bond ETF in China surpassed 700 billion yuan in scale, reaching 723.73 billion yuan, a 147% increase from the end of 2024 [11] - The Shanghai and Shenzhen Stock Exchanges issued a revised notice on fund business operations, standardizing ETF naming conventions [10]

Core Viewpoint - ASML has established a technical academy in Phoenix, Arizona, aimed at training engineers to maintain and service its complex chip manufacturing equipment, supporting the rapid expansion of advanced chip production in the U.S. [1] Group 1: Facility and Training Goals - The new facility is located near Phoenix Airport and aims to train over 1,000 engineers annually [1] - The training is focused on supporting the U.S. advanced chip manufacturing capacity [1] Group 2: Equipment Complexity and Cost - ASML's DUV and EUV equipment complexity is comparable to that of F-35 fighter jets [1] - The most advanced EUV equipment costs approximately $400 million and requires multiple 747 cargo planes for transportation [1] Group 3: Recruitment Focus - ASML is particularly interested in hiring veterans with military aircraft maintenance backgrounds, considering them highly suitable for the roles [1]

Core Insights - The article highlights the rapid growth of the "Technology Board" in China's bond market, driven by policy support and market demand for technology innovation bonds (科创债) [2][3][4] - A total of 1,186 technology innovation bonds were issued from May 7 to November 6, with a cumulative issuance scale of 1.38 trillion yuan, representing 81% of the annual issuance scale [3][4] - The issuance of technology innovation bonds is seen as a key mechanism to enhance financing for technology enterprises, thereby promoting industrial upgrading and economic high-quality development [9][10] Policy Support - The "Technology Board" was established to facilitate the issuance of technology innovation bonds by financial institutions, technology enterprises, and private equity investment institutions [3][5] - Regulatory bodies have expanded the range of issuers, broadened the use of funds, and simplified the issuance process to stimulate market activity [4][5] - The issuance of technology innovation bonds is aligned with national strategic goals, focusing on sectors like artificial intelligence, semiconductor manufacturing, and renewable energy [5][6] Market Dynamics - The current low-interest-rate environment and the scarcity of quality assets have led to increased investor interest in technology innovation bonds, with 85% of these bonds experiencing oversubscription [4][6] - Commercial banks have emerged as the main issuers, accounting for 17.6% of the total issuance scale, while technology enterprises are also utilizing these bonds for direct financing of R&D projects [6][7] - The successful issuance of technology innovation bonds has allowed companies to lower financing costs and better align their debt structure with long-term funding needs [6][7] Future Trends - The article anticipates a diversification of issuers, innovation in bond terms, and the continued expansion of technology innovation bond ETFs [10][11] - The introduction of convertible bonds linked to the future growth of technology enterprises is expected to enhance the attractiveness of these financial instruments [10][11] - The ongoing development of technology innovation bonds is projected to improve the financing ecosystem for technology companies, addressing common challenges such as long R&D cycles and unstable cash flows [11]